SG163493A1 - Die ejector - Google Patents

Die ejector

Info

Publication number
SG163493A1
SG163493A1 SG201000309-3A SG2010003093A SG163493A1 SG 163493 A1 SG163493 A1 SG 163493A1 SG 2010003093 A SG2010003093 A SG 2010003093A SG 163493 A1 SG163493 A1 SG 163493A1
Authority
SG
Singapore
Prior art keywords
slot
base plate
plate
slide
drive belt
Prior art date
Application number
SG201000309-3A
Other languages
English (en)
Inventor
Daniel Kloeckner
Roland Kuster
Ives Muehlemann
Matthias Urben
Original Assignee
Esec Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Ag filed Critical Esec Ag
Publication of SG163493A1 publication Critical patent/SG163493A1/en

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03C—DOMESTIC PLUMBING INSTALLATIONS FOR FRESH WATER OR WASTE WATER; SINKS
    • E03C1/00—Domestic plumbing installations for fresh water or waste water; Sinks
    • E03C1/12—Plumbing installations for waste water; Basins or fountains connected thereto; Sinks
    • E03C1/18—Sinks, whether or not connected to the waste-pipe
    • E03C1/181—Anti-splash devices in sinks, e.g. splash guards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Public Health (AREA)
  • Water Supply & Treatment (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
SG201000309-3A 2009-01-22 2010-01-15 Die ejector SG163493A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14641109P 2009-01-22 2009-01-22

Publications (1)

Publication Number Publication Date
SG163493A1 true SG163493A1 (en) 2010-08-30

Family

ID=41698208

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201000309-3A SG163493A1 (en) 2009-01-22 2010-01-15 Die ejector

Country Status (7)

Country Link
EP (1) EP2211372B8 (fr)
JP (1) JP5569001B2 (fr)
KR (1) KR101621561B1 (fr)
HK (1) HK1142440A1 (fr)
MY (1) MY152753A (fr)
SG (1) SG163493A1 (fr)
TW (1) TWI523130B (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH707236B1 (de) 2012-11-23 2016-10-31 Besi Switzerland Ag Verfahren zum Ablösen von Halbleiterchips von einer Folie.
CN105914177A (zh) * 2016-06-08 2016-08-31 广东科杰机械自动化有限公司 一种夹具
TWI641070B (zh) * 2018-01-09 2018-11-11 力成科技股份有限公司 晶片頂針裝置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062270Y2 (ja) * 1988-09-21 1994-01-19 新日本無線株式会社 半導体ペレット剥離装置
JP4482243B2 (ja) * 2001-03-13 2010-06-16 株式会社新川 ダイのピックアップ方法及びピックアップ装置
JP3999744B2 (ja) 2004-01-05 2007-10-31 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置
EP1587138B1 (fr) 2004-04-13 2007-05-30 Oerlikon Assembly Equipment AG, Steinhausen Dispositif pour la montage de de puces semiconductrices et procédé de séparer de puces semiconductries d'une feuille
US7240422B2 (en) * 2004-05-11 2007-07-10 Asm Assembly Automation Ltd. Apparatus for semiconductor chip detachment
CN101512746B (zh) 2006-09-29 2010-08-11 佳能机械株式会社 片状器件拾取方法及片状器件拾取装置
JP4198745B1 (ja) 2008-05-07 2008-12-17 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法

Also Published As

Publication number Publication date
HK1142440A1 (zh) 2010-12-03
JP2010171426A (ja) 2010-08-05
TW201036089A (en) 2010-10-01
EP2211372A1 (fr) 2010-07-28
JP5569001B2 (ja) 2014-08-13
MY152753A (en) 2014-11-28
EP2211372B8 (fr) 2016-10-12
KR20100086429A (ko) 2010-07-30
KR101621561B1 (ko) 2016-05-16
TWI523130B (zh) 2016-02-21
EP2211372B1 (fr) 2016-08-17

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