SG59955A1 - Partially polymerized resins - Google Patents

Partially polymerized resins

Info

Publication number
SG59955A1
SG59955A1 SG1996004807A SG1996004807A SG59955A1 SG 59955 A1 SG59955 A1 SG 59955A1 SG 1996004807 A SG1996004807 A SG 1996004807A SG 1996004807 A SG1996004807 A SG 1996004807A SG 59955 A1 SG59955 A1 SG 59955A1
Authority
SG
Singapore
Prior art keywords
partially polymerized
polymerized resins
resins
partially
polymerized
Prior art date
Application number
SG1996004807A
Other languages
English (en)
Inventor
Pamela S Foster
Ernest L Ecker
Edward W Rutter Jr
Eric S Moyer
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of SG59955A1 publication Critical patent/SG59955A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Optical Integrated Circuits (AREA)
  • Polymerisation Methods In General (AREA)
SG1996004807A 1993-04-29 1994-04-25 Partially polymerized resins SG59955A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5499993A 1993-04-29 1993-04-29
US08/224,203 US5854302A (en) 1993-04-29 1994-04-14 Partially polymerized divinylsiloxane linked bisbenzocyclobutene resins and methods for making said resins

Publications (1)

Publication Number Publication Date
SG59955A1 true SG59955A1 (en) 1999-02-22

Family

ID=26733729

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996004807A SG59955A1 (en) 1993-04-29 1994-04-25 Partially polymerized resins

Country Status (9)

Country Link
US (2) US5854302A (ko)
EP (1) EP0700534B1 (ko)
JP (1) JP3839469B2 (ko)
KR (1) KR100305127B1 (ko)
CA (1) CA2159733A1 (ko)
DE (1) DE69424786T2 (ko)
MY (1) MY131673A (ko)
SG (1) SG59955A1 (ko)
WO (1) WO1994025903A1 (ko)

