GB8929304D0 - Improved method of metallic bonding - Google Patents

Improved method of metallic bonding

Info

Publication number
GB8929304D0
GB8929304D0 GB8929304A GB8929304A GB8929304D0 GB 8929304 D0 GB8929304 D0 GB 8929304D0 GB 8929304 A GB8929304 A GB 8929304A GB 8929304 A GB8929304 A GB 8929304A GB 8929304 D0 GB8929304 D0 GB 8929304D0
Authority
GB
United Kingdom
Prior art keywords
improved method
metallic bonding
metallic
bonding
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8929304A
Other versions
GB2239416A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ITT Industries Ltd
Original Assignee
ITT Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ITT Industries Ltd filed Critical ITT Industries Ltd
Priority to GB8929304A priority Critical patent/GB2239416A/en
Publication of GB8929304D0 publication Critical patent/GB8929304D0/en
Priority to DE19904039787 priority patent/DE4039787A1/en
Publication of GB2239416A publication Critical patent/GB2239416A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
GB8929304A 1989-12-29 1989-12-29 Metal bonding method Withdrawn GB2239416A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB8929304A GB2239416A (en) 1989-12-29 1989-12-29 Metal bonding method
DE19904039787 DE4039787A1 (en) 1989-12-29 1990-12-13 METHOD AND DEVICE FOR PRODUCING A METALLIC CONNECTION AND CIRCUIT BOARD THEREFORE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8929304A GB2239416A (en) 1989-12-29 1989-12-29 Metal bonding method

Publications (2)

Publication Number Publication Date
GB8929304D0 true GB8929304D0 (en) 1990-02-28
GB2239416A GB2239416A (en) 1991-07-03

Family

ID=10668569

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8929304A Withdrawn GB2239416A (en) 1989-12-29 1989-12-29 Metal bonding method

Country Status (2)

Country Link
DE (1) DE4039787A1 (en)
GB (1) GB2239416A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5311405A (en) * 1993-08-02 1994-05-10 Motorola, Inc. Method and apparatus for aligning and attaching a surface mount component
DE19813932A1 (en) * 1998-03-28 1999-09-30 Wuerth Elektronik Gmbh & Co Kg Fastening arrangement of a connector on a circuit board
DE10255088B4 (en) * 2002-11-22 2004-09-23 Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. Method and device for making soldered connections

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8522429D0 (en) * 1985-09-10 1985-10-16 Plessey Co Plc Alignment for hybrid device

Also Published As

Publication number Publication date
DE4039787A1 (en) 1991-07-04
GB2239416A (en) 1991-07-03

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)