SG178301A1 - Device and method for stripping a product substrate from a carrier substrate - Google Patents

Device and method for stripping a product substrate from a carrier substrate Download PDF

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Publication number
SG178301A1
SG178301A1 SG2012008520A SG2012008520A SG178301A1 SG 178301 A1 SG178301 A1 SG 178301A1 SG 2012008520 A SG2012008520 A SG 2012008520A SG 2012008520 A SG2012008520 A SG 2012008520A SG 178301 A1 SG178301 A1 SG 178301A1
Authority
SG
Singapore
Prior art keywords
product substrate
stripping
film
substrate
product
Prior art date
Application number
SG2012008520A
Inventor
Friedrich Paul Lindner
Juergen Burggraf
Original Assignee
Ev Group Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group Gmbh filed Critical Ev Group Gmbh
Publication of SG178301A1 publication Critical patent/SG178301A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/003—Cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y10S156/942—Means for delaminating semiconductive product with reorientation means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1111—Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1121—Using vibration during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y10T156/1184—Piercing layer during delaminating [e.g., cutting, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T156/1922—Vibrating delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T156/19—Delaminating means
    • Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T156/19—Delaminating means
    • Y10T156/1961—Severing delaminating means [e.g., chisel, etc.]
    • Y10T156/1967—Cutting delaminating means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

EVG 1934I-EP ih08Device and Method for Stripping a Product Substrate from a Carrier SubstrateAbstractDevice for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.Furthermore, the invention relates to a method for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, and a stripping of the product substrate from the carrier substrate from the periphery of the product substrate being caused by the stripping means. Figures la and lb

