SG73569A1 - Photosensitive resin composition and photosensitive using the resin composition - Google Patents

Photosensitive resin composition and photosensitive using the resin composition

Info

Publication number
SG73569A1
SG73569A1 SG1998004206A SG1998004206A SG73569A1 SG 73569 A1 SG73569 A1 SG 73569A1 SG 1998004206 A SG1998004206 A SG 1998004206A SG 1998004206 A SG1998004206 A SG 1998004206A SG 73569 A1 SG73569 A1 SG 73569A1
Authority
SG
Singapore
Prior art keywords
resin composition
weight parts
photosensitive
components
component
Prior art date
Application number
SG1998004206A
Other languages
English (en)
Inventor
Eiji Kosaka
Shigeru Murakami
Original Assignee
Nichigo Morton Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichigo Morton Co Ltd filed Critical Nichigo Morton Co Ltd
Publication of SG73569A1 publication Critical patent/SG73569A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/118—Initiator containing with inhibitor or stabilizer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/122—Sulfur compound containing
    • Y10S430/123—Sulfur in heterocyclic ring

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Photoreceptors In Electrophotography (AREA)
SG1998004206A 1997-12-01 1998-10-14 Photosensitive resin composition and photosensitive using the resin composition SG73569A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9347112A JPH11167203A (ja) 1997-12-01 1997-12-01 感光性樹脂組成物及びそれを用いた感光性エレメント

Publications (1)

Publication Number Publication Date
SG73569A1 true SG73569A1 (en) 2000-06-20

Family

ID=18387999

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998004206A SG73569A1 (en) 1997-12-01 1998-10-14 Photosensitive resin composition and photosensitive using the resin composition

Country Status (12)

