CN103422150A - Electroplating device and heavy-metal-ion concentration adjusting tank used for electroplating - Google Patents
Electroplating device and heavy-metal-ion concentration adjusting tank used for electroplating Download PDFInfo
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- CN103422150A CN103422150A CN2012101601073A CN201210160107A CN103422150A CN 103422150 A CN103422150 A CN 103422150A CN 2012101601073 A CN2012101601073 A CN 2012101601073A CN 201210160107 A CN201210160107 A CN 201210160107A CN 103422150 A CN103422150 A CN 103422150A
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- electroplating
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- plating
- adjusting tank
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Abstract
The invention relates to an electroplating adjusting tank used for adjusting concentrations of heavy metal ions and an electroplating device comprising the electroplating adjusting tank. The electroplating adjusting tank comprises an electroplating tank body and inert anode plates. The adjusting tank and an electroplating tank are disposed cooperatively to form the electroplating device comprising the adjusting tank. The adjusting tank and the electroplating tank are capable of consuming redundant Cu<2+> in an electroplating solution and maintaining concentration stabilization of the Cu<2+> in the electroplating solution, thereby guaranteeing the good quality of coppered steel wires and avoiding environment pollution caused by discharging heavy metals in the electroplating solution.
Description
Technical field
The present invention relates to a kind of device of regulating concentration of heavy metal ion, thereby especially in the cupric pyrophosphate electroplating solution, by regulating copper ion concentration, reach the regulating tank that improves the Coppered Steel Wire quality, reduces production costs, controls heavy metal contamination.
Background technology
At present, thus in known adjusting cupric pyrophosphate electroplating solution, the ordinary method of concentration of heavy metal ion is that the discharge electroplate liquid reduces concentration of heavy metal ion in electroplate liquid.The cupric pyrophosphate electro-coppering be using metal plated steel wire or by the plating matrix as negative electrode, copper as anode pad steel wire or by the plating matrix below, steel wire or by the plating matrix in electroplate liquid, move, by electrochemical reaction by copper be plating to steel wire or by the plating matrix on.In electroplating process, because the increase of current efficiency along with current density reduces, current efficiency is lower than 100%, and the speed that anode copper dissolves is far longer than the negative electrode steel wire or is plated matrix by copper-plated amount, Cu in solution
2+Content is relatively more and more higher, too high Cu
2+Content can cause steel wire or quilt plating matrix coating is coarse, crystal grain is excessive, thereby affect quality product.General treatment process is the discharge electroplate liquid, then reduces Cu in electroplate liquid
2+Concentration, this method, to environment, increases production cost.
Summary of the invention
In order to solve Cu in the cupric pyrophosphate electroplating solution
2+The problem of excessive concentration, the invention provides a kind of regulating tank of concentration of heavy metal ion, and this regulating tank can consume Cu unnecessary in electroplating solution
2+, keep Cu in electroplating solution
2+Stablizing of concentration, thus the good quality of Coppered Steel Wire guaranteed, avoid the discharge of heavy metal in electroplate liquid to cause the pollution to environment.
The new principle of this practicality is a kind of regulating tank of design in plating tank, uses a kind of inert anode plate instead of copper anode in cell body.During plating, steel wire or quilt plating matrix continue deposition Cu as negative electrode
2+, the inert anode plate is dissolved copper not, and a brine electrolysis becomes O
2And H
2.
The technical solution adopted for the present invention to solve the technical problems is: a kind of plating regulating tank of concentration of heavy metal ion, comprise electroplating cell body and anode, and described anode is the inert anode plate.
Described plating regulating tank is to be equipped with plating tank, and described inert anode plate is electrically connected to the plating tank Anodic, and the power supply barretter is arranged for controlling strength of current.
The invention also discloses a kind of electroplanting device, comprise plating tank, cathode roller, anode, also be provided with the plating regulating tank, described electroplating cell body and the anode of comprising, described anode is the inert anode plate.
Above-mentioned electroplanting device, wherein electroplating regulating tank is to be equipped with plating tank, described inert anode plate is electrically connected to the plating tank Anodic, and the power supply barretter is arranged for controlling strength of current.
