SG47706A1 - A method of bonding a metal by solder - Google Patents

A method of bonding a metal by solder

Info

Publication number
SG47706A1
SG47706A1 SG1996003936A SG1996003936A SG47706A1 SG 47706 A1 SG47706 A1 SG 47706A1 SG 1996003936 A SG1996003936 A SG 1996003936A SG 1996003936 A SG1996003936 A SG 1996003936A SG 47706 A1 SG47706 A1 SG 47706A1
Authority
SG
Singapore
Prior art keywords
solder
bonding
metal
Prior art date
Application number
SG1996003936A
Other languages
English (en)
Inventor
Kazou Fujinami
Teruo Takeuchi
Yoshiaki Inoue
Yoshio Yoshikawa
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of SG47706A1 publication Critical patent/SG47706A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SG1996003936A 1992-06-02 1993-05-26 A method of bonding a metal by solder SG47706A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14182592 1992-06-02

Publications (1)

Publication Number Publication Date
SG47706A1 true SG47706A1 (en) 1998-04-17

Family

ID=15301006

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996003936A SG47706A1 (en) 1992-06-02 1993-05-26 A method of bonding a metal by solder

Country Status (7)

Country Link
US (1) US5305948A (it)
EP (1) EP0574161B1 (it)
KR (1) KR0184606B1 (it)
DE (1) DE69320112T2 (it)
MY (1) MY110342A (it)
SG (1) SG47706A1 (it)
TW (1) TW225999B (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW268913B (it) * 1993-08-30 1996-01-21 Mitsubishi Gas Chemical Co
US5466349A (en) * 1995-01-06 1995-11-14 Rockwell International Corporation Potentiometric evaluation of substrate oxidation and coating porosity
US5866070A (en) * 1995-02-08 1999-02-02 Mitsubishi Gas Chemical Company, Inc. Method for preserving adhesive tape and method for preserving article using the same
WO1996029362A1 (en) * 1995-03-21 1996-09-26 W.R. Grace & Co.-Conn. Methods and compositions for improved initiation of oxygen scavenging
US5778638A (en) * 1996-03-06 1998-07-14 Mitsubishi Gas Chemical Company, Inc. Process for preserving solder paste
US5853662A (en) * 1996-04-17 1998-12-29 Mitsubishi Gas Chemical Company, Inc. Method for preserving polished inorganic glass and method for preserving article obtained by using the same
CN101239423B (zh) * 2007-11-24 2013-03-20 美的集团股份有限公司 铁素体不锈钢在焊接中的防锈工艺

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3086893A (en) * 1960-10-20 1963-04-23 Nat Lead Co Rosin and bromonated diphenolic acid flux
US3973322A (en) * 1974-05-13 1976-08-10 Hollis Engineering, Inc. Mass soldering system and method
JPS5548468A (en) * 1978-09-09 1980-04-07 Kobe Steel Ltd Manufacture of compound metal material
US4495007A (en) * 1984-03-12 1985-01-22 At&T Technologies, Inc. Soldering flux
JPS6260936A (ja) * 1985-09-09 1987-03-17 Toyota Motor Corp 内燃機関の出力制御装置
KR960015106B1 (ko) * 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체패키지 포장체
US4908151A (en) * 1987-02-14 1990-03-13 Mitsubishi Gas Chemical Co., Inc. Oxygen absorbent
JP2850405B2 (ja) * 1989-10-23 1999-01-27 三菱瓦斯化学株式会社 半導体または半導体部品の保存方法
JP2881849B2 (ja) * 1989-10-23 1999-04-12 三菱瓦斯化学株式会社 防錆剤包装体
JP3134291B2 (ja) * 1990-05-25 2001-02-13 三菱瓦斯化学株式会社 酸素吸収用組成物
JPH04268085A (ja) * 1991-02-22 1992-09-24 Mitsubishi Gas Chem Co Inc 被酸化性粉体の保存方法
JPH04297588A (ja) * 1991-03-27 1992-10-21 Mitsubishi Gas Chem Co Inc 金属および金属を含む製品の保存方法と保存形態
MY131565A (en) * 1990-04-25 2007-08-30 Mitsubishi Gas Chemical Co Oxygen absorbent composition and method of preserving article with same

Also Published As

Publication number Publication date
DE69320112T2 (de) 1999-03-11
EP0574161B1 (en) 1998-08-05
EP0574161A1 (en) 1993-12-15
KR940005345A (ko) 1994-03-21
TW225999B (it) 1994-07-01
US5305948A (en) 1994-04-26
KR0184606B1 (ko) 1999-04-01
DE69320112D1 (de) 1998-09-10
MY110342A (en) 1998-04-30

Similar Documents

Publication Publication Date Title
ZA944186B (en) A method of brazing
HK1006377A1 (en) Permanent metallic bonding method
SG69090G (en) Method of forming solder film
GB2250940B (en) Method of explosively bonding composite metal structures
ZA917800B (en) Method of welding a first to a second metal plate
GB2244226B (en) Method of explosively bonding composite metal structures
EP0447820A3 (en) Method of making a composite metal wire
EP0749157A3 (en) Solder connection process
GB2228015B (en) A method of manufacturing an intermetallic compound
SG47706A1 (en) A method of bonding a metal by solder
EP0422612A3 (en) Method of brazing metal members
GB2232626B (en) A method of welding
SG44413A1 (en) A method for bonding a member having metal
AU4826693A (en) A method of producing sintered alloy steel components
GB2264662B (en) A solder joint
AU108971S (en) A set of soldering heads for a soldering iron
SG44517A1 (en) Method of forming solder mask
GB9206571D0 (en) Method of joining metals using a zinc based solder alloy
GB8929304D0 (en) Improved method of metallic bonding
EP0458348A3 (en) Method of integrally bonding a plurality of metal members
GB2287206B (en) Soldering method
GB8824136D0 (en) Method of soldering & solders
PL296060A1 (en) Method of obtaining a potassium-bismuth-graphite compound
PL296552A1 (en) Method of making metal heel-taps
GB9221618D0 (en) Metal joining processes