Country Link
US (1) US6242158B1 (de)
EP (1) EP0919870B1 (de)
JP (1) JPH11167203A (de)
KR (1) KR100312062B1 (de)
CN (1) CN1111758C (de)
AT (1) ATE220219T1 (de)
AU (1) AU707535B1 (de)
CA (1) CA2252123A1 (de)
DE (1) DE69806330T2 (de)
IL (1) IL127251A0 (de)
SG (1) SG73569A1 (de)
TW (1) TW472175B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4512281B2 (ja) 2001-02-22 2010-07-28 富士フイルム株式会社 ネガ型平版印刷版原版
JP4266077B2 (ja) 2001-03-26 2009-05-20 富士フイルム株式会社 平版印刷版原版及び平版印刷方法
US7247489B2 (en) * 2002-03-11 2007-07-24 Auburn University Ion-detecting microspheres and methods of use thereof
JP2004002616A (ja) * 2002-03-22 2004-01-08 Konica Minolta Holdings Inc 活性エネルギー線硬化性組成物、インクジェット用インク組成物、それを用いたインクジェット記録方法及び平版印刷版
JP4137577B2 (ja) 2002-09-30 2008-08-20 富士フイルム株式会社 感光性組成物
US7338748B2 (en) 2002-09-30 2008-03-04 Fujifilm Corporation Polymerizable composition and planographic printing plate precursor
JP2004126050A (ja) 2002-09-30 2004-04-22 Fuji Photo Film Co Ltd 平版印刷版原版
CN100590525C (zh) 2002-12-18 2010-02-17 富士胶片株式会社 可聚合组合物和平版印刷版前体
JP4150261B2 (ja) 2003-01-14 2008-09-17 富士フイルム株式会社 平版印刷版原版の製版方法
JP2004252201A (ja) 2003-02-20 2004-09-09 Fuji Photo Film Co Ltd 平版印刷版原版
JP4299639B2 (ja) 2003-07-29 2009-07-22 富士フイルム株式会社 重合性組成物及びそれを用いた画像記録材料
JP2005099284A (ja) 2003-09-24 2005-04-14 Fuji Photo Film Co Ltd 感光性組成物及び平版印刷版原版
KR100708310B1 (ko) * 2003-12-15 2007-04-17 주식회사 코오롱 액정 표시 소자의 칼럼 스페이서용 감광성 수지 조성물
KR100708311B1 (ko) * 2003-12-15 2007-04-17 주식회사 코오롱 액정 표시 소자의 칼럼 스페이서용 감광성 수지 조성물
US20050272926A1 (en) * 2004-06-02 2005-12-08 Lee Yoon Y Non-crystalline cellulose and production thereof
JP4651037B2 (ja) * 2004-06-11 2011-03-16 旭化成イーマテリアルズ株式会社 フレキソ印刷版用感光性樹脂
US20060240560A1 (en) * 2005-01-31 2006-10-26 Eric Bakker Microsphere optical ion sensors based on doped silica gel templates
JP4368323B2 (ja) * 2005-03-25 2009-11-18 富士フイルム株式会社 感光性平版印刷版
JP4874707B2 (ja) * 2005-05-03 2012-02-15 ドンジン セミケム カンパニー リミテッド 感光性樹脂組成物
US7678252B2 (en) * 2005-06-14 2010-03-16 Auburn University Long lived anion-selective sensors based on a covalently attached metalloporphyrin as anion receptor
US8242203B2 (en) * 2005-11-10 2012-08-14 Eric Bakker Covalently attached nile blue derivatives for optical sensors
JP5035726B2 (ja) * 2007-10-31 2012-09-26 東邦化学工業株式会社 新規ジ（メタ）アクリレートおよびこれを含有する光硬化性樹脂組成物
JP5129680B2 (ja) * 2008-07-29 2013-01-30 富士フイルム株式会社 感光性組成物、並びに感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
JP5344034B2 (ja) * 2009-03-13 2013-11-20 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
KR20140148379A (ko) * 2012-03-23 2014-12-31 히타치가세이가부시끼가이샤 감광성 수지 조성물, 및 이것을 사용한 가공 유리 기판의 제조 방법, 및 터치 패널 및 그 제조 방법
TWI691794B (zh) * 2016-09-29 2020-04-21 奇美實業股份有限公司 負型白色感光性樹脂組成物及其應用
JP7190439B2 (ja) * 2017-11-06 2022-12-15 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4414312A (en) 1980-09-03 1983-11-08 E. I. Du Pont De Nemours & Co. Photopolymerizable polyamide ester resin compositions containing an oxygen scavenger
JPS61166541A (ja) * 1985-01-19 1986-07-28 Fuotopori Ouka Kk 光重合性組成物
US4636453A (en) 1985-10-01 1987-01-13 E. I. Du Pont De Nemours And Company Photopolymer films containing microencapsulated sensitometric adjuvants
JPH0820733B2 (ja) * 1988-08-11 1996-03-04 富士写真フイルム株式会社 ドライフイルムレジスト用光重合性組成物
JP2744643B2 (ja) * 1989-06-02 1998-04-28 旭化成工業株式会社 光重合性組成物
US5096799A (en) * 1989-09-21 1992-03-17 Fuji Photo Film Co., Ltd. Photopolymerizable composition
DE69506970T2 (de) 1994-09-06 1999-06-10 Fuji Photo Film Co., Ltd., Minami-Ashigara, Kanagawa Lichtempfindliche Bis(halogenmethyloxadiazol)-Verbindung und lichtempfindliches Übertragungsblatt, das diese Verbindung verwendet
TW424172B (en) 1995-04-19 2001-03-01 Hitachi Chemical Co Ltd Photosensitive resin composition and photosensitive element using the same
JP3644731B2 (ja) * 1995-10-04 2005-05-11 旭化成エレクトロニクス株式会社 新規な光硬化性樹脂組成物
JPH09176253A (ja) * 1995-12-26 1997-07-08 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
US5939238A (en) * 1998-06-02 1999-08-17 Morton International, Inc. Photoimageable composition having improved photoinitiator system
US5952154A (en) * 1998-05-29 1999-09-14 Morton International, Inc. Photoimageable composition having improved flexibility

Also Published As

Publication number Publication date
US6242158B1 (en) 2001-06-05
DE69806330D1 (de) 2002-08-08
AU707535B1 (en) 1999-07-15
KR19990062610A (ko) 1999-07-26
ATE220219T1 (de) 2002-07-15
CA2252123A1 (en) 1999-06-01
TW472175B (en) 2002-01-11
EP0919870A1 (de) 1999-06-02
CN1221129A (zh) 1999-06-30
CN1111758C (zh) 2003-06-18
DE69806330T2 (de) 2003-04-03
IL127251A0 (en) 1999-09-22
JPH11167203A (ja) 1999-06-22
KR100312062B1 (ko) 2001-12-12
EP0919870B1 (de) 2002-07-03

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