SG45181A1 - Teaching method and system for mounted component inspection - Google Patents

Teaching method and system for mounted component inspection

Info

Publication number
SG45181A1
SG45181A1 SG1996001031A SG1996001031A SG45181A1 SG 45181 A1 SG45181 A1 SG 45181A1 SG 1996001031 A SG1996001031 A SG 1996001031A SG 1996001031 A SG1996001031 A SG 1996001031A SG 45181 A1 SG45181 A1 SG 45181A1
Authority
SG
Singapore
Prior art keywords
mounted component
component inspection
teaching method
teaching
inspection
Prior art date
Application number
SG1996001031A
Other languages
English (en)
Inventor
Shigeki Kobayashi
Norihito Yamamoto
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3206272A external-priority patent/JPH0526815A/ja
Priority claimed from JP3214358A external-priority patent/JP2570239B2/ja
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of SG45181A1 publication Critical patent/SG45181A1/en

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41805—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by assembly
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31027—Computer assisted manual assembly CAA, display operation, tool, result
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31047—Display image of finished workpiece on screen, show how, where to mount next part
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32186—Teaching inspection data, pictures and criteria and apply them for inspection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG1996001031A 1991-07-22 1992-07-21 Teaching method and system for mounted component inspection SG45181A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3206272A JPH0526815A (ja) 1991-07-22 1991-07-22 実装部品検査用データの教示方法
JP3214358A JP2570239B2 (ja) 1991-07-30 1991-07-30 実装部品検査用データ生成方法およびその方法の実施に用いられる実装部品検査装置

Publications (1)

Publication Number Publication Date
SG45181A1 true SG45181A1 (en) 1998-01-16

Family

ID=26515549

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996001031A SG45181A1 (en) 1991-07-22 1992-07-21 Teaching method and system for mounted component inspection

Country Status (4)

Country Link
US (1) US5822449A (fr)
EP (1) EP0526080B1 (fr)
DE (1) DE69214225T2 (fr)
SG (1) SG45181A1 (fr)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0985991A3 (fr) * 1991-11-07 2000-05-31 Omron Corporation Appareil et méthode de correction automatique du soudage
US5717456A (en) * 1995-03-06 1998-02-10 Champion International Corporation System for monitoring a continuous manufacturing process
JPH10143660A (ja) * 1996-11-11 1998-05-29 Hitachi Ltd 欠陥判定処理方法およびその装置
JPH10141929A (ja) * 1996-11-12 1998-05-29 Hitachi Ltd はんだ付け検査装置
US6272018B1 (en) * 1999-02-11 2001-08-07 Original Solutions Inc. Method for the verification of the polarity and presence of components on a printed circuit board
US6496270B1 (en) 2000-02-17 2002-12-17 Gsi Lumonics, Inc. Method and system for automatically generating reference height data for use in a three-dimensional inspection system
SE516239C2 (sv) 2000-04-28 2001-12-03 Mydata Automation Ab Metod och anordning för bestämning av nominella data för elektroniska kretsar, genom att ta en digital bild och jämföra med lagrade nominella data.
JP3877501B2 (ja) * 2000-07-07 2007-02-07 松下電器産業株式会社 部品認識データ作成方法及び作成装置並びに電子部品実装装置及び記録媒体
DE10152408A1 (de) * 2000-10-25 2002-05-16 Matsushita Electric Ind Co Ltd System und Verfahren zur Bauteilmontage
JP2003058601A (ja) * 2001-08-14 2003-02-28 Matsushita Electric Ind Co Ltd 画像処理装置用教示データの配送方法及びシステム
US7151850B2 (en) * 2001-10-30 2006-12-19 Matsushita Electric Industrial Co., Ltd. Apparatus and method for setting teaching data, teaching data providing system over network
JP3551188B2 (ja) * 2002-01-10 2004-08-04 オムロン株式会社 表面状態検査方法および基板検査装置
KR100486410B1 (ko) * 2002-04-29 2005-04-29 주식회사 미르기술 회로기판 검사장치용 자동티칭방법
JP3870872B2 (ja) * 2002-08-06 2007-01-24 オムロン株式会社 検査データ作成方法およびこの方法を用いた基板検査装置
JP4255267B2 (ja) * 2002-11-22 2009-04-15 富士機械製造株式会社 作業プログラム適否判定装置を含む対基板作業システムおよび作業プログラム適否判定プログラム
JP3867724B2 (ja) * 2004-02-27 2007-01-10 オムロン株式会社 表面状態検査方法およびその方法を用いた表面状態検査装置ならびに基板検査装置
JP4423130B2 (ja) * 2004-07-30 2010-03-03 富士通株式会社 プリント回路基板外観検査方法、プリント回路基板外観検査プログラム及びプリント回路基板外観検査装置
JP4941422B2 (ja) * 2008-07-14 2012-05-30 パナソニック株式会社 部品実装システム
US7880900B2 (en) * 2008-08-19 2011-02-01 Silverbrook Research Pty Ltd Measuring apparatus for performing positional analysis on an integrated circuit carrier
US20100045729A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Method for testing alignment of a test bed with a plurality of integrated circuits thereon
US20100044437A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Measuring apparatus for a carrier of printhead integrated circuitry
US7924440B2 (en) * 2008-08-19 2011-04-12 Silverbrook Research Pty Ltd Imaging apparatus for imaging integrated circuits on an integrated circuit carrier
US20120050522A1 (en) * 2010-08-24 2012-03-01 Research In Motion Limited Method of and apparatus for verifying assembly components of a mobile device
JP5958160B2 (ja) * 2012-08-03 2016-07-27 オムロン株式会社 部品実装検査のための検査基準情報の設定方法および検査基準情報の作成システム
US9513230B2 (en) 2012-12-14 2016-12-06 Kla-Tencor Corporation Apparatus and method for optical inspection, magnetic field and height mapping
JP6524418B2 (ja) * 2016-02-04 2019-06-05 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法
US11282187B2 (en) * 2019-08-19 2022-03-22 Ricoh Company, Ltd. Inspection system, inspection apparatus, and method using multiple angle illumination

