SG70014A1 - An infrared radiation sensitive device - Google Patents

An infrared radiation sensitive device

Info

Publication number
SG70014A1
SG70014A1 SG1997002113A SG1997002113A SG70014A1 SG 70014 A1 SG70014 A1 SG 70014A1 SG 1997002113 A SG1997002113 A SG 1997002113A SG 1997002113 A SG1997002113 A SG 1997002113A SG 70014 A1 SG70014 A1 SG 70014A1
Authority
SG
Singapore
Prior art keywords
infrared radiation
sensitive device
radiation sensitive
infrared
sensitive
Prior art date
Application number
SG1997002113A
Other languages
English (en)
Inventor
Satoru Ito
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of SG70014A1 publication Critical patent/SG70014A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Light Receiving Elements (AREA)
SG1997002113A 1996-09-06 1997-06-20 An infrared radiation sensitive device SG70014A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25743496A JP3186603B2 (ja) 1996-09-06 1996-09-06 焦電型赤外線センサ素子

Publications (1)

Publication Number Publication Date
SG70014A1 true SG70014A1 (en) 2000-01-25

Family

ID=17306313

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997002113A SG70014A1 (en) 1996-09-06 1997-06-20 An infrared radiation sensitive device

Country Status (5)

Country Link
US (1) US6121615A (de)
JP (1) JP3186603B2 (de)
CN (1) CN1087073C (de)
DE (1) DE19727447B4 (de)
SG (1) SG70014A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3289677B2 (ja) * 1998-05-25 2002-06-10 株式会社村田製作所 赤外線センサ
US6476663B1 (en) * 2001-08-14 2002-11-05 Sun Microsystems, Inc. Method for reducing supply noise near an on-die thermal sensor
JP2009068863A (ja) * 2007-09-10 2009-04-02 Toshiba Corp 赤外線検出素子及びそれを用いた赤外線イメージセンサ
DE102009037111B4 (de) 2009-08-11 2011-07-21 Pyreos Ltd. Kompakter Infrarotlichtdetektor und Verfahren zur Herstellung desselben
US20130099121A1 (en) * 2010-03-10 2013-04-25 Pioneer Corporation Infrared ray detection element and infrared ray detection device having the same
JP5781869B2 (ja) * 2011-09-09 2015-09-24 シチズン電子株式会社 焦電型赤外線センサ
US10490726B2 (en) * 2014-09-11 2019-11-26 Sicpa Holding Sa Pyroelectric generator
US10302500B2 (en) 2015-03-12 2019-05-28 Laser Components Gmbh Differential circuit for pyroelectric infrared detector
CN106124067B (zh) * 2016-07-18 2019-01-18 上海集成电路研发中心有限公司 红外探测像元结构及其制备方法、混合成像器件
JP6904847B2 (ja) 2017-08-10 2021-07-21 太陽誘電株式会社 積層型焦電素子

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3733499A (en) * 1972-04-20 1973-05-15 Westinghouse Electric Corp Pyroelectric detector
US3842276A (en) * 1973-06-15 1974-10-15 Rca Corp Thermal radiation detector
US3932753A (en) * 1973-10-16 1976-01-13 The Harshaw Chemical Company Pyroelectric device with coplanar electrodes
JPS5866828A (ja) * 1981-10-17 1983-04-21 Tdk Corp 焦電体チツプ及びその製造方法
US4514247A (en) * 1983-08-15 1985-04-30 North American Philips Corporation Method for fabricating composite transducers
US4627138A (en) * 1985-08-06 1986-12-09 The Dow Chemical Company Method of making piezoelectric/pyroelectric elements
JPS62123324A (ja) * 1985-11-25 1987-06-04 Nec Corp 焦電形赤外線検出素子
JP2799741B2 (ja) * 1989-07-15 1998-09-21 日本真空技術株式会社 有機焦電体およびその製造方法

Also Published As

Publication number Publication date
CN1087073C (zh) 2002-07-03
JPH1082695A (ja) 1998-03-31
DE19727447A1 (de) 1998-03-12
JP3186603B2 (ja) 2001-07-11
US6121615A (en) 2000-09-19
DE19727447B4 (de) 2008-06-19
CN1178319A (zh) 1998-04-08

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