SG150466A1 - Interpenetrating network for chemical mechanical polishing - Google Patents
Interpenetrating network for chemical mechanical polishingInfo
- Publication number
- SG150466A1 SG150466A1 SG200806006-3A SG2008060063A SG150466A1 SG 150466 A1 SG150466 A1 SG 150466A1 SG 2008060063 A SG2008060063 A SG 2008060063A SG 150466 A1 SG150466 A1 SG 150466A1
- Authority
- SG
- Singapore
- Prior art keywords
- chemical mechanical
- mechanical polishing
- interpenetrating network
- polishing pads
- fugitive phase
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 6
- 239000000126 substance Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/839,376 US7635290B2 (en) | 2007-08-15 | 2007-08-15 | Interpenetrating network for chemical mechanical polishing |
Publications (1)
Publication Number | Publication Date |
---|---|
SG150466A1 true SG150466A1 (en) | 2009-03-30 |
Family
ID=40029278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200806006-3A SG150466A1 (en) | 2007-08-15 | 2008-08-13 | Interpenetrating network for chemical mechanical polishing |
Country Status (7)
Country | Link |
---|---|
US (2) | US7635290B2 (de) |
EP (1) | EP2025458B1 (de) |
JP (1) | JP5216473B2 (de) |
KR (1) | KR101507611B1 (de) |
CN (2) | CN102554767B (de) |
SG (1) | SG150466A1 (de) |
TW (1) | TWI438835B (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8221196B2 (en) * | 2007-08-15 | 2012-07-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad and methods of making and using same |
US7530887B2 (en) * | 2007-08-16 | 2009-05-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with controlled wetting |
US8067305B2 (en) * | 2008-09-03 | 2011-11-29 | Ultratech, Inc. | Electrically conductive structure on a semiconductor substrate formed from printing |
US8500515B2 (en) | 2010-03-12 | 2013-08-06 | Wayne O. Duescher | Fixed-spindle and floating-platen abrasive system using spherical mounts |
US8602842B2 (en) | 2010-03-12 | 2013-12-10 | Wayne O. Duescher | Three-point fixed-spindle floating-platen abrasive system |
US8740668B2 (en) | 2010-03-12 | 2014-06-03 | Wayne O. Duescher | Three-point spindle-supported floating abrasive platen |
US8647171B2 (en) | 2010-03-12 | 2014-02-11 | Wayne O. Duescher | Fixed-spindle floating-platen workpiece loader apparatus |
US20110287698A1 (en) * | 2010-05-18 | 2011-11-24 | Hitachi Global Storage Technologies Netherlands B.V. | System, method and apparatus for elastomer pad for fabricating magnetic recording disks |
US8257545B2 (en) * | 2010-09-29 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith |
JP5429397B2 (ja) * | 2010-10-21 | 2014-02-26 | 株式会社Moresco | ガラス基板研磨用潤滑組成物及び研磨スラリー |
JP5404673B2 (ja) * | 2011-02-25 | 2014-02-05 | 株式会社東芝 | Cmp装置、研磨パッド及びcmp方法 |
US10309018B2 (en) * | 2011-05-31 | 2019-06-04 | United Technologies Corporation | Composite article having layer with co-continuous material regions |
US8801949B2 (en) | 2011-09-22 | 2014-08-12 | Dow Global Technologies Llc | Method of forming open-network polishing pads |
US9108291B2 (en) | 2011-09-22 | 2015-08-18 | Dow Global Technologies Llc | Method of forming structured-open-network polishing pads |
US8894799B2 (en) | 2011-09-22 | 2014-11-25 | Dow Global Technologies Llc | Method of forming layered-open-network polishing pads |
JP6239354B2 (ja) * | 2012-12-04 | 2017-11-29 | 不二越機械工業株式会社 | ウェーハ研磨装置 |
JP6067481B2 (ja) * | 2013-05-23 | 2017-01-25 | 株式会社東芝 | 研磨パッド、研磨方法、および研磨パッドの製造方法 |
US20160354896A1 (en) * | 2014-02-10 | 2016-12-08 | President And Fellows Of Harvard College | 3d-printed polishing pad for chemical-mechanical planarization (cmp) |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
SG11201703114QA (en) | 2014-10-17 | 2017-06-29 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
JP2016087770A (ja) * | 2014-11-11 | 2016-05-23 | 株式会社東芝 | 研磨布および研磨方法 |
TWI754275B (zh) * | 2015-10-16 | 2022-02-01 | 美商應用材料股份有限公司 | 拋光墊及形成其之方法 |
CN108290267B (zh) | 2015-10-30 | 2021-04-20 | 应用材料公司 | 形成具有期望ζ电位的抛光制品的设备与方法 |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
CN105729250B (zh) * | 2015-12-29 | 2018-01-30 | 广东工业大学 | 一种自修整磁流变柔性抛光砂轮及其磨抛方法 |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
