SG67351A1 - Gold wire for bonding - Google Patents
Gold wire for bondingInfo
- Publication number
- SG67351A1 SG67351A1 SG1996009298A SG1996009298A SG67351A1 SG 67351 A1 SG67351 A1 SG 67351A1 SG 1996009298 A SG1996009298 A SG 1996009298A SG 1996009298 A SG1996009298 A SG 1996009298A SG 67351 A1 SG67351 A1 SG 67351A1
- Authority
- SG
- Singapore
- Prior art keywords
- bonding
- gold wire
- gold
- wire
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/012—Semiconductor purity grades
- H01L2924/01205—5N purity grades, i.e. 99.999%
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11852195 | 1995-05-17 | ||
JP31905995A JP3337049B2 (ja) | 1995-05-17 | 1995-12-07 | ボンディング用金線 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG67351A1 true SG67351A1 (en) | 1999-09-21 |
Family
ID=26456443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996009298A SG67351A1 (en) | 1995-05-17 | 1996-04-18 | Gold wire for bonding |
Country Status (6)
Country | Link |
---|---|
US (1) | US5702814A (de) |
EP (1) | EP0743679B1 (de) |
JP (1) | JP3337049B2 (de) |
DE (1) | DE69615746T2 (de) |
MY (1) | MY113663A (de) |
SG (1) | SG67351A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE224961T1 (de) * | 1996-06-12 | 2002-10-15 | Kazuo Ogasa | Verfahren zur herstellung von einer hochreinen hartgoldlegierung |
EP0890987B1 (de) * | 1997-07-07 | 2003-03-05 | W.C. Heraeus GmbH & Co. KG | Feinstdraht aus einer Goldlegierung, Verfahren zu seiner Herstellung und seine Verwendung |
DE19821395C2 (de) | 1998-05-13 | 2000-06-29 | Heraeus Gmbh W C | Verwendung eines Feinstdrahtes aus einer nickelhaltigen Gold-Legierung |
US6610930B1 (en) * | 1998-09-16 | 2003-08-26 | Kulicke & Soffa Investments, Inc. | Composite noble metal wire |
JP3323185B2 (ja) * | 2000-06-19 | 2002-09-09 | 田中電子工業株式会社 | 半導体素子接続用金線 |
KR100427749B1 (ko) * | 2002-05-07 | 2004-04-28 | 엠케이전자 주식회사 | 반도체 소자 본딩용 금-은 합금 와이어 |
EP1811555A4 (de) * | 2004-09-30 | 2012-06-20 | Tanaka Electronics Ind | Au-legierungs-bonddraht |
US8440137B2 (en) * | 2004-11-26 | 2013-05-14 | Tanaka Denshi Kogyo K.K. | Au bonding wire for semiconductor device |
JP5311715B2 (ja) | 2005-01-24 | 2013-10-09 | 新日鉄住金マテリアルズ株式会社 | 半導体素子接続用金線 |
JP5166738B2 (ja) * | 2006-03-24 | 2013-03-21 | 新日鉄住金マテリアルズ株式会社 | 半導体素子接続用金線 |
JP4134261B1 (ja) * | 2007-10-24 | 2008-08-20 | 田中電子工業株式会社 | ボールボンディング用金合金線 |
JP4195495B1 (ja) * | 2007-11-06 | 2008-12-10 | 田中電子工業株式会社 | ボールボンディング用金合金線 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4330329A (en) * | 1979-11-28 | 1982-05-18 | Tanaka Denshi Kogyo Kabushiki Kaisha | Gold bonding wire for semiconductor elements and the semiconductor element |
GB2116208B (en) * | 1981-12-04 | 1985-12-04 | Mitsubishi Metal Corp | Fine gold alloy wire for bonding of a semiconductor device |
US4775512A (en) * | 1985-10-01 | 1988-10-04 | Tanaka Denshi Kogyo Kabushiki Kaisha | Gold line for bonding semiconductor element |
GB2201545B (en) * | 1987-01-30 | 1991-09-11 | Tanaka Electronics Ind | Method for connecting semiconductor material |
GB2262746B (en) * | 1989-04-28 | 1993-09-22 | Tanaka Electronics Ind | Gold wire for the bonding of a semiconductor device |
KR920010119B1 (ko) * | 1989-04-28 | 1992-11-16 | 다나카 덴시 고오교오 가부시기가이샤 | 반도체 소자의 본딩(bonding)용 금선 |
JP2891432B2 (ja) * | 1989-12-27 | 1999-05-17 | 田中電子工業株式会社 | 半導体材料の接続方法,それに用いる接続材料及び半導体装置 |
JP2689773B2 (ja) * | 1991-07-02 | 1997-12-10 | 住友金属鉱山株式会社 | ボンデイングワイヤー |
-
1995
- 1995-12-07 JP JP31905995A patent/JP3337049B2/ja not_active Expired - Fee Related
-
1996
- 1996-01-08 MY MYPI96000051A patent/MY113663A/en unknown
- 1996-01-17 US US08/587,747 patent/US5702814A/en not_active Expired - Lifetime
- 1996-03-12 DE DE69615746T patent/DE69615746T2/de not_active Expired - Lifetime
- 1996-03-12 EP EP96103845A patent/EP0743679B1/de not_active Expired - Lifetime
- 1996-04-18 SG SG1996009298A patent/SG67351A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP3337049B2 (ja) | 2002-10-21 |
JPH0936162A (ja) | 1997-02-07 |
DE69615746T2 (de) | 2002-06-20 |
EP0743679A3 (de) | 1997-02-26 |
MY113663A (en) | 2002-04-30 |
EP0743679A2 (de) | 1996-11-20 |
US5702814A (en) | 1997-12-30 |
DE69615746D1 (de) | 2001-11-15 |
EP0743679B1 (de) | 2001-10-10 |
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