SG71146A1 - Device for the transfer of an object between at least two locations - Google Patents

Device for the transfer of an object between at least two locations

Info

Publication number
SG71146A1
SG71146A1 SG1998003278A SG1998003278A SG71146A1 SG 71146 A1 SG71146 A1 SG 71146A1 SG 1998003278 A SG1998003278 A SG 1998003278A SG 1998003278 A SG1998003278 A SG 1998003278A SG 71146 A1 SG71146 A1 SG 71146A1
Authority
SG
Singapore
Prior art keywords
locations
transfer
Prior art date
Application number
SG1998003278A
Other languages
English (en)
Inventor
Klaus Schultz
Volker Weisbach
Bernd Gey
Andreas Mages
Original Assignee
Jenoptik Jena Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Jena Gmbh filed Critical Jenoptik Jena Gmbh
Publication of SG71146A1 publication Critical patent/SG71146A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/907—Sensor controlled device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
SG1998003278A 1998-02-16 1998-08-24 Device for the transfer of an object between at least two locations SG71146A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19806231A DE19806231C1 (de) 1998-02-16 1998-02-16 Einrichtung zum Greifen eines Objektes

Publications (1)

Publication Number Publication Date
SG71146A1 true SG71146A1 (en) 2000-03-21

Family

ID=7857824

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998003278A SG71146A1 (en) 1998-02-16 1998-08-24 Device for the transfer of an object between at least two locations

Country Status (7)

Country Link
US (1) US6099059A (ja)
JP (1) JPH11227938A (ja)
KR (1) KR100282046B1 (ja)
DE (1) DE19806231C1 (ja)
FR (1) FR2774975A1 (ja)
GB (1) GB2334246B (ja)
SG (1) SG71146A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100322620B1 (ko) * 1999-08-16 2002-03-18 황인길 스탠더드 메커니컬 인터페이스 시스템의 카세트 캐리어 이송장치
US6811369B2 (en) 1999-09-02 2004-11-02 Canon Kabushiki Kaisha Semiconductor fabrication apparatus, pod carry apparatus, pod carry method, and semiconductor device production method
JP2003007598A (ja) * 2001-06-25 2003-01-10 Mitsubishi Electric Corp フォーカスモニタ方法およびフォーカスモニタ用装置ならびに半導体装置の製造方法
US6822413B2 (en) * 2002-03-20 2004-11-23 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
EP1375405A1 (en) * 2002-06-27 2004-01-02 Innopack S.r.l. Unit for handling a product comprising at least one ream of sheets
US7694583B2 (en) * 2005-05-05 2010-04-13 Control Gaging, Inc. Gripper gage assembly
FR2917660B1 (fr) * 2007-06-25 2009-09-25 Commissariat Energie Atomique Pince pour robot manipulateur a precision de serrage amelioree et robot manipulateur comportant au moins une telle pince.
JP5603124B2 (ja) * 2010-04-16 2014-10-08 アイダエンジニアリング株式会社 プレス機械のワーク搬送装置及びクロスバーユニット
JP6171984B2 (ja) * 2014-03-07 2017-08-02 株式会社ダイフク 物品支持装置
JP6064940B2 (ja) * 2014-04-07 2017-01-25 株式会社ダイフク 物品搬送車
CN105921963B (zh) * 2016-05-18 2018-10-30 博众精工科技股份有限公司 有序上料的上料机构
CN107838938B (zh) * 2017-12-08 2024-04-12 威海科莱默自动化设备股份有限公司 一种机器人抓手
US11767181B2 (en) * 2019-03-14 2023-09-26 Mujin, Inc. Robotic system with handling mechanism and method of operation thereof
WO2021181923A1 (ja) * 2020-03-13 2021-09-16 村田機械株式会社 グリッパ装置、搬送車、及び搬送方法
DE102021003002A1 (de) * 2020-07-02 2022-01-05 Sew-Eurodrive Gmbh & Co Kg Verfahren zum Betreiben eines Systems und System, aufweisend einen Stapel von Objekten, einen Roboter, einen Sensor und ein Aufnahmemittel

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1225358B (de) * 1961-07-04 1966-09-22 Euratom Einrichtung zum schnellen Instellungbringen von Gegenstaenden
JPS59353B2 (ja) * 1980-07-24 1984-01-06 ファナック株式会社 把持装置
USH65H (en) * 1983-05-27 1986-05-06 At&T Bell Laboratories Dynamic optical sensing: Robotic system and manufacturing method utilizing same
US4591198A (en) * 1984-02-16 1986-05-27 Monforte Robotics, Inc. Robotic end effectors
JPS6171302A (ja) * 1984-09-14 1986-04-12 Toshiba Corp ロボットハンド用近接センサ装置
US4698775A (en) * 1985-05-17 1987-10-06 Flexible Manufacturing Systems, Inc. Self-contained mobile reprogrammable automation device
US4836733A (en) * 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
US5219264A (en) * 1986-09-19 1993-06-15 Texas Instruments Incorporated Mobile robot on-board vision system
EP0338673B1 (en) * 1988-04-22 1992-09-30 Beckman Instruments, Inc. Robot gripper having auxiliary degrees of freedom
DE4129829A1 (de) * 1991-09-07 1993-03-11 Brodhag Angelika Selbsttaetige entladevorrichtung fuer riegelfoermige nahrungsmittel
JPH05299489A (ja) * 1992-04-23 1993-11-12 Fuji Electric Co Ltd ウェーハ搬送用ロボット
DE4326309C1 (de) * 1993-08-05 1994-09-15 Jenoptik Jena Gmbh Vorrichtung zum Transport von Wafermagazinen
US5425565A (en) * 1993-08-12 1995-06-20 Tension Envelope Corporation Multiple envelope gripping and transfer apparatus and method
JP3331746B2 (ja) * 1994-05-17 2002-10-07 神鋼電機株式会社 搬送システム
DE19542646C2 (de) * 1995-03-28 2003-04-30 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
US5788458A (en) * 1995-07-10 1998-08-04 Asyst Technologies, Inc. Method and apparatus for vertical transfer of a semiconductor wafer cassette
JP3570827B2 (ja) * 1996-09-13 2004-09-29 東京エレクトロン株式会社 処理装置

Also Published As

Publication number Publication date
GB9818136D0 (en) 1998-10-14
JPH11227938A (ja) 1999-08-24
GB2334246B (en) 2000-04-26
US6099059A (en) 2000-08-08
KR19990071382A (ko) 1999-09-27
KR100282046B1 (ko) 2001-04-02
DE19806231C1 (de) 1999-07-22
FR2774975A1 (fr) 1999-08-20
GB2334246A (en) 1999-08-18

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