KR102587473B1 (ko) | 2016-02-08 | 2023-10-11 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 연마를 위한 시스템들, 장치, 및 방법들 |
US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
TWI639486B (zh) * | 2018-05-31 | 2018-11-01 | 國立清華大學 | 全向整合式調節裝置 |
CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
US20210053056A1 (en) * | 2019-08-23 | 2021-02-25 | Lawrence Livermore National Security, Llc | Systems and methods for reaction and transport engineering via cellular fluidics |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4927432A (en) * | 1986-03-25 | 1990-05-22 | Rodel, Inc. | Pad material for grinding, lapping and polishing |
US4931287A (en) | 1988-06-14 | 1990-06-05 | University Of Utah | Heterogeneous interpenetrating polymer networks for the controlled release of drugs |
MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US6099394A (en) * | 1998-02-10 | 2000-08-08 | Rodel Holdings, Inc. | Polishing system having a multi-phase polishing substrate and methods relating thereto |
US6069080A (en) * | 1992-08-19 | 2000-05-30 | Rodel Holdings, Inc. | Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
US5976000A (en) | 1996-05-28 | 1999-11-02 | Micron Technology, Inc. | Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers |
JPH11285961A (ja) * | 1998-04-03 | 1999-10-19 | Nikon Corp | 研磨パッド及び研磨方法 |
JP3668046B2 (ja) * | 1998-05-11 | 2005-07-06 | 株式会社東芝 | 研磨布及びこの研磨布を用いた半導体装置の製造方法 |
EP1161322A4 (de) * | 1999-01-21 | 2003-09-24 | Rodel Inc | Verbesserte polierkissen und darauf bezogene verfahren |
US6656018B1 (en) * | 1999-04-13 | 2003-12-02 | Freudenberg Nonwovens Limited Partnership | Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles |
US6296717B1 (en) | 1999-06-11 | 2001-10-02 | International Business Machines Corporation | Regeneration of chemical mechanical polishing pads in-situ |
US6533645B2 (en) * | 2000-01-18 | 2003-03-18 | Applied Materials, Inc. | Substrate polishing article |
US6712681B1 (en) * | 2000-06-23 | 2004-03-30 | International Business Machines Corporation | Polishing pads with polymer filled fibrous web, and methods for fabricating and using same |
JP2002190460A (ja) | 2000-10-12 | 2002-07-05 | Toshiba Corp | 研磨布、研磨装置および半導体装置の製造方法 |
US6857941B2 (en) | 2001-06-01 | 2005-02-22 | Applied Materials, Inc. | Multi-phase polishing pad |
JP2002361564A (ja) * | 2001-06-06 | 2002-12-18 | Nihon Micro Coating Co Ltd | 研磨シート及びその製造方法 |
JP4317016B2 (ja) * | 2001-10-09 | 2009-08-19 | 日立化成工業株式会社 | Cmp用研磨パッド、それを用いた基板の研磨方法及びcmp用研磨パッドの製造法 |
US7037184B2 (en) * | 2003-01-22 | 2006-05-02 | Raytech Innovation Solutions, Llc | Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
TWI228768B (en) | 2002-08-08 | 2005-03-01 | Jsr Corp | Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer |
CN100417493C (zh) * | 2002-09-25 | 2008-09-10 | Ppg工业俄亥俄公司 | 平面化用的具有窗口的抛光垫片及制备方法 |
US20040226620A1 (en) | 2002-09-26 | 2004-11-18 | Daniel Therriault | Microcapillary networks |
US7311862B2 (en) | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
JP4039214B2 (ja) * | 2002-11-05 | 2008-01-30 | Jsr株式会社 | 研磨パッド |
US6979713B2 (en) * | 2002-11-25 | 2005-12-27 | 3M Innovative Properties Company | Curable compositions and abrasive articles therefrom |
CN1768417A (zh) * | 2003-04-03 | 2006-05-03 | 日立化成工业株式会社 | 研磨垫、其制造方法以及使用该研磨垫的研磨方法 |
US6802878B1 (en) * | 2003-04-17 | 2004-10-12 | 3M Innovative Properties Company | Abrasive particles, abrasive articles, and methods of making and using the same |
US20040259479A1 (en) * | 2003-06-23 | 2004-12-23 | Cabot Microelectronics Corporation | Polishing pad for electrochemical-mechanical polishing |
US7160178B2 (en) | 2003-08-07 | 2007-01-09 | 3M Innovative Properties Company | In situ activation of a three-dimensional fixed abrasive article |
US8075372B2 (en) | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
US7059950B1 (en) * | 2004-12-14 | 2006-06-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP polishing pad having grooves arranged to improve polishing medium utilization |
KR100709392B1 (ko) | 2005-07-20 | 2007-04-20 | 에스케이씨 주식회사 | 액상의 비닐계 모노머가 상호침투 가교된 형태를 갖는폴리우레탄 연마 패드 |
TW200720017A (en) * | 2005-09-19 | 2007-06-01 | Rohm & Haas Elect Mat | Water-based polishing pads having improved adhesion properties and methods of manufacture |