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WO1996031805A1 (en) * 1995-04-03 1996-10-10 The Dow Chemical Company Photodefineable compositions
DE19543540C1 (de) * 1995-11-22 1996-11-21 Siemens Ag Vertikal integriertes Halbleiterbauelement mit zwei miteinander verbundenen Substraten und Herstellungsverfahren dafür
JP3031272B2 (ja) 1996-12-05 2000-04-10 日本電気株式会社 樹脂組成物及びその成形体表面への導体形成方法
US6660875B1 (en) 1998-06-09 2003-12-09 Ppt Technologies, Llc Ion exchange purification of dielectric condensate precursor fluids and silicate esters such as tetraethylorthosilicate (TEOS)
US6361926B1 (en) * 1998-10-23 2002-03-26 The Dow Chemical Company Acid functional polymers based on benzocyclobutene
US6281115B1 (en) * 1998-11-16 2001-08-28 Industrial Technology Research Institute Sidewall protection for a via hole formed in a photosensitive, low dielectric constant layer
TW418475B (en) * 1999-02-22 2001-01-11 Mosel Vitelic Inc Configuration method for thin film cracking parameters and the application using the same
US6235544B1 (en) * 1999-04-20 2001-05-22 International Business Machines Corporation Seed metal delete process for thin film repair solutions using direct UV laser
US6535105B2 (en) 2000-03-30 2003-03-18 Avx Corporation Electronic device and process of making electronic device
CN1447981B (zh) 2000-08-21 2013-08-07 陶氏环球技术公司 微电子装置制造中用于有机聚合物电介质的硬面层的有机硅酸盐树脂
US6617674B2 (en) * 2001-02-20 2003-09-09 Dow Corning Corporation Semiconductor package and method of preparing same
JP2002265762A (ja) * 2001-03-08 2002-09-18 Nippon Kayaku Co Ltd ベンゾシクロブテン樹脂組成物、樹脂結合型金属成型部品
US6919164B2 (en) * 2001-06-08 2005-07-19 The Penn State Research Foundation Patterning compositions using E-beam lithography and structures and devices made thereby
US7019093B2 (en) * 2002-10-18 2006-03-28 Dow Global Technologies Inc. Aqueous developable, photosensitive benzocyclobutene-based oligomers and polymers with high moisture resistance
US20040131970A1 (en) * 2003-01-07 2004-07-08 Meagley Robert P. Photodefinable polymers for semiconductor applications
JP2004221449A (ja) * 2003-01-17 2004-08-05 Sumitomo Metal Mining Co Ltd 多層配線基板およびその製造方法
US7297460B2 (en) * 2003-02-26 2007-11-20 Agfa-Gevaert Radiation curable ink compositions suitable for ink-jet printing
JP4308821B2 (ja) * 2003-07-28 2009-08-05 ダウ・コーニング・コーポレイション パターン形成されたシリコーン層をエッチングする方法
JP4801082B2 (ja) 2004-10-13 2011-10-26 ダウ グローバル テクノロジーズ エルエルシー 湿式現像可能なベンゾシクロブテン系ポリマー組成物及びその組成物の使用方法
DE602005025550D1 (de) 2004-10-13 2011-02-03 Dow Global Technologies Inc Polymerformulierungen auf Benzocyclobutenbasis
CN100374448C (zh) * 2005-12-30 2008-03-12 四川大学 双烯基硅氧烷桥联双苯并环丁烯单体及预聚体的制备方法
DE102007038514A1 (de) * 2007-08-16 2009-02-19 Robert Bosch Gmbh Elektrische Schaltungsanordnung und Verfahren zur Herstellung einer elektrischen Schaltungsanordnung
CN101463042B (zh) * 2007-12-21 2012-01-11 中国科学院化学研究所 一种含硅苯并环丁烯树脂及其中间体与它们的制备方法
CN102448621B (zh) * 2009-04-15 2014-10-29 3M创新有限公司 可减少涂层缺陷的涂布方法和设备
CN102206229A (zh) * 2011-04-14 2011-10-05 西南科技大学 含硅苯并环丁烯单体及其制备方法
CN102516547B (zh) * 2011-11-18 2013-10-16 西南科技大学 苯并环丁烯硅油树脂及其制备方法
US9269623B2 (en) 2012-10-25 2016-02-23 Rohm And Haas Electronic Materials Llc Ephemeral bonding
US9273215B2 (en) 2012-10-30 2016-03-01 Rohm And Haas Electronic Materials Llc Adhesion promoter
US9315696B2 (en) 2013-10-31 2016-04-19 Dow Global Technologies Llc Ephemeral bonding
US9153357B1 (en) 2014-03-27 2015-10-06 Rohm And Haas Electronic Materials Llc Adhesion promoter
US9644118B2 (en) 2015-03-03 2017-05-09 Dow Global Technologies Llc Method of releasably attaching a semiconductor substrate to a carrier
US9296915B1 (en) 2015-04-10 2016-03-29 Dow Global Technologies Llc Toughened arylcyclobutene polymers
US9441055B1 (en) 2015-09-18 2016-09-13 Dow Global Technologies Llc Arylcyclobutenes
US10113024B2 (en) 2015-12-21 2018-10-30 Dow Global Technologies Llc Arylcyclobutenes
US20170174805A1 (en) 2015-12-21 2017-06-22 Dow Global Technologies Llc Arylcyclobutenes
US20190112400A1 (en) 2017-10-12 2019-04-18 Rohm And Haas Electronic Materials Llc Polymers from bis-arylcyclobutene group containing monomers that cure through other groups and methods for making the same
US11817316B2 (en) 2020-05-02 2023-11-14 Rohm And Haas Electronic Materials Llc Coating compositions and methods of forming electronic devices
EP4317339A1 (en) 2021-03-30 2024-02-07 Nissan Chemical Corporation Adhesive composition, laminate, method for manufacturing laminate, and method for manufacturing processed substrate
CN117157738A (zh) 2021-03-31 2023-12-01 日产化学株式会社 层叠体、剥离剂组合物以及经加工的半导体基板的制造方法
EP4306609A1 (en) 2021-03-31 2024-01-17 Nissan Chemical Corporation Laminate, release agent composition, and method for manufacturing processed semiconductor substrate
WO2022210262A1 (ja) 2021-03-31 2022-10-06 日産化学株式会社 積層体、剥離剤組成物及び加工された半導体基板の製造方法
WO2023074324A1 (ja) 2021-10-29 2023-05-04 日産化学株式会社 積層体、剥離剤組成物及び加工された半導体基板の製造方法