Generally include some electroplating cell bodies in existing electroplating assembly line, connect and compose electroplating assembly line by some electroplating cell bodies, the present invention, on the prior art basis, changes the copper anode (not steel steel anode) in one or two electroplating cell body wherein into inert sun plate, forms regulating tank.The electric current of regulating tank is according to electroplate liquid Cu
2+Concentration is regulated.Work as Cu
2+During excessive concentration, increase electric current in regulating tank and slow down shot copper ion dissolution rate, Cu
2+Concentration decreases.Otherwise, work as Cu
2+When concentration is on the low side, reduces electric current in regulating tank and promote shot copper ion dissolution rate, Cu in solution
2+After concentration is effectively controlled, just do not affect by plating matrix coating quality, simultaneously without passing through the discharge electroplate liquid to reduce Cu yet
2+Content.In addition, because the regulating tank brine electrolysis produces H
+, can reduce the pH value of electroplate liquid, avoid the higher enhancing solution acidic of pH value and then affect the Coppered Steel Wire quality.
The accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is copper facing schematic diagram of the present invention.
Fig. 2 is the longitudinal section structural map of an embodiment of regulating tank.
1. cathode rollers in figure, 2. steel wire, 3. inert anode plate, 4. shot copper, 5. electroplate liquid, 6. power supply barretter, 7. stainless steel anode plate.
Embodiment
In Fig. 1, the inert anode plate 3 that replaces copper anode is padded on below steel wire 2, and steel wire 2 is moved by right side in electroplate liquid 5 to the left as negative electrode, and the shot copper 4 that electrochemical reaction will be placed in stainless steel anode plate 7 and be immersed in electroplate liquid 5 is decomposed into Cu
2+Be plating to the top layer of steel wire 2.
In embodiment illustrated in fig. 2, Cu in electroplating solution 5
2+Because dissolution rate higher than steel wire 2 by plating speed, Cu in electroplate liquid 5
2+When content is progressively too high, controls power supply barretter 6 and increase electric currents, Cu
2+Content correspondingly reduces.Otherwise, Cu in electroplate liquid 5
2+When content is on the low side, controls power supply barretter 6 and reduce electric current with active balance Cu
2+Content.Cu
2+Content is effectively controlled, and steel wire 2 copper plate quality just can be guaranteed, and simultaneously, has also avoided the discharge of heavy metal in the electroplate liquid to cause the pollution to environment.
Claims (4)
1. the plating regulating tank of a concentration of heavy metal ion, is characterized in that comprising electroplating cell body and anode, and described anode is the inert anode plate.
2. the plating regulating tank of concentration of heavy metal ion according to claim 1, is characterized in that described plating regulating tank is to be equipped with plating tank, and described inert anode plate is electrically connected to the plating tank Anodic, and the power supply barretter is arranged for controlling strength of current.
3. an electroplanting device, comprise plating tank, cathode roller, anode, it is characterized in that also being provided with the plating regulating tank, described electroplating cell body and the anode of comprising, and described anode is the inert anode plate.
4. electroplanting device according to claim 3, is characterized in that described plating regulating tank is to be equipped with plating tank, and described inert anode plate is electrically connected to the plating tank Anodic, and the power supply barretter is arranged for controlling strength of current.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101601073A CN103422150A (en) | 2012-05-22 | 2012-05-22 | Electroplating device and heavy-metal-ion concentration adjusting tank used for electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101601073A CN103422150A (en) | 2012-05-22 | 2012-05-22 | Electroplating device and heavy-metal-ion concentration adjusting tank used for electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103422150A true CN103422150A (en) | 2013-12-04 |
Family
ID=49647523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101601073A Pending CN103422150A (en) | 2012-05-22 | 2012-05-22 | Electroplating device and heavy-metal-ion concentration adjusting tank used for electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103422150A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103668374A (en) * | 2013-12-19 | 2014-03-26 | 株洲永盛电池材料有限公司 | Method for carrying out one-side copper plating on wide stainless steel band and electroplating bath |
| CN112458523A (en) * | 2020-11-12 | 2021-03-09 | 南通创源电化学科技有限公司 | Ceramic anode electroplating bath |
Citations (10)
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|---|---|---|---|---|
| US4181580A (en) * | 1973-11-28 | 1980-01-01 | Nippon Steel Corporation | Process for electro-tin plating |
| EP0297178A1 (en) * | 1987-07-03 | 1989-01-04 | N.V. Bekaert S.A. | Electrodeposition of metals |
| CN1047540A (en) * | 1989-05-19 | 1990-12-05 | 新加坡商太阳工业股份有限公司 | Electroplating system |
| US4986888A (en) * | 1988-07-07 | 1991-01-22 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces |
| JPH07150397A (en) * | 1993-11-26 | 1995-06-13 | Nobuyasu Doi | Power feeder for electroplating |
| US5804053A (en) * | 1995-12-07 | 1998-09-08 | Eltech Systems Corporation | Continuously electroplated foam of improved weight distribution |
| CN1213019A (en) * | 1997-06-18 | 1999-04-07 | 阿托泰克德国有限公司 | Electroplating of low-stress nickel |
| CN1529903A (en) * | 2000-10-02 | 2004-09-15 | �Ƚ�װ�ù�˾ | Plating system with remote secondary anode for semiconductor manufacturing |
| CN1900380A (en) * | 2005-07-08 | 2007-01-24 | 霍尔穆勒机械制造有限公司 | Apparatus and process for electroplating treatment of foils from roller to roller |
| CN202705551U (en) * | 2012-05-22 | 2013-01-30 | 泰州宏瑞新材料有限责任公司 | Regulation tank for copper ion concentration of copper pyrophosphate electroplate liquid and electroplating device |
-
2012
- 2012-05-22 CN CN2012101601073A patent/CN103422150A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4181580A (en) * | 1973-11-28 | 1980-01-01 | Nippon Steel Corporation | Process for electro-tin plating |
| EP0297178A1 (en) * | 1987-07-03 | 1989-01-04 | N.V. Bekaert S.A. | Electrodeposition of metals |
| US4986888A (en) * | 1988-07-07 | 1991-01-22 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces |
| CN1047540A (en) * | 1989-05-19 | 1990-12-05 | 新加坡商太阳工业股份有限公司 | Electroplating system |
| JPH07150397A (en) * | 1993-11-26 | 1995-06-13 | Nobuyasu Doi | Power feeder for electroplating |
| US5804053A (en) * | 1995-12-07 | 1998-09-08 | Eltech Systems Corporation | Continuously electroplated foam of improved weight distribution |
| CN1213019A (en) * | 1997-06-18 | 1999-04-07 | 阿托泰克德国有限公司 | Electroplating of low-stress nickel |
| CN1529903A (en) * | 2000-10-02 | 2004-09-15 | �Ƚ�װ�ù�˾ | Plating system with remote secondary anode for semiconductor manufacturing |
| CN1900380A (en) * | 2005-07-08 | 2007-01-24 | 霍尔穆勒机械制造有限公司 | Apparatus and process for electroplating treatment of foils from roller to roller |
| CN202705551U (en) * | 2012-05-22 | 2013-01-30 | 泰州宏瑞新材料有限责任公司 | Regulation tank for copper ion concentration of copper pyrophosphate electroplate liquid and electroplating device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103668374A (en) * | 2013-12-19 | 2014-03-26 | 株洲永盛电池材料有限公司 | Method for carrying out one-side copper plating on wide stainless steel band and electroplating bath |
| CN103668374B (en) * | 2013-12-19 | 2016-05-18 | 湖南永盛新材料股份有限公司 | A kind of wide cut stainless steel band one side copper coating and electroplating bath |
| CN112458523A (en) * | 2020-11-12 | 2021-03-09 | 南通创源电化学科技有限公司 | Ceramic anode electroplating bath |
| CN112458523B (en) * | 2020-11-12 | 2023-10-31 | 南通创源电化学科技有限公司 | Ceramic anode electroplating bath |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131204 |