SG68697A1 - A chemical mechanical polishing system and method therefor - Google Patents
A chemical mechanical polishing system and method thereforInfo
- Publication number
- SG68697A1 SG68697A1 SG1998004358A SG1998004358A SG68697A1 SG 68697 A1 SG68697 A1 SG 68697A1 SG 1998004358 A SG1998004358 A SG 1998004358A SG 1998004358 A SG1998004358 A SG 1998004358A SG 68697 A1 SG68697 A1 SG 68697A1
- Authority
- SG
- Singapore
- Prior art keywords
- mechanical polishing
- chemical mechanical
- method therefor
- polishing system
- therefor
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/963,486 US6107203A (en) | 1997-11-03 | 1997-11-03 | Chemical mechanical polishing system and method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
SG68697A1 true SG68697A1 (en) | 1999-11-16 |
Family
ID=25507311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1998004358A SG68697A1 (en) | 1997-11-03 | 1998-10-30 | A chemical mechanical polishing system and method therefor |
Country Status (6)
Country | Link |
---|---|
US (1) | US6107203A (zh) |
JP (1) | JPH11216666A (zh) |
KR (1) | KR19990044935A (zh) |
CN (1) | CN1216266A (zh) |
SG (1) | SG68697A1 (zh) |
TW (1) | TW379161B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030010792A1 (en) * | 1998-12-30 | 2003-01-16 | Randy Forshey | Chemical mix and delivery systems and methods thereof |
TW436382B (en) * | 1999-03-12 | 2001-05-28 | Mitsubishi Materials Corp | Wafer holding head, wafer polishing apparatus, and method for making wafers |
JP2001191246A (ja) * | 2000-01-06 | 2001-07-17 | Nec Corp | 平面研磨装置および平面研磨方法 |
AU2001259745A1 (en) * | 2000-05-12 | 2001-11-26 | Multi-Planar Technologies, Inc. | System and method for pneumatic diaphragm cmp head having separate retaining ring and multi-region wafer pressure control |
JP5676832B2 (ja) | 2001-06-08 | 2015-02-25 | エルエスアイ コーポレーション | 半導体ウエハの化学的機械的研磨における欠陥密度低減方法及びスラリ流量制御方法 |
DE10137577C1 (de) * | 2001-07-31 | 2003-03-06 | Infineon Technologies Ag | Ventilmittel für eine Slurry-Auslassöffnung einer Vorrichtung für Chemisch-Mechanisches Polieren |
WO2003029133A1 (en) | 2001-10-01 | 2003-04-10 | Fsi International | Fluid dispensing apparatus |
JP4004795B2 (ja) * | 2001-12-28 | 2007-11-07 | 松下環境空調エンジニアリング株式会社 | 研磨用流体の供給装置 |
US7204679B2 (en) * | 2002-09-30 | 2007-04-17 | Emerson Electric Co. | Flow control system |
JP2004207422A (ja) * | 2002-12-25 | 2004-07-22 | Matsushita Electric Ind Co Ltd | 半導体装置の研磨方法、半導体装置の製造方法および研磨装置 |
US6843709B1 (en) * | 2003-12-11 | 2005-01-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for reducing slurry reflux |
US7455573B2 (en) * | 2006-09-06 | 2008-11-25 | Lightmachinery Inc. | Fluid jet polishing with constant pressure pump |
BRPI0907921A2 (pt) * | 2008-02-26 | 2015-07-28 | Avi Efraty | Parques eólicas hidráulicos para redes de eletricidade e de dessalinização |
CN102335877A (zh) * | 2011-10-11 | 2012-02-01 | 清华大学 | 抛光液输送装置 |
CN104765295B (zh) * | 2015-03-26 | 2017-07-07 | 湖南标立通用科技有限公司 | 一种微量添加仪控制装置及微量添加仪 |
CN109664162B (zh) * | 2017-10-17 | 2020-02-07 | 长鑫存储技术有限公司 | 在金属栓塞的化学机械研磨中的制程动态优化方法及系统 |
CN110202480B (zh) * | 2019-07-09 | 2023-09-05 | 辽宁翔舜科技有限公司 | 一种全自动快速煤焦光片表面处理机系统及处理方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5222867A (en) * | 1986-08-29 | 1993-06-29 | Walker Sr Frank J | Method and system for controlling a mechanical pump to monitor and optimize both reservoir and equipment performance |
US5400855A (en) * | 1993-01-27 | 1995-03-28 | Halliburton Company | Casing inflation packer |
US5477844A (en) * | 1993-11-10 | 1995-12-26 | Diamant Boart, Inc. | Slurry recovery system for a wet cutting saw |
KR0132274B1 (ko) * | 1994-05-16 | 1998-04-11 | 김광호 | 웨이퍼 연마 설비 |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
US5618447A (en) * | 1996-02-13 | 1997-04-08 | Micron Technology, Inc. | Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers |
-
1997
- 1997-11-03 US US08/963,486 patent/US6107203A/en not_active Expired - Lifetime
-
1998
- 1998-10-29 TW TW087117972A patent/TW379161B/zh not_active IP Right Cessation
- 1998-10-30 JP JP31026698A patent/JPH11216666A/ja active Pending
- 1998-10-30 SG SG1998004358A patent/SG68697A1/en unknown
- 1998-11-02 CN CN98121456A patent/CN1216266A/zh active Pending
- 1998-11-02 KR KR1019980046751A patent/KR19990044935A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPH11216666A (ja) | 1999-08-10 |
US6107203A (en) | 2000-08-22 |
CN1216266A (zh) | 1999-05-12 |
KR19990044935A (ko) | 1999-06-25 |
TW379161B (en) | 2000-01-11 |
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