CN202705550U - Copper ion concentration adjusting device for copper pyrophosphate electroplating liquid - Google Patents

Abstract

The utility model relates to a copper ion concentration adjusting device for copper pyrophosphate electroplating liquid. An adjusting tank is arranged in an electroplating tank, and an inert anode plate is used to serve as an anode. By means of the device, the aims of improving coppered steel wire, lowering production cost and controlling heavy metal pollution can be achieved by adjusting copper ion concentration.

Description

Cupric pyrophosphate electroplate liquid copper ion concentration setting device

Technical field

The utility model relates to a kind of device of regulating concentration of heavy metal ion, thereby especially reaches the device that improves the Coppered Steel Wire quality, reduces production costs, controls heavy metal contamination by regulating copper ion concentration in the cupric pyrophosphate electroplating solution.

Background technology

At present, thus the ordinary method of concentration of heavy metal ion is that the discharging electroplate liquid reduces concentration of heavy metal ion in the electroplate liquid in the known adjusting cupric pyrophosphate electroplating solution.The cupric pyrophosphate electro-coppering is with metal plated steel wire or is plated matrix as negative electrode that below steel wire or quilt plating matrix, steel wire or quilt plating matrix move copper as anode pad, by electrochemical reaction copper are plating on steel wire or the quilt plating matrix in electroplate liquid.Owing to the increase of current efficiency along with current density reduces, current efficiency is lower than 100% in electroplating process, and the speed of anode copper dissolving is far longer than the negative electrode steel wire or is plated matrix by copper-plated amount, Cu in the solution ²⁺Content is relatively more and more higher, too high Cu ²⁺Content can cause steel wire or quilt plating matrix coating is coarse, crystal grain is excessive, thereby affect quality product.General treatment process is the discharging electroplate liquid, then reduces Cu in the electroplate liquid ²⁺Concentration, this method increase production cost to environment.

Summary of the invention

In order to solve Cu in the cupric pyrophosphate electroplating solution ²⁺The problem of excessive concentration, the utility model provide a kind of setting device of concentration of heavy metal ion, and this device can consume Cu unnecessary in the electroplating solution ²⁺, keep Cu in the electroplating solution ²⁺Concentration stable, thus the good quality of Coppered Steel Wire guaranteed, avoid the discharging of heavy metal in the electroplate liquid to cause pollution to environment.

The technical scheme that its technical problem that solves the utility model adopts is: regulating tank is set in the plating tank, regulates and use the inert anode plate as anode in the cell body.During plating, steel wire or quilt plating matrix continue deposition Cu as negative electrode ²⁺, the inert anode plate is dissolved copper not, and a brine electrolysis becomes O ²And H ²

The electric current of regulating tank is according to electroplate liquid Cu ²⁺Concentration is regulated.Work as Cu ²⁺During excessive concentration, increase the interior electric current of regulating tank and slow down shot copper ion dissolution rate, Cu ²⁺Concentration decreases.Otherwise, work as Cu ²⁺When concentration is on the low side, reduce electric current promotion shot copper ion dissolution rate in the regulating tank, Cu in the solution ²⁺After concentration is effectively controlled, just do not affect by plating matrix coating quality, need not simultaneously by the discharging electroplate liquid to reduce Cu yet ²⁺Content.In addition, because the regulating tank brine electrolysis produces H ⁺, can reduce the pH value of electroplate liquid, avoid the higher enhancing solution acidic of pH value and then affect the Coppered Steel Wire quality.

Description of drawings

Below in conjunction with drawings and Examples the utility model is further specified.

Fig. 1 is copper facing schematic diagram of the present utility model.

Fig. 2 is the longitudinal section structural map of an embodiment of regulating tank.

1. cathode rollers among the figure, 2. steel wire, 3. inert anode plate, 4. shot copper, 5. electroplate liquid, 6. power supply barretter, 7. stainless steel anode plate.

Embodiment

In Fig. 1, the inert anode plate 3 that replaces copper anode is padded on below the steel wire 2, and steel wire 2 is mobile to the left by the right side in electroplate liquid 5 as negative electrode, and the shot copper 4 that electrochemical reaction will place stainless steel anode plate 7 and be immersed in electroplate liquid 5 is decomposed into Cu ²⁺Be plating to the top layer of steel wire 2.

In embodiment illustrated in fig. 2, Cu in the electroplating solution 5 ²⁺Because dissolution rate is higher than steel wire 2 by plating speed, Cu in the electroplate liquid 5 ²⁺When content was progressively too high, control power supply barretter 6 increased electric currents, Cu ²⁺Content correspondingly reduces.Otherwise, Cu in the electroplate liquid 5 ²⁺When content was on the low side, control power supply barretter 6 reduced electric current with active balance Cu ²⁺Content.Cu ²⁺Content is effectively controlled, steel wire 2 copper plate quality just can be guaranteed, and simultaneously, has also avoided the discharging of heavy metal in the electroplate liquid to cause pollution to environment.

Claims (1)

1.. a cupric pyrophosphate electroplate liquid copper ion concentration setting device is characterized in that: regulating tank is set in plating tank, regulates and use the inert anode plate as anode in the cell body.

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