SG165993A1 - User interface for quantifying wafer non-uniformities and graphically explore significance - Google Patents

User interface for quantifying wafer non-uniformities and graphically explore significance

Info

Publication number
SG165993A1
SG165993A1 SG200702205-6A SG2007022056A SG165993A1 SG 165993 A1 SG165993 A1 SG 165993A1 SG 2007022056 A SG2007022056 A SG 2007022056A SG 165993 A1 SG165993 A1 SG 165993A1
Authority
SG
Singapore
Prior art keywords
wafer
user interface
uniformities
wafer non
analysis
Prior art date
Application number
SG200702205-6A
Other languages
English (en)
Inventor
Jorge Luque
Iii Andrew D Bailey
Mark Wilcoxson
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/452,248 external-priority patent/US7738693B2/en
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG165993A1 publication Critical patent/SG165993A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG200702205-6A 2002-09-26 2003-09-24 User interface for quantifying wafer non-uniformities and graphically explore significance SG165993A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41402102P 2002-09-26 2002-09-26
US10/331,194 US7239737B2 (en) 2002-09-26 2002-12-24 User interface for quantifying wafer non-uniformities and graphically explore significance
US10/452,248 US7738693B2 (en) 2002-12-24 2003-05-30 User interface for wafer data analysis and visualization

Publications (1)

Publication Number Publication Date
SG165993A1 true SG165993A1 (en) 2010-11-29

Family

ID=35476772

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200702205-6A SG165993A1 (en) 2002-09-26 2003-09-24 User interface for quantifying wafer non-uniformities and graphically explore significance

Country Status (4)

Country Link
US (1) US7239737B2 (zh)
JP (2) JP5460648B2 (zh)
CN (2) CN100431126C (zh)
SG (1) SG165993A1 (zh)

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BRPI0511299A (pt) * 2004-05-21 2007-12-04 Pressco Tech Inc interface de preparação de usuário para re-inspeção gráfica
US20070022000A1 (en) * 2005-07-22 2007-01-25 Accenture Llp Data analysis using graphical visualization
KR100706813B1 (ko) * 2006-02-13 2007-04-12 삼성전자주식회사 반도체 장치의 패턴 배치 방법
JP4953427B2 (ja) * 2006-06-21 2012-06-13 東京エレクトロン株式会社 基板処理装置、表示方法、記録媒体及びプログラム
USD609714S1 (en) * 2007-03-22 2010-02-09 Fujifilm Corporation Electronic camera
US20090171606A1 (en) * 2007-12-31 2009-07-02 Takahiro Murata Semiconductor manufacture performance analysis
US7991195B2 (en) * 2008-02-25 2011-08-02 Honeywell International Inc. Target specific image scaling for effective rapid serial visual presentation
CN103324380A (zh) * 2012-03-20 2013-09-25 赵盾 一种摄像头模件组测试结果的计算机显示方法
USD743412S1 (en) * 2012-09-06 2015-11-17 Abbyy Infopoisk Llc Display screen or portion thereof with graphical user interface
USD743413S1 (en) * 2012-09-19 2015-11-17 ABBYY InfoPiosk LLC Display screen or portion thereof with graphical user interface
USD743423S1 (en) * 2013-06-04 2015-11-17 Abbyy Infopoisk Llc Display screen or portion thereof with graphical user interface
US9822460B2 (en) 2014-01-21 2017-11-21 Lam Research Corporation Methods and apparatuses for electroplating and seed layer detection
JP2016119378A (ja) * 2014-12-19 2016-06-30 株式会社荏原製作所 表示制御システム、基板処理システム、及び、表示制御方法
US9735035B1 (en) 2016-01-29 2017-08-15 Lam Research Corporation Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing
CN108445618A (zh) * 2018-06-14 2018-08-24 苏州富莱智能科技有限公司 Dshow标准显微测量系统及测量方法
USD901535S1 (en) 2018-11-15 2020-11-10 Nutanix, Inc. Display screen or portion thereof with graphical user interface
US11157661B2 (en) 2018-12-19 2021-10-26 Applied Materials, Inc. Process development visualization tool
CN109632025B (zh) * 2019-01-18 2020-05-12 泰华智慧产业集团股份有限公司 针对声学多普勒流量计的流速的数据处理方法
CN110990453B (zh) * 2019-11-26 2021-07-16 北京理工大学 数据集中强相关变量提取及专利数量影响因素提取方法
USD930671S1 (en) * 2020-04-19 2021-09-14 Htc Corporation Display screen or portion thereof with animated graphical user interface
USD985017S1 (en) * 2021-03-05 2023-05-02 Mobiline, Inc. Smartphone display with personalized audio invitation graphical user interface

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US5939719A (en) * 1992-03-13 1999-08-17 Thermomicroscopes Corporation Scanning probe microscope with scan correction
US6128403A (en) * 1997-08-26 2000-10-03 Mitsubishi Denki Kabushiki Kaisha Wafer map analysis aid system, wafer map analyzing method and wafer processing method
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US20010000460A1 (en) * 1989-07-12 2001-04-26 Kazuko Ishihara Semiconductor failure analysis system
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US20020051565A1 (en) * 2000-10-26 2002-05-02 Takashi Hiroi Circuit pattern inspection method and apparatus
US20020102747A1 (en) * 2000-09-18 2002-08-01 David Muradian Correction of overlay offset between inspection layers in integrated circuits
US20020113967A1 (en) * 1998-11-30 2002-08-22 Yasuhiko Nara Inspection method, apparatus and system for circuit pattern

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JP3284988B2 (ja) * 1998-12-07 2002-05-27 株式会社日立製作所 検査データ解析システム
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Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0398781A2 (en) * 1989-05-19 1990-11-22 Eastman Kodak Company Method and apparatus for low angle, high resolution surface inspection
US20010000460A1 (en) * 1989-07-12 2001-04-26 Kazuko Ishihara Semiconductor failure analysis system
US5226118A (en) * 1991-01-29 1993-07-06 Prometrix Corporation Data analysis system and method for industrial process control systems
US5939719A (en) * 1992-03-13 1999-08-17 Thermomicroscopes Corporation Scanning probe microscope with scan correction
US5761064A (en) * 1995-10-06 1998-06-02 Advanced Micro Devices, Inc. Defect management system for productivity and yield improvement
US6128403A (en) * 1997-08-26 2000-10-03 Mitsubishi Denki Kabushiki Kaisha Wafer map analysis aid system, wafer map analyzing method and wafer processing method
US20020113967A1 (en) * 1998-11-30 2002-08-22 Yasuhiko Nara Inspection method, apparatus and system for circuit pattern
WO2001008099A1 (en) * 1999-07-24 2001-02-01 Intelligent Reasoning Systems, Inc. User interface for automated optical inspection systems
WO2001080168A1 (en) * 2000-04-18 2001-10-25 Semiconductor Technologies & Instruments, Inc. System and method for locating image features
US20020102747A1 (en) * 2000-09-18 2002-08-01 David Muradian Correction of overlay offset between inspection layers in integrated circuits
US20020051565A1 (en) * 2000-10-26 2002-05-02 Takashi Hiroi Circuit pattern inspection method and apparatus

Also Published As

Publication number Publication date
CN1701430A (zh) 2005-11-23
JP5460648B2 (ja) 2014-04-02
US7239737B2 (en) 2007-07-03
JP2011228730A (ja) 2011-11-10
CN100431126C (zh) 2008-11-05
JP2011228731A (ja) 2011-11-10
US20040070623A1 (en) 2004-04-15
JP5496955B2 (ja) 2014-05-21
CN1742365A (zh) 2006-03-01

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