SG194560A1 - Laminated polishing pad - Google Patents
Laminated polishing pad Download PDFInfo
- Publication number
- SG194560A1 SG194560A1 SG2013078175A SG2013078175A SG194560A1 SG 194560 A1 SG194560 A1 SG 194560A1 SG 2013078175 A SG2013078175 A SG 2013078175A SG 2013078175 A SG2013078175 A SG 2013078175A SG 194560 A1 SG194560 A1 SG 194560A1
- Authority
- SG
- Singapore
- Prior art keywords
- layer
- polishing
- adhesive
- polishing pad
- laminated
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 335
- 239000010410 layer Substances 0.000 claims abstract description 211
- 239000012790 adhesive layer Substances 0.000 claims abstract description 74
- 239000004831 Hot glue Substances 0.000 claims abstract description 64
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- FBPFZTCFMRRESA-GUCUJZIJSA-N galactitol Chemical compound OC[C@H](O)[C@@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-GUCUJZIJSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 125000001072 heteroaryl group Chemical group 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
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- FSWDLYNGJBGFJH-UHFFFAOYSA-N n,n'-di-2-butyl-1,4-phenylenediamine Chemical compound CCC(C)NC1=CC=C(NC(C)CC)C=C1 FSWDLYNGJBGFJH-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
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- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011095270 | 2011-04-21 | ||
| JP2011197277 | 2011-09-09 | ||
| JP2012084023A JP5893479B2 (ja) | 2011-04-21 | 2012-04-02 | 積層研磨パッド |
| PCT/JP2012/059910 WO2012144388A1 (ja) | 2011-04-21 | 2012-04-11 | 積層研磨パッド |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG194560A1 true SG194560A1 (en) | 2013-12-30 |
Family
ID=47041499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013078175A SG194560A1 (en) | 2011-04-21 | 2012-04-11 | Laminated polishing pad |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140065932A1 (zh) |
| JP (1) | JP5893479B2 (zh) |
| KR (1) | KR101572464B1 (zh) |
| CN (1) | CN103476546A (zh) |
| SG (1) | SG194560A1 (zh) |
| TW (1) | TWI457201B (zh) |
| WO (1) | WO2012144388A1 (zh) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014094424A (ja) * | 2012-11-08 | 2014-05-22 | Toyo Tire & Rubber Co Ltd | 積層研磨パッド |
| US9238295B2 (en) * | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical window polishing pad |
| JP6380977B2 (ja) * | 2014-08-29 | 2018-08-29 | サトーホールディングス株式会社 | 弾性体ローラー |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| MY182511A (en) * | 2014-10-14 | 2021-01-25 | Hoya Corp | Method for manufacturing magnetic-disk substrate, method for manufacturing magnetic disk, raw material for polishing pad, and method for manufacturing substrate |
| KR102295988B1 (ko) | 2014-10-17 | 2021-09-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성 |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| CN105619237B (zh) * | 2014-11-28 | 2018-07-27 | 浙江华正新材料股份有限公司 | 一种无腊抛光吸附垫及其制造方法 |
| US10618141B2 (en) | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
| US9868185B2 (en) * | 2015-11-03 | 2018-01-16 | Cabot Microelectronics Corporation | Polishing pad with foundation layer and window attached thereto |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
| KR101781938B1 (ko) * | 2016-08-04 | 2017-09-26 | 주식회사 휴비스 | 폴리에스테르계 핫멜트 접착파우더 |
| EP3496897A1 (de) * | 2016-08-10 | 2019-06-19 | Klingspor AG | Schruppscheibe mit trägerschicht |
| TWI626117B (zh) * | 2017-01-19 | 2018-06-11 | 智勝科技股份有限公司 | 研磨墊及研磨方法 |
| US20180345449A1 (en) * | 2017-06-06 | 2018-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| CN109202693B (zh) | 2017-10-16 | 2021-10-12 | Skc索密思株式会社 | 防泄漏抛光垫及其制造方法 |
| KR101890331B1 (ko) * | 2017-10-16 | 2018-08-21 | 에스케이씨 주식회사 | 누수 방지된 연마패드 및 이의 제조방법 |
