SG162668A1 - Lithographic apparatus and positioning apparatus - Google Patents

Lithographic apparatus and positioning apparatus

Info

Publication number
SG162668A1
SG162668A1 SG200907993-0A SG2009079930A SG162668A1 SG 162668 A1 SG162668 A1 SG 162668A1 SG 2009079930 A SG2009079930 A SG 2009079930A SG 162668 A1 SG162668 A1 SG 162668A1
Authority
SG
Singapore
Prior art keywords
heat
exchanging body
heat exchanging
positioning
lithographic
Prior art date
Application number
SG200907993-0A
Other languages
English (en)
Inventor
Noud Jan Gilissen
Theodorus Petrus Maria Cadee
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG162668A1 publication Critical patent/SG162668A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • User Interface Of Digital Computer (AREA)
SG200907993-0A 2008-12-10 2009-12-01 Lithographic apparatus and positioning apparatus SG162668A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12138208P 2008-12-10 2008-12-10

Publications (1)

Publication Number Publication Date
SG162668A1 true SG162668A1 (en) 2010-07-29

Family

ID=41820560

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200907993-0A SG162668A1 (en) 2008-12-10 2009-12-01 Lithographic apparatus and positioning apparatus

Country Status (7)

Country Link
US (1) US8411247B2 (zh)
EP (1) EP2202581B1 (zh)
JP (1) JP5102275B2 (zh)
KR (1) KR101121654B1 (zh)
CN (1) CN101819383A (zh)
SG (1) SG162668A1 (zh)
TW (1) TWI411890B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8695353B2 (en) * 2009-12-17 2014-04-15 Empire Technology Development Llc Electrocaloric cooling
JP5790179B2 (ja) * 2011-06-13 2015-10-07 トヨタ自動車株式会社 捲回型電池、及び捲回型電池の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05203773A (ja) 1991-07-09 1993-08-10 Nikon Corp ステ−ジ装置の調整方法、およびステ−ジ装置
JP2541456B2 (ja) 1993-07-14 1996-10-09 日本電気株式会社 微細構造の作製方法
JP4745556B2 (ja) * 2001-08-20 2011-08-10 キヤノン株式会社 位置決め装置、露光装置、及びデバイス製造方法
US7164466B2 (en) * 2002-08-27 2007-01-16 Nikon Corporation Detachable heat sink
JP2005077032A (ja) * 2003-09-02 2005-03-24 Denso Corp 熱交換装置
JP2005340719A (ja) 2004-05-31 2005-12-08 Tokyo Seimitsu Co Ltd ステージ機構
US7548303B2 (en) * 2004-09-04 2009-06-16 Nikon Corporation Cooling assembly for a stage
JP2006317316A (ja) * 2005-05-13 2006-11-24 Canon Inc ステージ装置およびステージ装置を用いた露光装置
US7522258B2 (en) * 2005-06-29 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing movement of clean air to reduce contamination
US7391503B2 (en) * 2005-10-04 2008-06-24 Asml Netherlands B.V. System and method for compensating for thermal expansion of lithography apparatus or substrate
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2008159677A (ja) 2006-12-21 2008-07-10 Canon Inc ステージ装置および露光装置
US7692766B2 (en) * 2007-05-04 2010-04-06 Asml Holding Nv Lithographic apparatus

Also Published As

Publication number Publication date
TWI411890B (zh) 2013-10-11
EP2202581A1 (en) 2010-06-30
US20100141914A1 (en) 2010-06-10
EP2202581B1 (en) 2014-10-01
KR101121654B1 (ko) 2012-03-09
TW201027274A (en) 2010-07-16
JP2010141319A (ja) 2010-06-24
JP5102275B2 (ja) 2012-12-19
CN101819383A (zh) 2010-09-01
KR20100067060A (ko) 2010-06-18
US8411247B2 (en) 2013-04-02

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