SG78295A1 - Flame-retardant resin composition and semiconductor sealant using the same - Google Patents

Flame-retardant resin composition and semiconductor sealant using the same

Info

Publication number
SG78295A1
SG78295A1 SG1998000996A SG1998000996A SG78295A1 SG 78295 A1 SG78295 A1 SG 78295A1 SG 1998000996 A SG1998000996 A SG 1998000996A SG 1998000996 A SG1998000996 A SG 1998000996A SG 78295 A1 SG78295 A1 SG 78295A1
Authority
SG
Singapore
Prior art keywords
flame
same
resin composition
retardant resin
semiconductor sealant
Prior art date
Application number
SG1998000996A
Other languages
English (en)
Inventor
Mikio Ito
Sumiya Miyake
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG78295A1 publication Critical patent/SG78295A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/14—Macromolecular materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/06—Organic materials
    • C09K21/12—Organic materials containing phosphorus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
SG1998000996A 1997-05-30 1998-05-02 Flame-retardant resin composition and semiconductor sealant using the same SG78295A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14182497A JPH10330596A (ja) 1997-05-30 1997-05-30 難燃性樹脂組成物およびこれを用いた半導体封止材料

Publications (1)

Publication Number Publication Date
SG78295A1 true SG78295A1 (en) 2001-02-20

Family

ID=15300988

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998000996A SG78295A1 (en) 1997-05-30 1998-05-02 Flame-retardant resin composition and semiconductor sealant using the same

Country Status (7)

Country Link
US (2) US6180695B1 (ko)
JP (1) JPH10330596A (ko)
KR (1) KR100458352B1 (ko)
CN (1) CN1166738C (ko)
DE (1) DE19824193A1 (ko)
MY (1) MY118097A (ko)
SG (1) SG78295A1 (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3611435B2 (ja) * 1997-10-22 2005-01-19 住友ベークライト株式会社 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
US6486242B1 (en) * 1999-04-20 2002-11-26 Sumitomo Bakelite Company Limited Flame-retardant resin composition and prepreg and laminate using the same
EP1059329A1 (en) 1999-06-09 2000-12-13 Matsushita Electric Works, Ltd. Flame retardant resin composition
JP4633214B2 (ja) 1999-12-08 2011-02-16 富士通株式会社 エポキシ樹脂組成物
DE60023752T2 (de) * 1999-12-13 2006-04-20 Dow Global Technologies, Inc., Midland Feuerhemmende phosporenthaltende epoxidharzzusammensetzung
TW490474B (en) * 2000-01-04 2002-06-11 Nat Science Council Phosphorus group containing flame retardant hardener, advanced epoxy resins and cured epoxy resins thereof
US6342303B1 (en) * 2000-02-23 2002-01-29 Georgia-Pacific Resins, Inc. Epoxy-functional polysiloxane modified phenolic resin compositions and composites
JP4588834B2 (ja) * 2000-04-06 2010-12-01 パナソニック電工株式会社 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板
JP4605855B2 (ja) * 2000-04-28 2011-01-05 株式会社Ａｄｅｋａ エポキシ樹脂組成物
JP4783984B2 (ja) * 2001-02-15 2011-09-28 日立化成工業株式会社 樹脂組成物およびその用途ならびにそれらの製造方法
JP4723865B2 (ja) * 2003-04-17 2011-07-13 互応化学工業株式会社 難燃性エポキシ樹脂組成物、同組成物を含有するプリプレグ、積層板およびプリント配線板
US20050075024A1 (en) * 2003-10-01 2005-04-07 Ranken Paul F. Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
WO2005118604A1 (en) * 2004-05-28 2005-12-15 Dow Global Technologies Inc. Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
JP4843944B2 (ja) * 2005-01-13 2011-12-21 三菱瓦斯化学株式会社 樹脂組成物並びにこれを用いたプリプレグ及び積層板
TWI379860B (en) 2008-06-24 2012-12-21 Univ Chung Yuan Christian Modified clay and clay-polymer composite
CN101307170B (zh) * 2008-07-10 2011-08-10 天津市凯华绝缘材料有限公司 一种阻燃含磷环氧粉末组合物
KR101084507B1 (ko) * 2009-04-01 2011-11-18 아이디비켐(주) 유기 인계 난연제 및 이의 제조방법
CN102002210B (zh) * 2009-09-01 2012-07-18 联茂电子股份有限公司 无卤树脂组合物及应用该无卤树脂组合物所制成的胶片与基板
KR20120110170A (ko) 2009-12-30 2012-10-09 다우 글로벌 테크놀로지스 엘엘씨 인 및 시아네이토 기를 함유하는 열경화성 단량체 및 조성물
WO2012064703A1 (en) 2010-11-12 2012-05-18 Albemarle Corporation Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions
JP5799694B2 (ja) * 2011-09-12 2015-10-28 日立化成株式会社 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
KR102042033B1 (ko) * 2012-10-30 2019-11-08 엘지이노텍 주식회사 칩 실장형 인쇄회로기판 및 그 제조방법
CN107400194A (zh) * 2017-08-04 2017-11-28 武汉工程大学 新型无卤反应型阻燃固化剂及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166822A (ja) * 1985-01-19 1986-07-28 Toshiba Chem Corp 封止用樹脂組成物
JPH0631276B2 (ja) * 1992-09-11 1994-04-27 三光化学株式会社 有機環状りん化合物及びその製造法
JPH08165331A (ja) 1994-12-13 1996-06-25 Hitachi Ltd 樹脂封止型半導体装置
EP0742261B1 (en) 1995-04-10 2000-08-02 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin compositions suitable for semiconductor encapsulation, their manufacture and use, semiconductor devices encapsulated therewith
JPH0931166A (ja) 1995-07-19 1997-02-04 Hitachi Ltd 樹脂封止型半導体装置

Also Published As

Publication number Publication date
KR19980086796A (ko) 1998-12-05
US6180695B1 (en) 2001-01-30
DE19824193A1 (de) 1998-12-03
US6296940B1 (en) 2001-10-02
JPH10330596A (ja) 1998-12-15
CN1201053A (zh) 1998-12-09
MY118097A (en) 2004-08-30
KR100458352B1 (ko) 2005-01-15
CN1166738C (zh) 2004-09-15

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