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US2852379A (en) * 1955-05-04 1958-09-16 Eastman Kodak Co Azide resin photolithographic composition
US3075950A (en) * 1960-08-04 1963-01-29 Eastman Kodak Co Cross-linked olefinic polymers
US3625919A (en) * 1967-02-10 1971-12-07 Hiroyoshi Kamogawa Process for the preparation of diazotized vinylphenol polymers having phototropic properties
US3948667A (en) * 1971-06-21 1976-04-06 Japan Synthetic Rubber Company Limited Photosensitive compositions
US4197133A (en) * 1977-10-14 1980-04-08 Ciba-Geigy Corporation Photo-curable compositions of matter containing bis-azidophthalimidyl derivatives
DE2948324C2 (de) * 1978-12-01 1993-01-14 Hitachi, Ltd., Tokio/Tokyo Lichtempfindliches Gemisch, enthaltend eine Bisazidverbindung, und Verfahren zur Bildung von Mustern
DE2951101A1 (de) * 1979-12-19 1981-06-25 Merck Patent Gmbh, 6100 Darmstadt Verfahren zur herstellung von azidobenzalverbindungen
JPS5940641A (ja) * 1982-08-31 1984-03-06 Toshiba Corp 高解像度用ネガ型フオトレジスト組成物
EP0119719B1 (en) * 1983-03-03 1987-05-06 Toray Industries, Inc. Radiation sensitive polymer composition
US4571375A (en) * 1983-10-24 1986-02-18 Benedikt George M Ring-opened polynorbornene negative photoresist with bisazide
US4642329A (en) * 1984-08-27 1987-02-10 The Dow Chemical Company Prepolymer processing of arylcyclobutene monomeric compositions
US4540763A (en) * 1984-09-14 1985-09-10 The Dow Chemical Company Polymers derived from poly(arylcyclobutenes)
US4783514A (en) * 1986-02-28 1988-11-08 The Dow Chemical Company Polymeric monoarylcyclobutane compositions
US4812588A (en) * 1987-12-14 1989-03-14 The Dow Chemical Company Polyorganosiloxane-bridged bisbenzocyclobutene monomers
JP2643261B2 (ja) * 1988-03-23 1997-08-20 株式会社日立製作所 ネガ型感光性組成物及びパタン形成方法
US5002808A (en) * 1988-03-23 1991-03-26 The Dow Chemical Company Adhesion methods employing benzocyclobutene-based organosilane adhesion aids
EP0616701B1 (en) * 1991-12-10 2002-02-13 The Dow Chemical Company Photocurable cyclobutarene compositions
US5416233A (en) * 1994-01-25 1995-05-16 The Dow Chemical Company Preparation of vinylsilane-benzocyclobutenes

Also Published As

Publication number Publication date
JP3839469B2 (ja) 2006-11-01
KR960702119A (ko) 1996-03-28
JPH08510273A (ja) 1996-10-29
US5854302A (en) 1998-12-29
WO1994025903A1 (en) 1994-11-10
US5882836A (en) 1999-03-16
EP0700534A1 (en) 1996-03-13
CA2159733A1 (en) 1994-11-10
DE69424786T2 (de) 2000-12-28
EP0700534B1 (en) 2000-05-31
MY131673A (en) 2007-08-30
DE69424786D1 (de) 2000-07-06
KR100305127B1 (ko) 2001-11-22

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