Description

Device and Method for Stripping a Product Substrate from a Carrier Substrate
Specification
The invention relates to a device according to Claim | and a method according to Claim 14 for stripping a product substrate from a carrier substrate.
The back-thinning of product substrates is often necessary in the semiconductor industry and can take place mechanically and/or chemically. For purposes of back-thinning, in general the product substrates are temporarily fixed on a carrier, there being various methods for the fixing. The carrier material can be, for example, films, glass substrates or silicon wafers.
Depending on the carrier materials used and the interconnect layer used between the carrier and the product substrate, different methods for dissolving or destroying the interconnect layer are known, such as, for example, the use of UV light, laser beams, the action of temperature, or solvents.
Stripping increasingly constitutes one of the most critical process steps since thin substrates with substrate thicknesses of a few microns easily break during stripping/peeling or are damaged by the forces that are necessary for the stripping process.
Moreover, thin substrates have hardly any stability of shape or none at all and typically curl without support material. During handling of back-thinned wafers, therefore, fixing and support of the wafers are essentially indispensable.
Therefore, the object of this invention is to devise a device and a method to detach such a product substrate from a carrier in as nondestructive a manner as possible.
This object is achieved with the features of Claims | and 14. Advantageous further developments of the invention are given in the dependent claims. The framework of the invention also encompasses all combinations of at least two of the features given in the specification, the claims, and/or the figures. In the specilied value ranges, values that lie within the indicated limits will also be disclosed as boundary values, and they are to be claimed in any combination.
The invention is based on the idea of further developing a generic device and a generic method by the elasticity or flexibility of a film mounted on a film frame being used to carefully strip the product substrate starting from the edge of the product substrate namely by deforming the film, especially in a stripping section of the film. In this way, the product substrate is immediately available for other process steps directly afier separation and is protected by the film and the film frame. Many process steps can be carried out directly on the product substrate mounted on the film frame.
In other words: the flexible film by means of a force bordering the film frame and the adhesive layer that bonds the product substrate in the bonding surface section of the film delivers a tensile force to the product substrate, by which the product substrate is stripped, especially peeled, from the carrier substrate,
A product substrate is defined as a product substrate, for example a semiconductor wafer, which is conventionally thinned to a thickness of between 0.5 um and 250 pm, the trend being toward thinner and thinner product substrates. This invention works especially effectively with product substrates that themselves have flexibility similar to the film mounted on the film frame. In the device according to the invention and the method according to the invention, the product substrate is peeled from the carrier substrate, especially proceeding concentrically from the periphery of the product substrate.
The carrier is, for example, a carrier substrate with a thickness of between 50 pm and 5,000 wm, especially between 500 um and 1,000 pm.
The interconnect layer can be an adhesive, for example a soluble adhesive, especially a thermoplastic, which is applied, for example, selectively in an edge region of the carrier substrate- product substrate combination, especially in an edge zone of from 0.1 to 20 mm. Alternatively, the adhesive can be applied over the entire surface, and the adhesive force can be reduced in the center by an adhesion-reducing layer, for example a fluoropolymer, preferably Teflon.
A chuck is especially well suited as the holding means, especially a spinner chuck for holding the carrier substrate, especially by means of negative pressure, for example suction paths, holes or suction cups. Alternatively, mechanical holding, for example by lateral clamps, is conceivable. Holding takes place electrostatically in another alternative configuration.
The stripping means encompass the film mounted on the film frame and a film frame holder that applies a force and that holds the film frame.
Advantageously, in addition to the stripping means, there is a connection release means for at least partial release of the connection between the carrier substrate and the product substrate caused by the interconnect layer.
To the extent that the device has heating means for heating the carrier substrate-product substrate combination that are integrated especially into the carrier substrate holder, a thermoplastically melting adhesive can be used as an interconnect layer. The maximum heating temperature is 250°C, preferably a maximum 175°C.
In one advantageous embodiment of the invention, it is provided that the connection release means is made to work essentially without heating. In this way, it is possible to omit any heating means.
In another advantageous embodiment of the invention, it is provided that the connection release means comprises {luid means, especially a solvent that selectively dissolves the interconnect layer, for detaching the interconnect layer. Chemical dissolution of the interconnect layer is especially protective of the product substrate and with the corresponding material choice, dissolution can also take place very quickly, especially when only edge regions of the product substrate are provided with an interconnect layer, so that the solvent can act very quickly from the side. In this way, perforations in the carrier substrate and/or product substrate can be omitted.
In one alternative embodiment of the invention, it is provided that the connection release means comprises mechanical separating means, especially a blade for cutting through the interconnect layer, for detaching the interconnect layer. In this way, especially prompt separation of the product substrate from the carrier is possible. A combination of mechanical separating means and fluid means is also conceivable.
