SG170744A1 - Circuit board and connection substrate - Google Patents

Circuit board and connection substrate

Info

Publication number
SG170744A1
SG170744A1 SG201101983-3A SG2011019833A SG170744A1 SG 170744 A1 SG170744 A1 SG 170744A1 SG 2011019833 A SG2011019833 A SG 2011019833A SG 170744 A1 SG170744 A1 SG 170744A1
Authority
SG
Singapore
Prior art keywords
conductor
circuit board
connection substrate
substrate
pad
Prior art date
Application number
SG201101983-3A
Other languages
English (en)
Inventor
Toshiaki Chuma
Makoto Inaba
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006207426A external-priority patent/JP2008004908A/ja
Priority claimed from JP2006244292A external-priority patent/JP4893175B2/ja
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG170744A1 publication Critical patent/SG170744A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
SG201101983-3A 2006-03-20 2007-03-14 Circuit board and connection substrate SG170744A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006075896 2006-03-20
JP2006144444 2006-05-24
JP2006144453 2006-05-24
JP2006207426A JP2008004908A (ja) 2006-03-20 2006-07-31 回路板
JP2006244292A JP4893175B2 (ja) 2006-03-20 2006-09-08 回路板

Publications (1)

Publication Number Publication Date
SG170744A1 true SG170744A1 (en) 2011-05-30

Family

ID=38522243

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201101983-3A SG170744A1 (en) 2006-03-20 2007-03-14 Circuit board and connection substrate

Country Status (7)

Country Link
US (1) US20090084597A1 (fr)
EP (3) EP2007176A4 (fr)
KR (1) KR20080111477A (fr)
CN (1) CN101406112B (fr)
SG (1) SG170744A1 (fr)
TW (1) TW200746938A (fr)
WO (1) WO2007108207A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010007704A1 (fr) * 2008-07-16 2010-01-21 イビデン株式会社 Carte de câblage flexorigide et dispositif électronique
CN102458037B (zh) * 2010-10-27 2016-06-22 厦门立达信光电有限公司 一种可弯折成预设形状的接桥式基板组件及其制作方法
CN203225947U (zh) * 2013-03-28 2013-10-02 富士康(昆山)电脑接插件有限公司 印刷电路板组件
CN105228343A (zh) * 2015-09-22 2016-01-06 广东欧珀移动通信有限公司 一种软硬结合板及其制作方法
WO2017194618A1 (fr) * 2016-05-11 2017-11-16 Flex Automotive Gmbh Ensemble circuit électrique et son procédé de fabrication
CN106102318A (zh) * 2016-07-20 2016-11-09 苏州福莱盈电子有限公司 一种柔性扩展的线路板
CN105934093A (zh) * 2016-07-20 2016-09-07 苏州福莱盈电子有限公司 一种软硬结合线路板
CN105960097A (zh) * 2016-07-20 2016-09-21 苏州福莱盈电子有限公司 一种便于安装的线路板
JP6700207B2 (ja) * 2017-02-08 2020-05-27 矢崎総業株式会社 印刷回路の電気接続方法
CN116867167A (zh) * 2023-06-13 2023-10-10 太仓神连科技有限公司 铝制柔性印刷线路板组件及其制备方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02214826A (ja) * 1989-02-16 1990-08-27 Matsushita Electric Ind Co Ltd 液晶表示装置
US5121297A (en) * 1990-12-31 1992-06-09 Compaq Computer Corporation Flexible printed circuits
US5144742A (en) * 1991-02-27 1992-09-08 Zycon Corporation Method of making rigid-flex printed circuit boards
US5198965A (en) * 1991-12-18 1993-03-30 International Business Machines Corporation Free form packaging of specific functions within a computer system
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
US5523695A (en) * 1994-08-26 1996-06-04 Vlsi Technology, Inc. Universal test socket for exposing the active surface of an integrated circuit in a die-down package
JP2606177B2 (ja) * 1995-04-26 1997-04-30 日本電気株式会社 印刷配線板
JPH09139559A (ja) * 1995-11-13 1997-05-27 Minolta Co Ltd 回路基板の接続構造
JP3222842B2 (ja) 1998-10-08 2001-10-29 日本航空電子工業株式会社 基板接続用コネクタ
JP3201748B2 (ja) * 1999-03-23 2001-08-27 日東電工株式会社 接点付きフレキシブルプリント基板
US6507095B1 (en) * 1999-03-25 2003-01-14 Seiko Epson Corporation Wiring board, connected board and semiconductor device, method of manufacture thereof, circuit board, and electronic instrument
DE19914418A1 (de) * 1999-03-30 2000-10-05 Bosch Gmbh Robert Leiterplatte mit starren und elastisch verformbaren Abschnitten und Gerät mit einer solchen Leiterplatte
US6699395B1 (en) * 2000-10-18 2004-03-02 Storage Technology Corporation Method of forming alignment features for conductive devices
JP4485708B2 (ja) * 2001-05-21 2010-06-23 シャープ株式会社 液晶表示装置用周辺回路基板及びそれを備えた液晶表示装置
JP2003133734A (ja) 2001-10-24 2003-05-09 Nippon Mektron Ltd ケーブル部を有するフレキシブルプリント基板
US6956284B2 (en) * 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US6794580B2 (en) * 2002-02-20 2004-09-21 Molex Incorporated Solder interconnections for flat circuits
JP2004063710A (ja) * 2002-07-29 2004-02-26 Hitachi Cable Ltd 配線板および電子装置、ならびに配線板の製造方法および電子装置の製造方法
US7071547B2 (en) * 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
WO2004049772A1 (fr) * 2002-11-27 2004-06-10 Sumitomo Bakelite Company Limited Carte de circuit imprime, panneau de cablage multicouche, procede de fabrication d'une carte de circuit imprime et procede de fabrication d'un panneau de cablage multicouche
JP4103653B2 (ja) * 2003-03-27 2008-06-18 株式会社デンソー Ｉｃカード
JP2005317943A (ja) * 2004-03-29 2005-11-10 Sumitomo Bakelite Co Ltd プリント回路基板およびその製造方法
JP2007067244A (ja) * 2005-08-31 2007-03-15 Sony Corp 回路基板
JP4849908B2 (ja) * 2006-02-27 2012-01-11 株式会社フジクラ リジッド基板の接続構造

Also Published As

Publication number Publication date
KR20080111477A (ko) 2008-12-23
EP2461656A3 (fr) 2012-08-01
CN101406112A (zh) 2009-04-08
CN101406112B (zh) 2011-03-02
TW200746938A (en) 2007-12-16
EP2007176A4 (fr) 2009-11-11
EP2007176A1 (fr) 2008-12-24
EP2473014A2 (fr) 2012-07-04
WO2007108207A1 (fr) 2007-09-27
EP2461656A2 (fr) 2012-06-06
US20090084597A1 (en) 2009-04-02

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