SG65694A1 - Method of reducing generation of particulate matter in a sputtering chamber - Google Patents

Method of reducing generation of particulate matter in a sputtering chamber

Info

Publication number
SG65694A1
SG65694A1 SG1997003872A SG1997003872A SG65694A1 SG 65694 A1 SG65694 A1 SG 65694A1 SG 1997003872 A SG1997003872 A SG 1997003872A SG 1997003872 A SG1997003872 A SG 1997003872A SG 65694 A1 SG65694 A1 SG 65694A1
Authority
SG
Singapore
Prior art keywords
particulate matter
sputtering chamber
reducing generation
generation
reducing
Prior art date
Application number
SG1997003872A
Other languages
English (en)
Inventor
Kenny K Ngan
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG65694A1 publication Critical patent/SG65694A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
SG1997003872A 1996-10-31 1997-10-27 Method of reducing generation of particulate matter in a sputtering chamber SG65694A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/741,708 US5961793A (en) 1996-10-31 1996-10-31 Method of reducing generation of particulate matter in a sputtering chamber

Publications (1)

Publication Number Publication Date
SG65694A1 true SG65694A1 (en) 1999-06-22

Family

ID=24981835

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997003872A SG65694A1 (en) 1996-10-31 1997-10-27 Method of reducing generation of particulate matter in a sputtering chamber

Country Status (5)

Country Link
US (1) US5961793A (fr)
EP (1) EP0840351A3 (fr)
JP (1) JPH10212576A (fr)
SG (1) SG65694A1 (fr)
TW (1) TW409280B (fr)

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Also Published As

Publication number Publication date
EP0840351A3 (fr) 1998-09-16
TW409280B (en) 2000-10-21
US5961793A (en) 1999-10-05
EP0840351A2 (fr) 1998-05-06
JPH10212576A (ja) 1998-08-11

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