In another alternative embodiment of the invention, it is provided that the connection release means comprises a UV light source for detaching the interconnect layer. This embodiment can also be combined with the embodiment of the mechanical separating means and/or the embodiment with fluid means.
To the extent that the connection release means is made to act especially exclusively from one side edge of the product substrate, action on the product substrate and/or the carrier from the top and/or bottom, especially the inside region of the product substrate that lies within the side edge, can be omitied.
There being a rotation means for rotation of the carrier substrate, product subsirate and/or film frame with the film makes it possible to omit an arrangement of the connection release means over the entire periphery of the product substrate and partial action on the periphery of the product substrate is sufficient.
To the extent that the stripping section is located outside of the outer contour of the product substrate and/or adjoins the bonding section, optimum transfer of the stripping force to the product substrate is possible by deformation of the film.
Advantageously, to expose the interconnect layer to the fluid means, for holding the fluid means there is a solvent reservoir that is fastened, especially sealed, to the carrier substrate or carrier substrate holder, the top edge of the reservoir extending at least as [ar as the plane formed by the product substrate. The solvent reservoir at least partially encompassing the side edge or the periphery of the product substrate allows especially effective action on the interconnect layer.
Furthermore, the measure of encompassing prevents fluid means from escaping from the solvent reservoir or UV light intensity from being lost. When using mechanical separation means, possible contaminants are prevented from escaping from the solvent reservoir and contaminating the product substrate. The solvent reservoir can be made L-shaped or U-shaped in cross-section in one advantageous configuration.
In another advantageous configuration of the invention, it is provided that the solvent reservoir extends only over one peripheral sector of the side edge or the periphery of the product substrate. Advantageously, the solvent reservoir extends only slightly over the side edge or periphery of the carrier substrate or product substrate in the direction of the product substrate center so that a force Fs can be applied to the carrier substrate. The force Fs can also be transferred to the carrier substrate via the solvent reservoir.
According to one advantageous embodiment of the invention, it is provided that stripping results by a force Fs that acts on the carrier substrate and a force I that acts on the film frame and that ts directed against the force Fs. The device can be made to deliver the force Ff as a local force, especially in spots at at least one point on the film frame. Advantageously, the force Fis delivered distributed among several points on the periphery of the film frame, whereby different forces can also be delivered and tilting of the film frame relative to the carrier substrate or the carrier substrate holder can be caused by the device.
A uniform force distribution on the periphery of the product substrate depending on the desired form of stripping is achieved by the capacity of the film to be deformed, especially stretched, by the force Fs and the force If in the stripping section.
According to another advantageous embodiment of the invention, it is provided that the force I's and the force Ff can cause displacement of the film frame relative to the carrier substrate, whereby in this way within the film frame a trough being formed that has acoustic wave generating means, especially formed from a fluid that can be held in the trough and an acoustic transmitter immersed in the fluid, for transmission of acoustic waves to the product substrate and/or the solvent. The stripping of the product substrate is greatly accelerated by the cavitation generated by ultrasound or megasound so that the stripping takes place much more carefully and at the same time more rapidly.
Advantageously, it is furthermore provided that the stripping of the product substrate takes place concentrically from the periphery of the product substrate to the center of the product substrate.
It is especially advantageous if the product substrate is made to adhere to the film during the stripping process since in this way, blanket holding and protection are ensured.
Other advantages, features and details of the invention will become apparent from the following description of preferred embodiments and based on the drawings. Tere:
Figure Ta shows a schematic top view of a substrate combination consisting of the product substrate, the carrier substrate and the interconnect layer on a film frame,
Figure Ib shows a schematic side view to Figure la with a detailed view,
Figure 2 shows a schematic representation of the device according to the invention in the stripping of the product substrate from the carrier substrate with a detailed view,
Figure 3 shows a schematic representation of the device according to the invention in the stripping of the product substrate from the carrier substrate with a detailed view,
Figure 4 shows a schematic representation of one embodiment of the invention.
In the figures, the same components and components with the same function are identified with the same reference number,
Figure {a shows a film frame | that is round in this embodiment at least on an inner periphery 1i, with a film 3 mounted, especially glued, on its bottom. With a radial distance to the inner periphery 1i of the film frame 1, within the film frame | a product substrate-carrier substrate combination is glued on an adhesive layer 3s of the film 3 concentrically to the film frame | (see
Figure 1b).
The product substrate-carrier substrate combination consists of a product substrate 4 that adheres to the film 3, a carrier substrate 2, and an interconnect layer 6 that connects the product substrate 4 and the carrier substrate 2. The diameters of the product substrate 4 and of the carrier substrate 2 are essentially identical, while the thickness of the product substrate 4 is less than the thickness of the carrier substrate 2.
