EP0892087A3 - Electroplating of low-stress nickel - Google Patents

Electroplating of low-stress nickel Download PDF

Info

Publication number
EP0892087A3
EP0892087A3 EP98304642A EP98304642A EP0892087A3 EP 0892087 A3 EP0892087 A3 EP 0892087A3 EP 98304642 A EP98304642 A EP 98304642A EP 98304642 A EP98304642 A EP 98304642A EP 0892087 A3 EP0892087 A3 EP 0892087A3
Authority
EP
European Patent Office
Prior art keywords
nickel
electroplating
low
stress
stress nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98304642A
Other languages
German (de)
French (fr)
Other versions
EP0892087A2 (en
Inventor
Nicholas Martyak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of EP0892087A2 publication Critical patent/EP0892087A2/en
Publication of EP0892087A3 publication Critical patent/EP0892087A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Nickel and nickel alloys can be electroplated from an aqueous acidic solution containing nickel alkane sulfonic acid and a stress-reducing additive that imparts compressive stress to an electrodeposit. The electroplating bath is acidic with a pH of 0 to 5.
EP98304642A 1997-06-18 1998-06-11 Electroplating of low-stress nickel Withdrawn EP0892087A3 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US5014097P 1997-06-18 1997-06-18
US50140P 1997-06-18
US6492398A 1998-04-23 1998-04-23
US64923 2002-08-29

Publications (2)

Publication Number Publication Date
EP0892087A2 EP0892087A2 (en) 1999-01-20
EP0892087A3 true EP0892087A3 (en) 2000-06-07

Family

ID=26727930

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98304642A Withdrawn EP0892087A3 (en) 1997-06-18 1998-06-11 Electroplating of low-stress nickel

Country Status (5)

Country Link
EP (1) EP0892087A3 (en)
JP (1) JPH1171695A (en)
CN (1) CN1142327C (en)
CA (1) CA2236933A1 (en)
SG (1) SG63851A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4707844B2 (en) * 2001-02-09 2011-06-22 住友電工ファインポリマー株式会社 Electroformed nickel belt, coated nickel belt, and method for producing coated nickel belt
FR2895206B1 (en) * 2005-12-16 2008-03-21 Framatome Anp Sas HEATED ROD FOR PRIMARY CIRCUIT PRESSURIZER OF A PRESSURE WATER NUCLEAR REACTOR.
MY151755A (en) * 2007-12-28 2014-06-30 Shinetsu Chemical Co Outer blade cutting wheel and making method
CN101831675B (en) * 2010-05-21 2012-03-14 南通市申海特种镀饰有限责任公司 Nickel plating process for superconducting materials
CN103160868A (en) * 2011-12-17 2013-06-19 鞍钢重型机械有限责任公司 Electrolyte for producing active nickel with sulfur and use method thereof
CN103422150A (en) * 2012-05-22 2013-12-04 泰州宏瑞新材料有限责任公司 Electroplating device and heavy-metal-ion concentration adjusting tank used for electroplating
CN102677103B (en) * 2012-06-05 2014-10-29 湖北联合天诚防伪技术股份有限公司 Method for enlarging sizes of patterns on electrotype
CN105200462A (en) * 2015-10-19 2015-12-30 姜少群 Electroplating method for elemental nickel transition layer of mould copper tube
CN114717612A (en) * 2022-03-29 2022-07-08 集美大学 Method for realizing microstructure optical copper mold protection and demolding by utilizing Cr nano layer

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312604A (en) * 1962-10-25 1967-04-04 Albright & Wilson Mfg Ltd Electrodeposition of nickel
GB1213267A (en) * 1968-05-31 1970-11-25 Nickel Le Improvements in or relating to high-rate electrolytic nickel-plating methods, and installations
US3726768A (en) * 1971-04-23 1973-04-10 Atomic Energy Commission Nickel plating baths containing aromatic sulfonic acids
US4108740A (en) * 1976-05-28 1978-08-22 The International Nickel Company, Inc. Hard, heat-resistant nickel electrodeposits
JPH01129988A (en) * 1987-11-13 1989-05-23 Nippon Engeruharudo Kk Tin-nickel alloy plating solution
JPH0598488A (en) * 1991-06-05 1993-04-20 Daiwa Kasei Kenkyusho:Kk Copper-nickel alloy electroplating bath
JPH0841676A (en) * 1994-08-01 1996-02-13 Ebara Yuujiraito Kk Non-cyan noble metal plating bath

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312604A (en) * 1962-10-25 1967-04-04 Albright & Wilson Mfg Ltd Electrodeposition of nickel
GB1213267A (en) * 1968-05-31 1970-11-25 Nickel Le Improvements in or relating to high-rate electrolytic nickel-plating methods, and installations
US3726768A (en) * 1971-04-23 1973-04-10 Atomic Energy Commission Nickel plating baths containing aromatic sulfonic acids
US4108740A (en) * 1976-05-28 1978-08-22 The International Nickel Company, Inc. Hard, heat-resistant nickel electrodeposits
JPH01129988A (en) * 1987-11-13 1989-05-23 Nippon Engeruharudo Kk Tin-nickel alloy plating solution
JPH0598488A (en) * 1991-06-05 1993-04-20 Daiwa Kasei Kenkyusho:Kk Copper-nickel alloy electroplating bath
JPH0841676A (en) * 1994-08-01 1996-02-13 Ebara Yuujiraito Kk Non-cyan noble metal plating bath

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
KUDRYAVTSEV ET AL.: "Nickel Electrodeposition from Methansulfonic Acid-Based Bath", PROCEEDINGS OF AMERICAN ELECTROPLATERS, SURFACE FINISHING, 1996, pages 837 - 841, XP000884995 *
PATENT ABSTRACTS OF JAPAN vol. 013, no. 379 (C - 628) 22 August 1989 (1989-08-22) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 446 (C - 1098) 17 August 1993 (1993-08-17) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 06 28 June 1996 (1996-06-28) *

Also Published As

Publication number Publication date
EP0892087A2 (en) 1999-01-20
SG63851A1 (en) 1999-03-30
CN1142327C (en) 2004-03-17
CA2236933A1 (en) 1998-12-18
CN1213019A (en) 1999-04-07
JPH1171695A (en) 1999-03-16

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