US7503833B2 (en) * | 2006-02-16 | 2009-03-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Three-dimensional network for chemical mechanical polishing |
US7604529B2 (en) * | 2006-02-16 | 2009-10-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Three-dimensional network for chemical mechanical polishing |
US8192257B2 (en) | 2006-04-06 | 2012-06-05 | Micron Technology, Inc. | Method of manufacture of constant groove depth pads |
JP5289787B2 (ja) * | 2007-02-01 | 2013-09-11 | 株式会社クラレ | 研磨パッド及び研磨パッドの製造方法 |
US7530887B2 (en) | 2007-08-16 | 2009-05-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with controlled wetting |
US7517277B2 (en) | 2007-08-16 | 2009-04-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Layered-filament lattice for chemical mechanical polishing |
US7828634B2 (en) | 2007-08-16 | 2010-11-09 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interconnected-multi-element-lattice polishing pad |
-
2007
- 2007-08-15 US US11/839,376 patent/US7635290B2/en active Active
-
2008
- 2008-08-05 TW TW097129622A patent/TWI438835B/zh active
- 2008-08-13 SG SG200806006-3A patent/SG150466A1/en unknown
- 2008-08-14 EP EP08162352.2A patent/EP2025458B1/de not_active Ceased
- 2008-08-14 KR KR1020080079827A patent/KR101507611B1/ko active IP Right Grant
- 2008-08-14 CN CN201210031219.9A patent/CN102554767B/zh active Active
- 2008-08-14 CN CN2008102104936A patent/CN101367204B/zh active Active
- 2008-08-15 JP JP2008209139A patent/JP5216473B2/ja active Active
-
2009
- 2009-07-16 US US12/504,189 patent/US7635291B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP5216473B2 (ja) | 2013-06-19 |
KR101507611B1 (ko) | 2015-03-31 |
EP2025458A3 (de) | 2014-04-02 |
TW200913042A (en) | 2009-03-16 |
US20090280725A1 (en) | 2009-11-12 |
US7635290B2 (en) | 2009-12-22 |
TWI438835B (zh) | 2014-05-21 |
US7635291B2 (en) | 2009-12-22 |
CN102554767A (zh) | 2012-07-11 |
EP2025458B1 (de) | 2015-06-03 |
EP2025458A2 (de) | 2009-02-18 |
US20090047871A1 (en) | 2009-02-19 |
KR20090017993A (ko) | 2009-02-19 |
CN101367204A (zh) | 2009-02-18 |
CN101367204B (zh) | 2012-11-14 |
CN102554767B (zh) | 2015-11-25 |
JP2009056585A (ja) | 2009-03-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG150466A1 (en) | Interpenetrating network for chemical mechanical polishing | |
EP2025454A3 (de) | Verbessertes chemisch-mechanisches Polierkissen und Herstellungs- und Nutzungsverfahren dafür | |
EP2025460A3 (de) | Verbessertes chemisch-mechanisches Polierkissen und Herstellungs- und Nutzungsverfahren dafür | |
GB2454343B (en) | Polishing composition for hard disk substrate | |
GB2433515B (en) | Polishing composition for hard disk substrate | |
SG150468A1 (en) | Chemical mechanical polishing pad with controlled wetting | |
TWI372094B (en) | Polishing pad for electrochemical mechanical polishing | |
GB2421955B (en) | Polishing composition for glass substrate | |
EP1938099A4 (de) | Reaktive oberflächen, substrate und verfahren zur herstellung und verwendung davon | |
HK1121199A1 (en) | High colour diamond layer | |
WO2011082155A3 (en) | Polishing pads including phase-separated polymer blend and method of making and using the same | |
TWI372093B (en) | Radial-biased polishing pad | |
GB2417034B (en) | Polishing composition | |
EP2046252A4 (de) | Verbandsubstrat | |
TWI370844B (en) | Polishing composition | |
GB0625311D0 (en) | Polishing composition for glass substrate | |
ZA200901042B (en) | Polycrystalline diamond abrasive compacts | |
EP2083027B8 (de) | Chemisch mechanisches Polierkissen und chemisch mechanisches Polierverfahren | |
EP2100325A4 (de) | Polierschlämme auf wasserbasis zum polieren eines siliziumcarbid-einkristallsubstrats und polierverfahren dafür | |
GB2415199B (en) | Polishing composition | |
WO2012082702A3 (en) | Chemical mechanical planarization (cmp) pad conditioner and method of making | |
GB0521905D0 (en) | Polishing composition | |
TWI365492B (en) | Super flat chemical mechanical polishing (sf-cmp) technology for thin film gan devices | |
EP2203399A4 (de) | Hochakustisches, nach dem nassformverfahren gebildetes substrat | |
EP2349644A4 (de) | Polierer, druckplatte eines polierers und polierverfahren |