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3506237C2 (de) * 1985-02-22 1987-04-09 Gunter 1000 Berlin Simon Vorrichtung zur Kontrolle von Leiterplattenlayouts
EP0236738A3 (fr) * 1986-02-05 1988-12-21 OMRON Corporation Procédé d'entrée de dates d'une plaque à circuits imprimés équipée de référence pour le traitement d'images d'un appareil d'inspection automatique de plaques à circuits imprimés équipées
US4953100A (en) * 1986-10-03 1990-08-28 Omron Tateisi Electronics Co. Apparatus for inspecting packaged electronic device
US4978224A (en) * 1987-07-14 1990-12-18 Sharp Kabushiki Kaisha Method of and apparatus for inspecting mounting of chip components
JPH0737892B2 (ja) * 1988-01-12 1995-04-26 大日本スクリーン製造株式会社 パターン欠陥検査方法
DE68929481T2 (de) * 1988-05-09 2004-06-09 Omron Corp. Vorrichtung und Verfahren zur Anzeige der Ergebnisse einer Leiterplattenprüfung
EP0355377B1 (fr) * 1988-08-05 1994-01-26 Siemens Aktiengesellschaft Méthode d'essai optique d'assemblages plats de composants électroniques
JP3092809B2 (ja) * 1989-12-21 2000-09-25 株式会社日立製作所 検査方法、並びに検査プログラムデータの自動作成機能を有する検査装置
US5058178A (en) * 1989-12-21 1991-10-15 At&T Bell Laboratories Method and apparatus for inspection of specular, three-dimensional features
JP2691789B2 (ja) * 1990-03-08 1997-12-17 三菱電機株式会社 はんだ印刷検査装置
US5086477A (en) * 1990-08-07 1992-02-04 Northwest Technology Corp. Automated system for extracting design and layout information from an integrated circuit

Also Published As

Publication number Publication date
EP0526080B1 (fr) 1996-10-02
US5822449A (en) 1998-10-13
DE69214225D1 (de) 1996-11-07
EP0526080A3 (en) 1993-03-31
DE69214225T2 (de) 1997-03-06
EP0526080A2 (fr) 1993-02-03

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