SG74111A1 - Electrolytic desilvering agents and electrolytic desilvering method - Google Patents

Electrolytic desilvering agents and electrolytic desilvering method

Info

Publication number
SG74111A1
SG74111A1 SG1998006213A SG1998006213A SG74111A1 SG 74111 A1 SG74111 A1 SG 74111A1 SG 1998006213 A SG1998006213 A SG 1998006213A SG 1998006213 A SG1998006213 A SG 1998006213A SG 74111 A1 SG74111 A1 SG 74111A1
Authority
SG
Singapore
Prior art keywords
electrolytic desilvering
electrolytic
agents
desilvering
desilvering agents
Prior art date
Application number
SG1998006213A
Other languages
English (en)
Inventor
Akihiro Aiba
Satomi Hisano
Original Assignee
Japan Energy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Energy Corp filed Critical Japan Energy Corp
Publication of SG74111A1 publication Critical patent/SG74111A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00—Electrolytic stripping of metallic layers or coatings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Electroplating Methods And Accessories (AREA)
SG1998006213A 1995-05-31 1996-05-30 Electrolytic desilvering agents and electrolytic desilvering method SG74111A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP15546195 1995-05-31
JP15546295 1995-05-31
JP8142304A JP2939181B2 (ja) 1995-05-31 1996-05-14 銀の電解剥離剤および電解剥離方法

Publications (1)

Publication Number Publication Date
SG74111A1 true SG74111A1 (en) 2000-07-18

Family

ID=27318421

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998006213A SG74111A1 (en) 1995-05-31 1996-05-30 Electrolytic desilvering agents and electrolytic desilvering method

Country Status (6)

Country Link
JP (1) JP2939181B2 (ko)
KR (1) KR100251832B1 (ko)
GB (1) GB2301599B (ko)
HK (1) HK1008687A1 (ko)
MY (1) MY114710A (ko)
SG (1) SG74111A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100322499B1 (ko) * 1999-06-29 2002-02-07 김 무 리드프레임의 제조공정에서 불필요한 은도금을 박리하는 방법
KR100429389B1 (ko) * 2001-07-23 2004-04-29 유니온스페셜티 (주) 은 전해박리제 및 은 전해박리방법
CN109880161A (zh) * 2019-02-26 2019-06-14 张坤 一种复配型抗铜剂及其制备和验证方法
GB2626791A (en) 2023-02-03 2024-08-07 Nec Corp Communication system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1162504A (en) * 1980-11-25 1984-02-21 Mobuyuki Oda Treating tin plated steel sheet with composition containing titanium or zirconium compounds
JPH05311485A (ja) * 1991-12-25 1993-11-22 Nikko Kinzoku Kk 貴金属めっき材の封孔処理方法
JP2603800B2 (ja) * 1994-03-08 1997-04-23 日本エレクトロプレイテイング・エンジニヤース株式会社 銀の電解剥離液及びそれを用いた電解剥離方法

Also Published As

Publication number Publication date
JP2939181B2 (ja) 1999-08-25
KR100251832B1 (ko) 2000-04-15
KR960041426A (ko) 1996-12-19
MY114710A (en) 2002-12-31
GB2301599A (en) 1996-12-11
HK1008687A1 (en) 1999-05-14
GB9611400D0 (en) 1996-08-07
GB2301599B (en) 1999-11-10
JPH0949100A (ja) 1997-02-18

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