SG47138A1 - Resin encapsulating mold die for manufacturing a semiconductor device - Google Patents

Resin encapsulating mold die for manufacturing a semiconductor device

Info

Publication number
SG47138A1
SG47138A1 SG1996009780A SG1996009780A SG47138A1 SG 47138 A1 SG47138 A1 SG 47138A1 SG 1996009780 A SG1996009780 A SG 1996009780A SG 1996009780 A SG1996009780 A SG 1996009780A SG 47138 A1 SG47138 A1 SG 47138A1
Authority
SG
Singapore
Prior art keywords
manufacturing
semiconductor device
mold die
resin encapsulating
encapsulating mold
Prior art date
Application number
SG1996009780A
Other languages
English (en)
Inventor
Noriaki Higuchi
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of SG47138A1 publication Critical patent/SG47138A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/047—Seal ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
SG1996009780A 1995-10-23 1996-05-08 Resin encapsulating mold die for manufacturing a semiconductor device SG47138A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7274202A JPH09115936A (ja) 1995-10-23 1995-10-23 半導体装置の樹脂封止用金型

Publications (1)

Publication Number Publication Date
SG47138A1 true SG47138A1 (en) 1998-03-20

Family

ID=17538464

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996009780A SG47138A1 (en) 1995-10-23 1996-05-08 Resin encapsulating mold die for manufacturing a semiconductor device

Country Status (6)

Country Link
US (1) US5645864A (ko)
JP (1) JPH09115936A (ko)
KR (1) KR100208768B1 (ko)
CN (1) CN1080934C (ko)
SG (1) SG47138A1 (ko)
TW (1) TW363258B (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3483994B2 (ja) * 1995-08-31 2004-01-06 ローム株式会社 樹脂パッケージ型半導体装置の成形用金型装置、および半導体装置の樹脂パッケージング方法
US5929511A (en) * 1996-07-15 1999-07-27 Matsushita Electronics Corporation Lead frame for resin sealed semiconductor device
US5971734A (en) * 1996-09-21 1999-10-26 Anam Semiconductor Inc. Mold for ball grid array semiconductor package
US6015280A (en) * 1997-04-28 2000-01-18 Advanced Micro Devices Apparatus for reducing warping of plastic packages
US6214273B1 (en) * 1997-09-30 2001-04-10 Texas Instruments Incorporated Molding method with the use of modified runners
JPH11284002A (ja) * 1998-03-31 1999-10-15 Sumitomo Heavy Ind Ltd 半導体素子の樹脂封止装置
KR200291282Y1 (ko) * 1999-04-14 2002-10-14 앰코 테크놀로지 코리아 주식회사 반도체패키지용 인쇄회로기판
US6856006B2 (en) 2002-03-28 2005-02-15 Siliconix Taiwan Ltd Encapsulation method and leadframe for leadless semiconductor packages
JP3660861B2 (ja) * 2000-08-18 2005-06-15 株式会社ルネサステクノロジ 半導体装置の製造方法
KR100555495B1 (ko) * 2003-02-08 2006-03-03 삼성전자주식회사 칩 어레이 몰딩용 몰드 다이, 그것을 포함하는 몰딩 장치및 칩 어레이 몰딩 방법
US7618249B2 (en) * 2006-09-22 2009-11-17 Asm Technology Singapore Pte Ltd. Memory card molding apparatus and process
CN102903643B (zh) * 2012-07-07 2016-08-10 上海鼎虹电子有限公司 电子元件封装装置
US20160257117A1 (en) 2013-10-28 2016-09-08 Hewlett-Packard Development Company, L.P. Encapsulating a Bonded Wire with Low Profile Encapsulation
JP7492263B2 (ja) * 2021-06-24 2024-05-29 アピックヤマダ株式会社 圧縮成形装置及び圧縮成形方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1271833A (en) * 1968-07-10 1972-04-26 Hitachi Ltd Improvements in or relating to encapsulation processes
JPH0719785B2 (ja) * 1985-11-30 1995-03-06 ローム株式会社 半導体装置の樹脂モールド方法
JPH0364035A (ja) * 1989-08-02 1991-03-19 Hitachi Ltd 半導体装置製造装置
KR920005035Y1 (ko) * 1989-11-28 1992-07-25 현대전자산업 주식회사 리드프레임
JP2564707B2 (ja) * 1991-01-09 1996-12-18 ローム株式会社 電子部品用リードフレームにおけるモールド部のマルチ式成形方法及び成形装置
US5214846A (en) * 1991-04-24 1993-06-01 Sony Corporation Packaging of semiconductor chips
JP3411332B2 (ja) * 1993-07-07 2003-05-26 本田技研工業株式会社 射出成形金型

Also Published As

Publication number Publication date
CN1148730A (zh) 1997-04-30
KR100208768B1 (ko) 1999-07-15
KR970024040A (ko) 1997-05-30
JPH09115936A (ja) 1997-05-02
US5645864A (en) 1997-07-08
TW363258B (en) 1999-07-01
CN1080934C (zh) 2002-03-13

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