CN202705552U - Device for regulating concentration of heavy metal ions in electroplate liquid - Google Patents

Device for regulating concentration of heavy metal ions in electroplate liquid Download PDF

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Publication number
CN202705552U
CN202705552U CN 201220231473 CN201220231473U CN202705552U CN 202705552 U CN202705552 U CN 202705552U CN 201220231473 CN201220231473 CN 201220231473 CN 201220231473 U CN201220231473 U CN 201220231473U CN 202705552 U CN202705552 U CN 202705552U
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CN
China
Prior art keywords
heavy metal
electroplate liquid
concentration
tank
metal ions
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220231473
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Chinese (zh)
Inventor
林国清
陶剑岗
李建强
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TAIZHOU HONGRUI NEW MATERIAL CO Ltd
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TAIZHOU HONGRUI NEW MATERIAL CO Ltd
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Priority to CN 201220231473 priority Critical patent/CN202705552U/en
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Publication of CN202705552U publication Critical patent/CN202705552U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a device for regulating concentration of heavy metal ions in electroplate liquid. A regulation tank is arranged in an electroplate tank, an inert anode plate in a regulation tank body is used as an anode, and current in an electroplate tank and the regulation tank can be regulated through a power ballast. The concentration of copper heavy metal ions can be regulated by the device so as to improve electroplate quality, reduce production cost and control heavy metal pollution.

Description

A kind of device of regulating concentration of heavy metal ion in the electroplate liquid
Technical field
The utility model relates to a kind of device of regulating concentration of heavy metal ion in the electroplate liquid.
Background technology
At present, thus the ordinary method of concentration of heavy metal ion is that the discharging electroplate liquid reduces concentration of heavy metal ion in the electroplate liquid in the known adjusting cupric pyrophosphate electroplating solution.The cupric pyrophosphate electro-coppering is that metal plated steel wire or quilt are plated matrix as negative electrode, and below steel wire or quilt plating matrix, steel wire or quilt plate matrix and move in electroplate liquid copper as anode pad, by electrochemical reaction copper are plating on steel wire or the quilt plating matrix.Owing to the increase of current efficiency along with current density reduces, current efficiency is lower than 100% in electroplating process, and the speed of anode copper dissolving is far longer than the negative electrode steel wire or is plated matrix by copper-plated amount, Cu in the solution 2+Content is relatively more and more higher, too high Cu 2+Content can cause steel wire or quilt plating matrix coating is coarse, crystal grain is excessive, thereby affect quality product.General treatment process is the discharging electroplate liquid, then reduces Cu in the electroplate liquid 2+Concentration, this method increase production cost to environment.
Summary of the invention
In order to solve Cu in the cupric pyrophosphate electroplating solution 2+The problem of excessive concentration, the utility model provide a kind of control method of concentration of heavy metal ion, and the method can consume Cu unnecessary in the electroplating solution 2+, keep Cu in the electroplating solution 2+Concentration stable, thus the good quality of Coppered Steel Wire guaranteed, avoid the discharging of heavy metal in the electroplate liquid to cause pollution to environment.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of device of regulating concentration of heavy metal ion in the electroplate liquid is characterized in that: regulating tank is set in plating tank, regulates and use the inert anode plate as anode in the cell body; Also be provided with the power supply barretter between plating tank and regulating tank, can regulate electric current in plating tank and the regulating tank by the power supply barretter.During plating, steel wire or quilt plating matrix continue deposition Cu as negative electrode 2+, the inert anode plate is dissolved copper not, and a brine electrolysis becomes O 2And H 2
The electric current of regulating tank is according to electroplate liquid Cu 2+Concentration is regulated.Work as Cu 2+During excessive concentration, increase the interior electric current of regulating tank and slow down shot copper ion dissolution rate, Cu 2+Concentration decreases.Otherwise, work as Cu 2+When concentration is on the low side, reduce electric current promotion shot copper ion dissolution rate in the regulating tank, Cu in the solution 2+After concentration is effectively controlled, just do not affect by plating matrix coating quality, need not simultaneously by the discharging electroplate liquid to reduce Cu yet 2+Content.In addition, because the regulating tank brine electrolysis produces H +, can reduce the pH value of electroplate liquid, avoid the higher enhancing solution acidic of pH value and then affect the Coppered Steel Wire quality.
Thereby concentration of heavy metal ion reaches the purpose that improves electroplating quality, reduces production costs, controls heavy metal contamination in the utility model adjustable plating liquor.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is copper facing schematic diagram of the present utility model.
Fig. 2 is the longitudinal section structural map of an embodiment of regulating tank.
1. cathode rollers among the figure, 2. steel wire, 3. inert anode plate, 4. shot copper, 5. electroplate liquid, 6. power supply barretter, 7. stainless steel anode plate.
Embodiment
In Fig. 1, the inert anode plate 3 that replaces copper anode is padded on below the steel wire 2, and steel wire 2 is mobile to the left by the right side in electroplate liquid 5 as negative electrode, and the shot copper 4 that electrochemical reaction will place stainless steel anode plate 7 and be immersed in electroplate liquid 5 is decomposed into Cu 2+Be plating to the top layer of steel wire 2.
In embodiment illustrated in fig. 2, Cu in the electroplating solution 5 2+Because dissolution rate is higher than steel wire 2 by plating speed, Cu in the electroplate liquid 5 2+When content was progressively too high, control power supply barretter 6 increased electric currents, Cu 2+Content correspondingly reduces.Otherwise, Cu in the electroplate liquid 5 2+When content was on the low side, control power supply barretter 6 reduced electric current with active balance Cu 2+Content.Cu 2+Content is effectively controlled, steel wire 2 copper plate quality just can be guaranteed, and simultaneously, has also avoided the discharging of heavy metal in the electroplate liquid to cause pollution to environment.

Claims (1)

1. a device of regulating concentration of heavy metal ion in the electroplate liquid is characterized in that: regulating tank is set in plating tank, regulates and use the inert anode plate as anode in the cell body; Also be provided with the power supply barretter between plating tank and regulating tank, can regulate electric current in plating tank and the regulating tank by the power supply barretter.
CN 201220231473 2012-05-22 2012-05-22 Device for regulating concentration of heavy metal ions in electroplate liquid Expired - Fee Related CN202705552U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220231473 CN202705552U (en) 2012-05-22 2012-05-22 Device for regulating concentration of heavy metal ions in electroplate liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220231473 CN202705552U (en) 2012-05-22 2012-05-22 Device for regulating concentration of heavy metal ions in electroplate liquid

Publications (1)

Publication Number Publication Date
CN202705552U true CN202705552U (en) 2013-01-30

Family

ID=47585873

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220231473 Expired - Fee Related CN202705552U (en) 2012-05-22 2012-05-22 Device for regulating concentration of heavy metal ions in electroplate liquid

Country Status (1)

Country Link
CN (1) CN202705552U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130130

Termination date: 20150522

EXPY Termination of patent right or utility model