The film 3 consists of an attachment section 3b that has the shape of a circular ring in this case and in which the film 3 is fixed to the film frame |. Furthermore, the film 3 consists of a bonding surface section 3k in which the product substrate 4 can be fixed on the adhesive layer 3s of the film 3. Between the attachment section 3b and the bonding surface section 3k, there is a stripping section 3a that is located especially concentrically to the attachment section 3b and the bonding surface section 3k, and that has a function that is critical according to the invention, The stripping section 3a thus extends from a periphery 4u of the product substrate 4 to the inner periphery li of the film frame, here labeled distance A. The ratio between a thickness D of the film frame | and the distance A is advantageously at least | to 2 to | to 50, especially 1 to Sto | to 25, and preferably 1 to 19to | to 10.
In the initial position shown in Figure 1b, the side of the product substrate 4 that makes contact with the film 3 and the side of the film frame 1 that makes contact with the film 3 are arranged flush in one plane E. The parts shown in Figures 1a and Ib are assembled on a known film frame mounter.
Figures 2 and 3 schematically show the stripping process in two variants, namely shortly after the start of the stripping of the product substrate 2 from the carrier substrate 4.
By delivering opposing forces Ff, or Fl and Ff2, and Fs, the product substrate-carrier substrate combination and the bonding surface section 3k of the film 3, which section adheres to the combination, are moved out of the film frame 1 in the direction of a carrier substrate holder 7. In a kinematic reversal, the film frame | can also be moved by the force Ff by means of a film frame holder that is not shown, for example a robot arm.
The force is transferred from the carrier substrate holder 7 to the carrier substrate 2 via vacuum paths 8 that have been machined into the surface of the carrier substrate holder 7 and via a vacuum means that is connected to them and that is not shown. The carrier substrate holder 7 is anchored securely to the device.
Alternatively, the holding of the carrier substrate 2 can take place mechanically, for example by clamping, or electrostatically.
The force Ff acting on the film frame 1 - as shown in Figure 2 - can act uniformly distributed as a superficial force on the film frame 1 so that the stripping of the product substrate 4 from the carrier substrate 2 takes place from the edge by way of deformation of the stripping section 3a, as is shown enlarged in the detailed representation in Figure 2. The force Ff1 is identical here to the force Ff2. The force can be delivered in spots distributed on the periphery of the {ilm frame | or can be introduced distributed by a film frame holder.
In the embodiment shown in Figure 3, the force distribution on the periphery of the film frame | is different, specifically the force Ff1 is greater than the force F12 on the opposite side so that the product substrate 4 is stripped first on the side on which the greater force Fl is delivered.
The holding means for delivering the force into the film frame | must therefore be made to allow tipping of the film frame |.
The product substrate 4 promotes stripping since it behaves in an elastic manner that is similar to the film 3 and is thus detached from the product substrate-carrier substrate combination step by step from its edge.
According to Figure 4, the solvent reservoir 20 is arranged on the carrier substrate 2 such that immersion of the product substrate-carrier substrate combination in the position of the product substrate-carrier substrate combination exposed to a force is enabled. The solvent reservoir 20 is attached annularly in this case to the periphery of the carrier substrate 2, especially to form a seal, so that the force can be delivered, as before, within the solvent reservoir 20 to the carrier substrate 2.
The force can also be delivered alternatively to the solvent reservoir 20, for example when the solvent reservoir 20 is attached nonpositively to the carrier substrate 2. An outer peripheral wall 21 of the solvent reservoir 20 extends at least as far as a plane formed by the product substrate 4 so that the solvent 22 in the solvent reservoir 20 reaches at least as far as the interconnect layer 6, and the latter can be dissolved by the solvent 22. Advantageously, the outer peripheral wall 21 extends beyond the plane formed by the product substrate 4 almost as far as the film frame | so that even during rotation, escape of the solvent 22 from the solvent reservoir 20 is avoided as much as possible.
This measure supports stripping, especially peeling of the product substrate 4 from the carrier substrate 2, by the interconnect layer 6 being dissolved from the periphery 4u of the product substrate 4 and the product substrate 4 being carefully lifted by the tensile force applied to the periphery 4u deforming the film 3.
The deformation of the film 3 causes a trough 9. The delivery of a fluid 11 into the trough 9 is made for for transmission of acoustic waves (ultrasound, megasound) via the film 3 into the solvent 22 located opposite the film 3 and into the product substrate-carrier substrate combination by means of an acoustic wave generating means, here an acoustic transmitter 10. The solvent 22 acts in an accelerated manner on the interconnect layer 6 by the delivery of sound from the edge so that the return force of the film 3 in the direction of the {ilm frame 1 can be reduced and/or stripping is supported, especially for radially symmetrical stripping according to Figure 2.
The delivery of sound causes the molecules of the solvent 22 to vibrate, resulting in cavitation; this leads to distinct acceleration of the dissolution of the interconnect layer 6.
The solvent 22 is advantageously matched selectively to the interconnect layer 6, and the adhesive layer 3s cannot be attacked by the solvent 22.
EVG 19341-EP ih08
Device and Method for Stripping a Product Substrate from a Carrier Substrate
Reference Symbol List
A Distance
D Thickness
E Plane
Film frame li Inner periphery 2 Carrier substrate 3 Film 3a Stripping section 3b Attachment section 3k Bonding surface section 3s Adhesive layer 4 Product substrate du Periphery 6 Interconnect layer 7 Carrier substrate holder 8 Vacuum paths 9 Trough
Acoustic transmitter 11 Fluid
Solvent reservoir 21 External peripheral wall 22 Solvent

