KR101572464B1 - 적층 연마 패드 - Google Patents

적층 연마 패드 Download PDF

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Publication number
KR101572464B1
KR101572464B1 KR1020137022306A KR20137022306A KR101572464B1 KR 101572464 B1 KR101572464 B1 KR 101572464B1 KR 1020137022306 A KR1020137022306 A KR 1020137022306A KR 20137022306 A KR20137022306 A KR 20137022306A KR 101572464 B1 KR101572464 B1 KR 101572464B1
Authority
KR
South Korea
Prior art keywords
layer
polishing
adhesive
polyester
laminated
Prior art date
Application number
KR1020137022306A
Other languages
English (en)
Korean (ko)
Other versions
KR20130119487A (ko
Inventor
아쓰시 가즈노
겐지 나카무라
Original Assignee
도요 고무 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도요 고무 고교 가부시키가이샤 filed Critical 도요 고무 고교 가부시키가이샤
Publication of KR20130119487A publication Critical patent/KR20130119487A/ko
Application granted granted Critical
Publication of KR101572464B1 publication Critical patent/KR101572464B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Laminated Bodies (AREA)
KR1020137022306A 2011-04-21 2012-04-11 적층 연마 패드 KR101572464B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2011-095270 2011-04-21
JP2011095270 2011-04-21
JPJP-P-2011-197277 2011-09-09
JP2011197277 2011-09-09
JPJP-P-2012-084023 2012-04-02
JP2012084023A JP5893479B2 (ja) 2011-04-21 2012-04-02 積層研磨パッド
PCT/JP2012/059910 WO2012144388A1 (ja) 2011-04-21 2012-04-11 積層研磨パッド

Publications (2)

Publication Number Publication Date
KR20130119487A KR20130119487A (ko) 2013-10-31
KR101572464B1 true KR101572464B1 (ko) 2015-11-27

Family

ID=47041499

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137022306A KR101572464B1 (ko) 2011-04-21 2012-04-11 적층 연마 패드

Country Status (7)

Country Link
US (1) US20140065932A1 (zh)
JP (1) JP5893479B2 (zh)
KR (1) KR101572464B1 (zh)
CN (1) CN103476546A (zh)
SG (1) SG194560A1 (zh)
TW (1) TWI457201B (zh)
WO (1) WO2012144388A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101781938B1 (ko) * 2016-08-04 2017-09-26 주식회사 휴비스 폴리에스테르계 핫멜트 접착파우더
KR101890331B1 (ko) * 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
US11267098B2 (en) 2017-10-16 2022-03-08 Skc Solmics Co., Ltd. Leakage-proof polishing pad and process for preparing the same

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JP2014094424A (ja) * 2012-11-08 2014-05-22 Toyo Tire & Rubber Co Ltd 積層研磨パッド
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
JP6380977B2 (ja) * 2014-08-29 2018-08-29 サトーホールディングス株式会社 弾性体ローラー
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
MY182511A (en) * 2014-10-14 2021-01-25 Hoya Corp Method for manufacturing magnetic-disk substrate, method for manufacturing magnetic disk, raw material for polishing pad, and method for manufacturing substrate
KR102295988B1 (ko) 2014-10-17 2021-09-01 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN105619237B (zh) * 2014-11-28 2018-07-27 浙江华正新材料股份有限公司 一种无腊抛光吸附垫及其制造方法
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
EP3496897A1 (de) * 2016-08-10 2019-06-19 Klingspor AG Schruppscheibe mit trägerschicht
TWI626117B (zh) * 2017-01-19 2018-06-11 智勝科技股份有限公司 研磨墊及研磨方法
US20180345449A1 (en) * 2017-06-06 2018-12-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7299970B2 (ja) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド 改良型研磨パッドのための配合物
CN112930584A (zh) * 2018-11-12 2021-06-08 昭和电工材料株式会社 半导体装置的制造方法及半导体晶圆加工用胶黏膜
KR102202076B1 (ko) * 2018-12-26 2021-01-12 에스케이씨 주식회사 연마패드용 조성물, 연마패드 및 이의 제조방법
CN113382824A (zh) * 2019-03-20 2021-09-10 丸石产业株式会社 研磨装置用的平台及研磨装置和研磨方法
US11207757B2 (en) * 2019-06-17 2021-12-28 Skc Solmics Co., Ltd. Composition for polishing pad, polishing pad and preparation method of semiconductor device
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN112238670B (zh) * 2020-10-16 2022-11-15 上海江丰平芯电子科技有限公司 一种研磨垫的制备方法
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN113211337B (zh) * 2021-05-18 2023-04-07 南通大学 超硬衬底片抛光用抛光盘的制备方法及精密抛光方法

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JP2000505837A (ja) 1996-11-26 2000-05-16 エルフ アトケム ソシエテ アノニム エポキシ基を有する共重合体をベースとしたホットメルト接着剤

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JPH03157473A (ja) * 1989-11-15 1991-07-05 Unitika Ltd ポリエステル系ホットメルト接着剤
JP2003510826A (ja) * 1999-09-29 2003-03-18 ロデール ホールディングス インコーポレイテッド 研磨パッド
US20020137431A1 (en) * 2001-03-23 2002-09-26 Labunsky Michael A. Methods and apparatus for polishing and planarization
JP2002371258A (ja) * 2001-06-13 2002-12-26 Toyobo Co Ltd 溶剤可溶型結晶性ポリエステル接着剤組成物および積層体並びにフラットケーブル
JP2003188124A (ja) * 2001-12-14 2003-07-04 Rodel Nitta Co 研磨布
EP1542832A1 (en) * 2002-09-25 2005-06-22 PPG Industries Ohio, Inc. Polishing pad with window for planarization
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
WO2005104199A1 (ja) * 2004-04-23 2005-11-03 Jsr Corporation 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP4566660B2 (ja) * 2004-08-30 2010-10-20 富士紡ホールディングス株式会社 仕上げ研磨用研磨布及び研磨布の製造方法
KR101107044B1 (ko) * 2004-12-10 2012-01-25 도요 고무 고교 가부시키가이샤 연마 패드 및 연마 패드의 제조 방법
JP4681970B2 (ja) * 2005-07-27 2011-05-11 ニッタ・ハース株式会社 研磨パッドおよび研磨機
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
JP5315678B2 (ja) * 2007-03-30 2013-10-16 東レ株式会社 研磨パッドの製造方法
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
WO2009081821A1 (ja) * 2007-12-21 2009-07-02 Toagosei Co., Ltd. ホットメルト接着剤組成物
US7820005B2 (en) * 2008-07-18 2010-10-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad manufacturing process
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JP2000505837A (ja) 1996-11-26 2000-05-16 エルフ アトケム ソシエテ アノニム エポキシ基を有する共重合体をベースとしたホットメルト接着剤

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101781938B1 (ko) * 2016-08-04 2017-09-26 주식회사 휴비스 폴리에스테르계 핫멜트 접착파우더
KR101890331B1 (ko) * 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
US11267098B2 (en) 2017-10-16 2022-03-08 Skc Solmics Co., Ltd. Leakage-proof polishing pad and process for preparing the same

Also Published As

Publication number Publication date
JP2013066993A (ja) 2013-04-18
TW201302380A (zh) 2013-01-16
US20140065932A1 (en) 2014-03-06
JP5893479B2 (ja) 2016-03-23
TWI457201B (zh) 2014-10-21
CN103476546A (zh) 2013-12-25
WO2012144388A1 (ja) 2012-10-26
SG194560A1 (en) 2013-12-30
KR20130119487A (ko) 2013-10-31

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