SG63851A1 - Electroplating of low-stress nickel - Google Patents

Electroplating of low-stress nickel

Info

Publication number
SG63851A1
SG63851A1 SG1998001409A SG1998001409A SG63851A1 SG 63851 A1 SG63851 A1 SG 63851A1 SG 1998001409 A SG1998001409 A SG 1998001409A SG 1998001409 A SG1998001409 A SG 1998001409A SG 63851 A1 SG63851 A1 SG 63851A1
Authority
SG
Singapore
Prior art keywords
electroplating
low
stress nickel
nickel
stress
Prior art date
Application number
SG1998001409A
Inventor
Nicholas M Martyak
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of SG63851A1 publication Critical patent/SG63851A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SG1998001409A 1997-06-18 1998-06-12 Electroplating of low-stress nickel SG63851A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5014097P 1997-06-18 1997-06-18
US6492398A 1998-04-23 1998-04-23

Publications (1)

Publication Number Publication Date
SG63851A1 true SG63851A1 (en) 1999-03-30

Family

ID=26727930

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998001409A SG63851A1 (en) 1997-06-18 1998-06-12 Electroplating of low-stress nickel

Country Status (5)

Country Link
EP (1) EP0892087A3 (en)
JP (1) JPH1171695A (en)
CN (1) CN1142327C (en)
CA (1) CA2236933A1 (en)
SG (1) SG63851A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4707844B2 (en) * 2001-02-09 2011-06-22 住友電工ファインポリマー株式会社 Electroformed nickel belt, coated nickel belt, and method for producing coated nickel belt
FR2895206B1 (en) * 2005-12-16 2008-03-21 Framatome Anp Sas HEATED ROD FOR PRIMARY CIRCUIT PRESSURIZER OF A PRESSURE WATER NUCLEAR REACTOR.
MY151755A (en) * 2007-12-28 2014-06-30 Shinetsu Chemical Co Outer blade cutting wheel and making method
CN101831675B (en) * 2010-05-21 2012-03-14 南通市申海特种镀饰有限责任公司 Nickel plating process for superconducting materials
CN103160868A (en) * 2011-12-17 2013-06-19 鞍钢重型机械有限责任公司 Electrolyte for producing active nickel with sulfur and use method thereof
CN103422150A (en) * 2012-05-22 2013-12-04 泰州宏瑞新材料有限责任公司 Electroplating device and heavy-metal-ion concentration adjusting tank used for electroplating
CN102677103B (en) * 2012-06-05 2014-10-29 湖北联合天诚防伪技术股份有限公司 Method for enlarging sizes of patterns on electrotype
CN105200462A (en) * 2015-10-19 2015-12-30 姜少群 Electroplating method for elemental nickel transition layer of mould copper tube
CN114717612A (en) * 2022-03-29 2022-07-08 集美大学 Method for realizing microstructure optical copper mold protection and demolding by utilizing Cr nano layer

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1000311A (en) * 1962-10-25 1965-08-04 Albright & Wilson Mfg Ltd Electrodeposition of nickel
FR1582093A (en) * 1968-05-31 1969-09-26
US3726768A (en) * 1971-04-23 1973-04-10 Atomic Energy Commission Nickel plating baths containing aromatic sulfonic acids
GB1524748A (en) * 1976-05-28 1978-09-13 Inco Europ Ltd Production of hard heat-resistant nickel-base electrodeposits
JP2763072B2 (en) * 1987-11-13 1998-06-11 エヌ・イーケムキヤツト 株式会社 Tin-nickel alloy plating liquid
JPH0598488A (en) * 1991-06-05 1993-04-20 Daiwa Kasei Kenkyusho:Kk Copper-nickel alloy electroplating bath
JP3365866B2 (en) * 1994-08-01 2003-01-14 荏原ユージライト株式会社 Non-cyanide precious metal plating bath

Also Published As

Publication number Publication date
EP0892087A2 (en) 1999-01-20
EP0892087A3 (en) 2000-06-07
CN1142327C (en) 2004-03-17
CA2236933A1 (en) 1998-12-18
CN1213019A (en) 1999-04-07
JPH1171695A (en) 1999-03-16

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