SG170759A1 - Method and apparatus for angular-resolved spectroscopic lithography characterization - Google Patents

Method and apparatus for angular-resolved spectroscopic lithography characterization

Info

Publication number
SG170759A1
SG170759A1 SG201102077-3A SG2011020773A SG170759A1 SG 170759 A1 SG170759 A1 SG 170759A1 SG 2011020773 A SG2011020773 A SG 2011020773A SG 170759 A1 SG170759 A1 SG 170759A1
Authority
SG
Singapore
Prior art keywords
angular
resolved spectroscopic
characterization
lithography characterization
spectroscopic lithography
Prior art date
Application number
SG201102077-3A
Other languages
English (en)
Inventor
Boef Arie Jeffrey Deb
Everhardus Cornelis Mos
Van Der Schaar Maurits
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG170759A1 publication Critical patent/SG170759A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Environmental & Geological Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
SG201102077-3A 2006-09-25 2007-09-14 Method and apparatus for angular-resolved spectroscopic lithography characterization SG170759A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/526,243 US7573584B2 (en) 2006-09-25 2006-09-25 Method and apparatus for angular-resolved spectroscopic lithography characterization

Publications (1)

Publication Number Publication Date
SG170759A1 true SG170759A1 (en) 2011-05-30

Family

ID=38829227

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200708751-3A SG141384A1 (en) 2006-09-25 2007-09-14 Method and apparatus for angular-resolved spectroscopic lithography characterization
SG201102077-3A SG170759A1 (en) 2006-09-25 2007-09-14 Method and apparatus for angular-resolved spectroscopic lithography characterization

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG200708751-3A SG141384A1 (en) 2006-09-25 2007-09-14 Method and apparatus for angular-resolved spectroscopic lithography characterization

Country Status (7)

Country Link
US (1) US7573584B2 (ko)
EP (1) EP1903397B1 (ko)
JP (2) JP4555847B2 (ko)
KR (1) KR100923543B1 (ko)
CN (1) CN101154055B (ko)
SG (2) SG141384A1 (ko)
TW (1) TWI371662B (ko)

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CN106164733B (zh) * 2014-03-31 2020-06-30 科磊股份有限公司 使用散射术计量的焦点测量
CN107078074B (zh) * 2014-11-25 2021-05-25 科磊股份有限公司 分析及利用景观
CN104897078B (zh) * 2015-05-19 2017-12-22 哈尔滨工业大学 一种基于可见光反射光谱特性的超精密车削加工表面三维微观形貌的测量方法
CN105180825A (zh) * 2015-05-19 2015-12-23 哈尔滨工业大学 一种基于可见光反射光谱特性的超精密车削加工表面三维微观形貌测量装置
CN105004286B (zh) * 2015-05-19 2017-12-22 哈尔滨工业大学 一种基于激光束衍射光斑特性的超精密车削加工表面三维微观形貌测量方法
CN109154562A (zh) * 2016-05-11 2019-01-04 Ipg光子公司 用于测量平板显示器的光纤激光退火多晶硅薄膜的形态特性的过程和系统
CN109328182B (zh) * 2016-06-29 2021-10-29 株式会社小原 光学玻璃、预制件以及光学元件
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Also Published As

Publication number Publication date
US7573584B2 (en) 2009-08-11
JP2008109104A (ja) 2008-05-08
KR100923543B1 (ko) 2009-10-27
JP4719817B2 (ja) 2011-07-06
CN101154055B (zh) 2010-11-24
EP1903397A3 (en) 2009-07-08
TW200821770A (en) 2008-05-16
SG141384A1 (en) 2008-04-28
TWI371662B (en) 2012-09-01
KR20080027748A (ko) 2008-03-28
JP2010251798A (ja) 2010-11-04
EP1903397A2 (en) 2008-03-26
CN101154055A (zh) 2008-04-02
EP1903397B1 (en) 2012-07-25
JP4555847B2 (ja) 2010-10-06
US20080074666A1 (en) 2008-03-27

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