| JP7299970B2 (ja) | 2018-09-04 | 2023-06-28 | アプライド マテリアルズ インコーポレイテッド | 改良型研磨パッドのための配合物 |
| CN112930584A (zh) * | 2018-11-12 | 2021-06-08 | 昭和电工材料株式会社 | 半导体装置的制造方法及半导体晶圆加工用胶黏膜 |
| KR102202076B1 (ko) * | 2018-12-26 | 2021-01-12 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| CN113382824A (zh) * | 2019-03-20 | 2021-09-10 | 丸石产业株式会社 | 研磨装置用的平台及研磨装置和研磨方法 |
| US11207757B2 (en) * | 2019-06-17 | 2021-12-28 | Skc Solmics Co., Ltd. | Composition for polishing pad, polishing pad and preparation method of semiconductor device |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| CN112238670B (zh) * | 2020-10-16 | 2022-11-15 | 上海江丰平芯电子科技有限公司 | 一种研磨垫的制备方法 |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN113211337B (zh) * | 2021-05-18 | 2023-04-07 | 南通大学 | 超硬衬底片抛光用抛光盘的制备方法及精密抛光方法 |
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| JPH03157473A (ja) * | 1989-11-15 | 1991-07-05 | Unitika Ltd | ポリエステル系ホットメルト接着剤 |
| CA2244972A1 (fr) | 1996-11-26 | 1998-06-04 | Eric Radigon | Colles thermofusibles a base de copolymeres a fonctions epoxydes |
| JP2003510826A (ja) * | 1999-09-29 | 2003-03-18 | ロデール ホールディングス インコーポレイテッド | 研磨パッド |
| US20020137431A1 (en) * | 2001-03-23 | 2002-09-26 | Labunsky Michael A. | Methods and apparatus for polishing and planarization |
| JP2002371258A (ja) * | 2001-06-13 | 2002-12-26 | Toyobo Co Ltd | 溶剤可溶型結晶性ポリエステル接着剤組成物および積層体並びにフラットケーブル |
| JP2003188124A (ja) * | 2001-12-14 | 2003-07-04 | Rodel Nitta Co | 研磨布 |
| EP1542832A1 (en) * | 2002-09-25 | 2005-06-22 | PPG Industries Ohio, Inc. | Polishing pad with window for planarization |
| US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
| WO2005104199A1 (ja) * | 2004-04-23 | 2005-11-03 | Jsr Corporation | 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 |
| JP4566660B2 (ja) * | 2004-08-30 | 2010-10-20 | 富士紡ホールディングス株式会社 | 仕上げ研磨用研磨布及び研磨布の製造方法 |
| KR101107044B1 (ko) * | 2004-12-10 | 2012-01-25 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 연마 패드의 제조 방법 |
| JP4681970B2 (ja) * | 2005-07-27 | 2011-05-11 | ニッタ・ハース株式会社 | 研磨パッドおよび研磨機 |
| JP2007118106A (ja) * | 2005-10-26 | 2007-05-17 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法 |
| JP5315678B2 (ja) * | 2007-03-30 | 2013-10-16 | 東レ株式会社 | 研磨パッドの製造方法 |
| US8562389B2 (en) * | 2007-06-08 | 2013-10-22 | Applied Materials, Inc. | Thin polishing pad with window and molding process |
| WO2009081821A1 (ja) * | 2007-12-21 | 2009-07-02 | Toagosei Co., Ltd. | ホットメルト接着剤組成物 |
| US7820005B2 (en) * | 2008-07-18 | 2010-10-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad manufacturing process |
| JP5254727B2 (ja) * | 2008-09-29 | 2013-08-07 | 富士紡ホールディングス株式会社 | 研磨パッド |
| US8393940B2 (en) * | 2010-04-16 | 2013-03-12 | Applied Materials, Inc. | Molding windows in thin pads |
-
2012
- 2012-04-02 JP JP2012084023A patent/JP5893479B2/ja not_active Expired - Fee Related
- 2012-04-11 US US14/111,503 patent/US20140065932A1/en not_active Abandoned
- 2012-04-11 SG SG2013078175A patent/SG194560A1/en unknown
- 2012-04-11 CN CN201280018985XA patent/CN103476546A/zh active Pending
- 2012-04-11 KR KR1020137022306A patent/KR101572464B1/ko active IP Right Grant
- 2012-04-11 WO PCT/JP2012/059910 patent/WO2012144388A1/ja active Application Filing
- 2012-04-16 TW TW101113451A patent/TWI457201B/zh not_active IP Right Cessation
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|---|---|
| KR101572464B1 (ko) | 2015-11-27 |
| JP2013066993A (ja) | 2013-04-18 |
| TW201302380A (zh) | 2013-01-16 |
| US20140065932A1 (en) | 2014-03-06 |
| JP5893479B2 (ja) | 2016-03-23 |
| TWI457201B (zh) | 2014-10-21 |
| CN103476546A (zh) | 2013-12-25 |
| WO2012144388A1 (ja) | 2012-10-26 |
| KR20130119487A (ko) | 2013-10-31 |
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