SG60093G - A method of making ohmic low resistance w-sb contacts to iii-v semiconductor materials - Google Patents

A method of making ohmic low resistance w-sb contacts to iii-v semiconductor materials

Info

Publication number
SG60093G
SG60093G SG60093A SG60093A SG60093G SG 60093 G SG60093 G SG 60093G SG 60093 A SG60093 A SG 60093A SG 60093 A SG60093 A SG 60093A SG 60093 G SG60093 G SG 60093G
Authority
SG
Singapore
Prior art keywords
contacts
iii
low resistance
semiconductor materials
making ohmic
Prior art date
Application number
SG60093A
Other languages
English (en)
Original Assignee
American Telephone & Telegraph
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone & Telegraph filed Critical American Telephone & Telegraph
Publication of SG60093G publication Critical patent/SG60093G/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • H01L29/452—Ohmic electrodes on AIII-BV compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/02—Contacts, special

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
SG60093A 1990-02-12 1993-05-07 A method of making ohmic low resistance w-sb contacts to iii-v semiconductor materials SG60093G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/478,875 US5011792A (en) 1990-02-12 1990-02-12 Method of making ohmic resistance WSb, contacts to III-V semiconductor materials

Publications (1)

Publication Number Publication Date
SG60093G true SG60093G (en) 1993-07-09

Family

ID=23901726

Family Applications (1)

Application Number Title Priority Date Filing Date
SG60093A SG60093G (en) 1990-02-12 1993-05-07 A method of making ohmic low resistance w-sb contacts to iii-v semiconductor materials

Country Status (6)

Country Link
US (1) US5011792A (fr)
EP (1) EP0442203B1 (fr)
JP (1) JP2898423B2 (fr)
DE (1) DE69001016T2 (fr)
HK (1) HK117693A (fr)
SG (1) SG60093G (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
JP3654037B2 (ja) 1999-03-25 2005-06-02 住友電気工業株式会社 オーミック電極とその製造方法、および半導体装置
JP7271166B2 (ja) * 2018-12-21 2023-05-11 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE532794A (fr) * 1953-10-26
US3768151A (en) * 1970-11-03 1973-10-30 Ibm Method of forming ohmic contacts to semiconductors
JPS567304B2 (fr) * 1972-08-28 1981-02-17
US4186410A (en) * 1978-06-27 1980-01-29 Bell Telephone Laboratories, Incorporated Nonalloyed ohmic contacts to n-type Group III(a)-V(a) semiconductors
CA1138795A (fr) * 1980-02-19 1983-01-04 Goodrich (B.F.) Company (The) Glissoire d'evacuation et embarcation de sauvetage gonflables combinees
US4361718A (en) * 1980-12-19 1982-11-30 E. I. Du Pont De Nemours And Company Silicon solar cell N-region metallizations comprising a nickel-antimony alloy
JPS586143A (ja) * 1981-07-02 1983-01-13 Matsushita Electronics Corp 半導体装置
US4523212A (en) * 1982-03-12 1985-06-11 The United States Of America As Represented By The Secretary Of The Air Force Simultaneous doped layers for semiconductor devices
JPS61111525A (ja) * 1984-11-06 1986-05-29 Nec Corp 半導体素子の電極形成方法
JPH071813B2 (ja) * 1985-05-31 1995-01-11 古河電気工業株式会社 半導体発光装置の製造方法
US4662060A (en) * 1985-12-13 1987-05-05 Allied Corporation Method of fabricating semiconductor device having low resistance non-alloyed contact layer
US4662063A (en) * 1986-01-28 1987-05-05 The United States Of America As Represented By The Department Of The Navy Generation of ohmic contacts on indium phosphide
EP0272303A1 (fr) * 1986-06-24 1988-06-29 AT&T Corp. Procede de fabrication de dispositifs dans des substrats semi-conducteurs iii-v et dispositifs ainsi formes
US4850357A (en) * 1988-01-12 1989-07-25 Cardiac Pacemakers, Inc. Biphasic pulse generator for an implantable defibrillator
JPH01261204A (ja) * 1988-04-11 1989-10-18 Fujikura Ltd 酸化物系超電導体の製造方法

Also Published As

Publication number Publication date
DE69001016D1 (de) 1993-04-08
DE69001016T2 (de) 1993-07-15
JPH04357827A (ja) 1992-12-10
US5011792A (en) 1991-04-30
EP0442203B1 (fr) 1993-03-03
EP0442203A1 (fr) 1991-08-21
JP2898423B2 (ja) 1999-06-02
HK117693A (en) 1993-11-05

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