SG194560A1 - Laminated polishing pad - Google Patents
Laminated polishing pad Download PDFInfo
- Publication number
- SG194560A1 SG194560A1 SG2013078175A SG2013078175A SG194560A1 SG 194560 A1 SG194560 A1 SG 194560A1 SG 2013078175 A SG2013078175 A SG 2013078175A SG 2013078175 A SG2013078175 A SG 2013078175A SG 194560 A1 SG194560 A1 SG 194560A1
- Authority
- SG
- Singapore
- Prior art keywords
- layer
- polishing
- adhesive
- polishing pad
- laminated
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 335
- 239000010410 layer Substances 0.000 claims abstract description 211
- 239000012790 adhesive layer Substances 0.000 claims abstract description 74
- 239000004831 Hot glue Substances 0.000 claims abstract description 64
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011095270 | 2011-04-21 | ||
JP2011197277 | 2011-09-09 | ||
JP2012084023A JP5893479B2 (ja) | 2011-04-21 | 2012-04-02 | 積層研磨パッド |
PCT/JP2012/059910 WO2012144388A1 (ja) | 2011-04-21 | 2012-04-11 | 積層研磨パッド |
Publications (1)
Publication Number | Publication Date |
---|---|
SG194560A1 true SG194560A1 (en) | 2013-12-30 |
Family
ID=47041499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013078175A SG194560A1 (en) | 2011-04-21 | 2012-04-11 | Laminated polishing pad |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140065932A1 (zh) |
JP (1) | JP5893479B2 (zh) |
KR (1) | KR101572464B1 (zh) |
CN (1) | CN103476546A (zh) |
SG (1) | SG194560A1 (zh) |
TW (1) | TWI457201B (zh) |
WO (1) | WO2012144388A1 (zh) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014094424A (ja) * | 2012-11-08 | 2014-05-22 | Toyo Tire & Rubber Co Ltd | 積層研磨パッド |
US9238295B2 (en) * | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical window polishing pad |
JP6380977B2 (ja) * | 2014-08-29 | 2018-08-29 | サトーホールディングス株式会社 | 弾性体ローラー |
US9873180B2 (en) * | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
MY182511A (en) * | 2014-10-14 | 2021-01-25 | Hoya Corp | Method for manufacturing magnetic-disk substrate, method for manufacturing magnetic disk, raw material for polishing pad, and method for manufacturing substrate |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
KR102436416B1 (ko) | 2014-10-17 | 2022-08-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 cmp 패드 구성 |
US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
CN105619237B (zh) * | 2014-11-28 | 2018-07-27 | 浙江华正新材料股份有限公司 | 一种无腊抛光吸附垫及其制造方法 |
US10618141B2 (en) | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
US9868185B2 (en) * | 2015-11-03 | 2018-01-16 | Cabot Microelectronics Corporation | Polishing pad with foundation layer and window attached thereto |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US10213894B2 (en) | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
KR101781938B1 (ko) * | 2016-08-04 | 2017-09-26 | 주식회사 휴비스 | 폴리에스테르계 핫멜트 접착파우더 |
WO2018028849A1 (de) * | 2016-08-10 | 2018-02-15 | Klingspor Ag | Schruppscheibe mit trägerschicht |
TWI626117B (zh) * | 2017-01-19 | 2018-06-11 | 智勝科技股份有限公司 | 研磨墊及研磨方法 |
US20180345449A1 (en) * | 2017-06-06 | 2018-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
KR101890331B1 (ko) * | 2017-10-16 | 2018-08-21 | 에스케이씨 주식회사 | 누수 방지된 연마패드 및 이의 제조방법 |
CN109202693B (zh) | 2017-10-16 | 2021-10-12 | Skc索密思株式会社 | 防泄漏抛光垫及其制造方法 |
CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
CN112930584A (zh) * | 2018-11-12 | 2021-06-08 | 昭和电工材料株式会社 | 半导体装置的制造方法及半导体晶圆加工用胶黏膜 |
KR102202076B1 (ko) * | 2018-12-26 | 2021-01-12 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
CN113382824A (zh) * | 2019-03-20 | 2021-09-10 | 丸石产业株式会社 | 研磨装置用的平台及研磨装置和研磨方法 |
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CN112238670B (zh) * | 2020-10-16 | 2022-11-15 | 上海江丰平芯电子科技有限公司 | 一种研磨垫的制备方法 |
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CN113211337B (zh) * | 2021-05-18 | 2023-04-07 | 南通大学 | 超硬衬底片抛光用抛光盘的制备方法及精密抛光方法 |
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JP5254727B2 (ja) * | 2008-09-29 | 2013-08-07 | 富士紡ホールディングス株式会社 | 研磨パッド |
US8393940B2 (en) * | 2010-04-16 | 2013-03-12 | Applied Materials, Inc. | Molding windows in thin pads |
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2012
- 2012-04-02 JP JP2012084023A patent/JP5893479B2/ja not_active Expired - Fee Related
- 2012-04-11 CN CN201280018985XA patent/CN103476546A/zh active Pending
- 2012-04-11 WO PCT/JP2012/059910 patent/WO2012144388A1/ja active Application Filing
- 2012-04-11 US US14/111,503 patent/US20140065932A1/en not_active Abandoned
- 2012-04-11 SG SG2013078175A patent/SG194560A1/en unknown
- 2012-04-11 KR KR1020137022306A patent/KR101572464B1/ko active IP Right Grant
- 2012-04-16 TW TW101113451A patent/TWI457201B/zh not_active IP Right Cessation
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WO2012144388A1 (ja) | 2012-10-26 |
TW201302380A (zh) | 2013-01-16 |
JP2013066993A (ja) | 2013-04-18 |
CN103476546A (zh) | 2013-12-25 |
US20140065932A1 (en) | 2014-03-06 |
JP5893479B2 (ja) | 2016-03-23 |
TWI457201B (zh) | 2014-10-21 |
KR101572464B1 (ko) | 2015-11-27 |
KR20130119487A (ko) | 2013-10-31 |
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