Claims (15)

EVG 19341-EP 1h08 Device and Method for Stripping a Product Substrate from a Carrier Substrate Claims
1. Device for stripping a product substrate (4) from a carrier substrate (2) connected to the product substrate (4) by an interconnect layer (6) by means of a flexible film (3) that is mounted on a film frame (1) and that comprises an adhesive layer (3s) for holding the product substrate (4) in a bonding surface section (3k) of the film (3), the film (3) being mounted on the film frame (1) in an attachment section (3b) of the filin (3) that surrounds the bonding surface section (3k), and the film (3) comprising a stripping section (3a) that is located between the bonding surface section (3k) and the attachment section (3b), characterized in that the device has stripping means for effecting a stripping of the product substrate (4) from the carrier substrate (2) from a periphery (4u) of the product substrate (4).
2. Device according to Claim |, wherein in addition to the stripping means, there is a connection release means for at least partially detaching the connection between the carrier substrate (2) and the product substrate (4) caused by the interconnect layer (6).
3. Device according to Claim 2, wherein the connection release means comprises fluid means, especially a solvent (22) that selectively dissolves the interconnect layer, for at least partial detachment of the interconnect layer (6).
4. Device according to Claim 2, wherein the connection release means comprises mechanical separating means, especially a blade for cutting through the interconnect layer (6), for at least partial detachment of the interconnect layer (6).
5. Device according to Claim 2, wherein the connection release means comprises a UV light source for at least partial detachment of the interconnect layer (6).
6. Device according to claim 2, wherein the connection release means is made to act especially exclusively in the region of the periphery (4u).
7. Device according to claim |, wherein the stripping section (3a) is located outside of the outer contour of the product substrate (4) and/or adjoins the bonding surface section (3k).
8. Device according to Claim 2 or 3, wherein to expose the interconnect layer (6) to the fluid means, for holding the fluid means there is a solvent reservoir (20) that is fastened, especially sealed, to the carrier substrate or a carrier substrate holder (7), the top edge of the reservoir extending at least as far as the plane formed by the product substrate (4).
9. Device according to claim 1, wherein stripping results by a force Fs that acts on the carrier substrate (2) and a force F{ that acts on the film frame (1) and that is directed against the {orce Fs.
10. Device according to Claim 9, wherein the film (3) can be stretched by the force Fs and the force Ff in the stripping section (3a).
J 1. Device according to Claim 9 or 10, wherein the force Fs and the force Ff can cause displacement of the film frame (1) relative to the carrier substrate (2), in this way within the film frame (1) a trough (9) being formed that has acoustic wave generating means, especially formed from a fluid (1 1) that can be held in the trough (9) and an acoustic transmitter (10) immersed into the fluid (11), for transmission of acoustic waves to the product substrate and/or the solvent (22). i5
12. Device according to claim 1, wherein stripping of the product substrate (4) takes place concentrically from the periphery (4u) of the product substrate (4) to the center (47) of the product substrate (4).
13. Device according to claim |, wherein the product substrate (4) is made to adhere to the film (3) during the stripping process.
14. Method for stripping a product substrate (4) from a carrier substrate (2) connected to the product substrate (4) by an interconnect layer (6) by means of a flexible film (3) that is mounted on a film frame (1) and that comprises an adhesive layer (3s) for holding the product substrate (4) in a bonding surface section (3k) of the film (3), the film (3) being mounted on the film frame (1) in an attachment section (3b) of the film (3) that surrounds the bonding surface section (3k), and the Gln (3) comprising a stripping section (3a) that is located between the bonding surface section (3k) and the attachment section (3b), wherein a stripping of the product substrate (4) from the carrier substrate (2) from a periphery (4u) of the product substrate (4) is caused by the stripping means.
15. Method according to Claim 14, wherein the stripping of the product substrate (4) takes place concentrically from the periphery (4u) of the product substrate (4) to the center (47) of the product substrate (4).
SG2012008520A 2009-09-01 2010-08-20 Device and method for stripping a product substrate from a carrier substrate SG178301A1 (en)

Applications Claiming Priority (2)

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EP09011198.0A EP2290679B1 (en) 2009-09-01 2009-09-01 Device and method for releasing a product substrate (e.g., a semiconductor wafer) from a support substrate by deformation of a flexible film mounted on a frame
PCT/EP2010/005108 WO2011026570A1 (en) 2009-09-01 2010-08-20 Device and method for detaching a semiconductor wafer from a substrate

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