SG59992A1 - Solder-coating method and solder paste suitable for use therein - Google Patents

Solder-coating method and solder paste suitable for use therein

Info

Publication number
SG59992A1
SG59992A1 SG1996009384A SG1996009384A SG59992A1 SG 59992 A1 SG59992 A1 SG 59992A1 SG 1996009384 A SG1996009384 A SG 1996009384A SG 1996009384 A SG1996009384 A SG 1996009384A SG 59992 A1 SG59992 A1 SG 59992A1
Authority
SG
Singapore
Prior art keywords
solder
coating method
paste suitable
solder paste
coating
Prior art date
Application number
SG1996009384A
Other languages
English (en)
Inventor
De Micheal T W Langen
Van Johannes A H Gerven
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Priority to SG1996009384A priority Critical patent/SG59992A1/en
Priority to EP93203059A priority patent/EP0651600B1/en
Priority to CA002134632A priority patent/CA2134632A1/en
Priority to US08/331,823 priority patent/US5551628A/en
Priority to BR9404291A priority patent/BR9404291A/pt
Priority to JP6293864A priority patent/JPH07193365A/ja
Priority to CN94118128A priority patent/CN1108025A/zh
Publication of SG59992A1 publication Critical patent/SG59992A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SG1996009384A 1993-11-02 1993-11-02 Solder-coating method and solder paste suitable for use therein SG59992A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SG1996009384A SG59992A1 (en) 1993-11-02 1993-11-02 Solder-coating method and solder paste suitable for use therein
EP93203059A EP0651600B1 (en) 1993-11-02 1993-11-02 Solder-coating method, and solder paste suitable for use therein
CA002134632A CA2134632A1 (en) 1993-11-02 1994-10-28 Solder-coating method, and solder paste suitable for use therein
US08/331,823 US5551628A (en) 1993-11-02 1994-10-31 Solder-coating method, and solder paste suitable for use therein
BR9404291A BR9404291A (pt) 1993-11-02 1994-10-31 Processo de revestimento com solda de uma área terminal metálica prevista sobre um substrato, pasta de solda apropriada para aplicação pelo processo e painel ou folha fina flexível de circuito impresso
JP6293864A JPH07193365A (ja) 1993-11-02 1994-11-01 半田コーティング方法及び該コーティングにおける使用に適切な半田ペースト
CN94118128A CN1108025A (zh) 1993-11-02 1994-11-02 涂敷焊料的方法以及适用于该方法的焊料糊剂

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG1996009384A SG59992A1 (en) 1993-11-02 1993-11-02 Solder-coating method and solder paste suitable for use therein
EP93203059A EP0651600B1 (en) 1993-11-02 1993-11-02 Solder-coating method, and solder paste suitable for use therein

Publications (1)

Publication Number Publication Date
SG59992A1 true SG59992A1 (en) 1999-02-22

Family

ID=26134049

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996009384A SG59992A1 (en) 1993-11-02 1993-11-02 Solder-coating method and solder paste suitable for use therein

Country Status (7)

Country Link
US (1) US5551628A (pt)
EP (1) EP0651600B1 (pt)
JP (1) JPH07193365A (pt)
CN (1) CN1108025A (pt)
BR (1) BR9404291A (pt)
CA (1) CA2134632A1 (pt)
SG (1) SG59992A1 (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69326009T2 (de) * 1993-11-02 2000-02-24 Koninklijke Philips Electronics N.V., Eindhoven Verfahren zur Lotbeschichtung und Lötpaste dafür
TW362342B (en) * 1997-10-27 1999-06-21 Sony Video Taiwan Co Ltd Method for combining e-mail network with pager
JP3422297B2 (ja) * 1999-08-31 2003-06-30 株式会社村田製作所 ペースト塗布方法及びペースト塗布装置
US6369345B1 (en) * 2000-08-18 2002-04-09 Motorola, Inc. Method and apparatus for reflowing solder paste using a light source
US6680457B2 (en) * 2002-01-15 2004-01-20 Agilent Technologies, Inc. Reflowing of solder joints
KR20060069425A (ko) * 2003-07-09 2006-06-21 프라이즈 메탈즈, 인크. 코팅 금속 입자
JP2007243084A (ja) * 2006-03-13 2007-09-20 Ricoh Microelectronics Co Ltd はんだ層形成方法及び電子部品実装方法
JP5430268B2 (ja) * 2008-08-21 2014-02-26 キヤノン株式会社 プリント基板
JP6370619B2 (ja) * 2014-06-26 2018-08-08 日東電工株式会社 回路付サスペンション基板およびその製造方法
CN108702862B (zh) * 2016-02-19 2021-03-09 爱法组装材料公司 具有选择性集成焊料的rf屏蔽件
CN112105172B (zh) * 2020-09-11 2021-11-09 衡阳华灏新材料科技有限公司 一种cof柔性印刷线路板的锡焊油涂抹处理方法
CN115555759B (zh) * 2022-01-18 2024-07-16 上海华庆焊材技术股份有限公司 一种含有垫高球的无残留焊膏及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59136990A (ja) * 1983-01-26 1984-08-06 オムロン株式会社 リフロ−半田付け方法
JPS61264743A (ja) * 1985-05-20 1986-11-22 Matsushita Electric Ind Co Ltd 半導体集積回路への突起電極形成方法
US4607782A (en) * 1985-05-24 1986-08-26 Contact Systems, Inc. Method and apparatus for soldering electrical components to circuit boards
JPH0671134B2 (ja) * 1989-05-26 1994-09-07 古河電気工業株式会社 電子部品表面実装方法
CA2030865C (en) * 1989-11-30 1993-01-12 Kenichi Fuse Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board

Also Published As

Publication number Publication date
JPH07193365A (ja) 1995-07-28
US5551628A (en) 1996-09-03
EP0651600A1 (en) 1995-05-03
CA2134632A1 (en) 1995-05-03
BR9404291A (pt) 1995-06-20
CN1108025A (zh) 1995-09-06
EP0651600B1 (en) 1999-08-11

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