DE69320112D1 - Verfahren zum Verbinden von Metallen durch Weichlöten - Google Patents

Verfahren zum Verbinden von Metallen durch Weichlöten

Info

Publication number
DE69320112D1
DE69320112D1 DE69320112T DE69320112T DE69320112D1 DE 69320112 D1 DE69320112 D1 DE 69320112D1 DE 69320112 T DE69320112 T DE 69320112T DE 69320112 T DE69320112 T DE 69320112T DE 69320112 D1 DE69320112 D1 DE 69320112D1
Authority
DE
Germany
Prior art keywords
soft soldering
joining metals
joining
metals
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69320112T
Other languages
English (en)
Other versions
DE69320112T2 (de
Inventor
Yoshio Yoshikawa
Yoshiaki Inoue
Teruo Takeuchi
Kazuo Fujinami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of DE69320112D1 publication Critical patent/DE69320112D1/de
Application granted granted Critical
Publication of DE69320112T2 publication Critical patent/DE69320112T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
DE69320112T 1992-06-02 1993-05-26 Verfahren zum Verbinden von Metallen durch Weichlöten Expired - Fee Related DE69320112T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14182592 1992-06-02

Publications (2)

Publication Number Publication Date
DE69320112D1 true DE69320112D1 (de) 1998-09-10
DE69320112T2 DE69320112T2 (de) 1999-03-11

Family

ID=15301006

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69320112T Expired - Fee Related DE69320112T2 (de) 1992-06-02 1993-05-26 Verfahren zum Verbinden von Metallen durch Weichlöten

Country Status (7)

Country Link
US (1) US5305948A (de)
EP (1) EP0574161B1 (de)
KR (1) KR0184606B1 (de)
DE (1) DE69320112T2 (de)
MY (1) MY110342A (de)
SG (1) SG47706A1 (de)
TW (1) TW225999B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW268913B (de) * 1993-08-30 1996-01-21 Mitsubishi Gas Chemical Co
US5466349A (en) * 1995-01-06 1995-11-14 Rockwell International Corporation Potentiometric evaluation of substrate oxidation and coating porosity
US5866070A (en) * 1995-02-08 1999-02-02 Mitsubishi Gas Chemical Company, Inc. Method for preserving adhesive tape and method for preserving article using the same
WO1996029362A1 (en) * 1995-03-21 1996-09-26 W.R. Grace & Co.-Conn. Methods and compositions for improved initiation of oxygen scavenging
US5778638A (en) * 1996-03-06 1998-07-14 Mitsubishi Gas Chemical Company, Inc. Process for preserving solder paste
US5853662A (en) * 1996-04-17 1998-12-29 Mitsubishi Gas Chemical Company, Inc. Method for preserving polished inorganic glass and method for preserving article obtained by using the same
CN101239423B (zh) * 2007-11-24 2013-03-20 美的集团股份有限公司 铁素体不锈钢在焊接中的防锈工艺

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3086893A (en) * 1960-10-20 1963-04-23 Nat Lead Co Rosin and bromonated diphenolic acid flux
US3973322A (en) * 1974-05-13 1976-08-10 Hollis Engineering, Inc. Mass soldering system and method
JPS5548468A (en) * 1978-09-09 1980-04-07 Kobe Steel Ltd Manufacture of compound metal material
US4495007A (en) * 1984-03-12 1985-01-22 At&T Technologies, Inc. Soldering flux
JPS6260936A (ja) * 1985-09-09 1987-03-17 Toyota Motor Corp 内燃機関の出力制御装置
KR960015106B1 (ko) * 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체패키지 포장체
DE3804488A1 (de) * 1987-02-14 1988-08-25 Mitsubishi Gas Chemical Co Sauerstoffabsorptionsmittel
JP2850405B2 (ja) * 1989-10-23 1999-01-27 三菱瓦斯化学株式会社 半導体または半導体部品の保存方法
JP2881849B2 (ja) * 1989-10-23 1999-04-12 三菱瓦斯化学株式会社 防錆剤包装体
JPH04268085A (ja) * 1991-02-22 1992-09-24 Mitsubishi Gas Chem Co Inc 被酸化性粉体の保存方法
JPH04297588A (ja) * 1991-03-27 1992-10-21 Mitsubishi Gas Chem Co Inc 金属および金属を含む製品の保存方法と保存形態
MY106162A (en) * 1990-04-25 1995-03-31 Mitsubishi Gas Chemical Co Oxygen absorbent composition and method of preserving article with same.
JP3134291B2 (ja) * 1990-05-25 2001-02-13 三菱瓦斯化学株式会社 酸素吸収用組成物

Also Published As

Publication number Publication date
TW225999B (de) 1994-07-01
US5305948A (en) 1994-04-26
MY110342A (en) 1998-04-30
EP0574161A1 (de) 1993-12-15
SG47706A1 (en) 1998-04-17
KR940005345A (ko) 1994-03-21
DE69320112T2 (de) 1999-03-11
EP0574161B1 (de) 1998-08-05
KR0184606B1 (ko) 1999-04-01

Similar Documents

Publication Publication Date Title
DE69516741D1 (de) Verfahren zum Mikroätzen von Kupfer- oder Kupferlegierungsoberflächen
DE69430275D1 (de) Verfahren zum Verbinden von Metallstücken
DE69301060T2 (de) Verfahren zum Aufbringen von Lot
DE69310845D1 (de) Verfahren zum Hartlöten von Aluminium-Gegenständen
AT399887B (de) Verfahren zum herstellen von kaltgepressten eisenhältigen briketts
DE69407933T2 (de) Verfahren zum Rohrverbinden durch TIG Schweissen
DE69211850D1 (de) Verfahren zum löten
DE59206321D1 (de) Verfahren zum phosphatieren von metalloberflächen
DE69203655T2 (de) Verfahren zum Schweissen von Kupferteilen.
DE58907246D1 (de) Verfahren und Vorrichtung zum Schweissen von metallischen Werkstücken durch Ultraschall.
DE69322994T2 (de) Verfahren zum Löten
DE69320112T2 (de) Verfahren zum Verbinden von Metallen durch Weichlöten
DE69027072D1 (de) Verfahren zum Schweissen durch Lichtbogenablenkung
DE69226040D1 (de) Verfahren zum Schweissen von Aluminiumlegierungen
DE69008989D1 (de) Verfahren zum Hartlöten von Metallteilen.
DE59501663D1 (de) Verfahren zum verschweissen von werkstücken
DE69327486D1 (de) Verfahren zum Extrahieren von Metallen
DE3484387D1 (de) Verfahren zum verformen von metall.
DE69203074T2 (de) Verfahren zum Verbindung von Bauelementen durch Laserlöten.
DE69204151T2 (de) Verfahren zum Schweissen oder Hartlöten von stark oxidierbaren Metalle.
DE59402842D1 (de) Verfahren zum schweissen
DE69408508D1 (de) Verfahren zum Verbinden von Titan-Aluminium intermetallische Verbindungen
DE69428752D1 (de) Verfahren zum Verbinden von Metal enthaltenden Gegenständen
AT378005B (de) Verfahren zum desoxidieren von metallschmelzen
DE69302105D1 (de) Verfahren zum Löten von Rohren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee