SG73432A1 - Polishing apparatus with improved product unloading - Google Patents

Polishing apparatus with improved product unloading

Info

Publication number
SG73432A1
SG73432A1 SG9610588A SG1996010588A SG73432A1 SG 73432 A1 SG73432 A1 SG 73432A1 SG 9610588 A SG9610588 A SG 9610588A SG 1996010588 A SG1996010588 A SG 1996010588A SG 73432 A1 SG73432 A1 SG 73432A1
Authority
SG
Singapore
Prior art keywords
polishing apparatus
improved product
product unloading
unloading
improved
Prior art date
Application number
SG9610588A
Other languages
English (en)
Inventor
Kasprzyk Karl
Nagahashi Isao
Original Assignee
Speedfam Ipec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Ipec Corp filed Critical Speedfam Ipec Corp
Publication of SG73432A1 publication Critical patent/SG73432A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG9610588A 1995-11-30 1996-09-09 Polishing apparatus with improved product unloading SG73432A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/564,968 US5762543A (en) 1995-11-30 1995-11-30 Polishing apparatus with improved product unloading

Publications (1)

Publication Number Publication Date
SG73432A1 true SG73432A1 (en) 2001-09-18

Family

ID=24256658

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9610588A SG73432A1 (en) 1995-11-30 1996-09-09 Polishing apparatus with improved product unloading

Country Status (7)

Country Link
US (1) US5762543A (de)
JP (1) JP2846865B2 (de)
KR (1) KR100207249B1 (de)
DE (1) DE19637445A1 (de)
GB (1) GB2307656B (de)
SG (1) SG73432A1 (de)
TW (1) TW380074B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10180624A (ja) * 1996-12-19 1998-07-07 Shin Etsu Handotai Co Ltd ラッピング装置及び方法
JP3665188B2 (ja) * 1997-09-03 2005-06-29 不二越機械工業株式会社 研磨装置
US5980366A (en) * 1997-12-08 1999-11-09 Speedfam-Ipec Corporation Methods and apparatus for polishing using an improved plate stabilizer
US6168506B1 (en) * 1998-01-21 2001-01-02 Speedfam-Ipec Corporation Apparatus for polishing using improved plate supports
US5997390A (en) * 1998-02-02 1999-12-07 Speedfam Corporation Polishing apparatus with improved alignment of polishing plates
US6716086B1 (en) * 1999-06-14 2004-04-06 Applied Materials Inc. Edge contact loadcup
JP2002154049A (ja) * 2000-11-15 2002-05-28 Fujikoshi Mach Corp 研磨方法
US6398631B1 (en) * 2001-02-02 2002-06-04 Memc Electronic Materials, Inc. Method and apparatus to place wafers into and out of machine
US7101253B2 (en) * 2002-08-27 2006-09-05 Applied Materials Inc. Load cup for chemical mechanical polishing
US7044832B2 (en) * 2003-11-17 2006-05-16 Applied Materials Load cup for chemical mechanical polishing
US8476547B1 (en) 2010-11-12 2013-07-02 Daniel J. Reed Wire electric discharge machine
JP5671735B2 (ja) * 2011-01-18 2015-02-18 不二越機械工業株式会社 両面研磨装置
CN106695554B (zh) * 2017-01-20 2019-08-09 中国科学院半导体研究所 磨抛夹具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4502252A (en) * 1982-03-29 1985-03-05 Tokyo Shibaura Denki Kabushiki Kaisha Lapping machine
EP0464864A2 (de) * 1988-06-20 1992-01-08 Westech Systems, Inc. Vorrichtung zum Transportieren eines Wafers

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA507939A (en) * 1954-12-07 A. Grobey Paul Multiple work piece chuck
JPS5946664U (ja) * 1982-09-21 1984-03-28 ホ−ヤ株式会社 両面加工装置
US4635401A (en) * 1983-09-01 1987-01-13 Daisho Seiki Kabushiki Kaisha Duplex-head surface grinder
JPS6362673A (ja) * 1986-09-01 1988-03-18 Speedfam Co Ltd 定寸機構付き平面研磨装置
DE3818159A1 (de) * 1988-05-28 1989-11-30 Wolters Peter Fa Verfahren und vorrichtung zur steuerung des betriebs von hon- oder schleifmaschinen
DE59002816D1 (de) * 1989-07-31 1993-10-28 Diskus Werke Frankfurt Main Ag Zuführ- und Dosiereinrichtung für das Läppgemisch bei Feinbearbeitungsmaschinen zum Läppen, Feinschleifen oder Polieren.
US5274960A (en) * 1990-10-23 1994-01-04 Speedfam Corporation Uniform velocity double sided finishing machine
US5121572A (en) * 1990-11-06 1992-06-16 Timesavers, Inc. Opposed disc deburring system
US5443416A (en) * 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
JPH0724552U (ja) * 1993-10-13 1995-05-09 日本板硝子株式会社 ディスク研磨機

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4502252A (en) * 1982-03-29 1985-03-05 Tokyo Shibaura Denki Kabushiki Kaisha Lapping machine
EP0464864A2 (de) * 1988-06-20 1992-01-08 Westech Systems, Inc. Vorrichtung zum Transportieren eines Wafers

Also Published As

Publication number Publication date
KR100207249B1 (ko) 1999-07-15
US5762543A (en) 1998-06-09
JPH09207066A (ja) 1997-08-12
JP2846865B2 (ja) 1999-01-13
TW380074B (en) 2000-01-21
GB2307656A (en) 1997-06-04
DE19637445A1 (de) 1997-06-05
GB2307656B (en) 1999-05-26
GB9617988D0 (en) 1996-10-09
KR970025842A (ko) 1997-06-24

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