SG148973A1 - Semiconductor device package having pseudo chips - Google Patents
Semiconductor device package having pseudo chipsInfo
- Publication number
- SG148973A1 SG148973A1 SG200804825-8A SG2008048258A SG148973A1 SG 148973 A1 SG148973 A1 SG 148973A1 SG 2008048258 A SG2008048258 A SG 2008048258A SG 148973 A1 SG148973 A1 SG 148973A1
- Authority
- SG
- Singapore
- Prior art keywords
- die
- semiconductor device
- device package
- substrate
- bonding pads
- Prior art date
Links
Classifications
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- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/819,193 US20080157398A1 (en) | 2007-01-03 | 2007-06-26 | Semiconductor device package having pseudo chips |
Publications (1)
Publication Number | Publication Date |
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SG148973A1 true SG148973A1 (en) | 2009-01-29 |
Family
ID=40197712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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SG200804825-8A SG148973A1 (en) | 2007-06-26 | 2008-06-25 | Semiconductor device package having pseudo chips |
Country Status (7)
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US (1) | US20080157398A1 (zh) |
JP (1) | JP2009010378A (zh) |
KR (1) | KR20080114603A (zh) |
CN (1) | CN101335265A (zh) |
DE (1) | DE102008002909A1 (zh) |
SG (1) | SG148973A1 (zh) |
TW (1) | TW200901396A (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US20090091017A1 (en) * | 2007-10-09 | 2009-04-09 | Fjelstad Joseph C | Partitioned Integrated Circuit Package with Central Clock Driver |
JP5401132B2 (ja) | 2009-01-20 | 2014-01-29 | 信越ポリマー株式会社 | 電波透過性装飾部材およびその製造方法 |
TWI533412B (zh) * | 2010-08-13 | 2016-05-11 | 金龍國際公司 | 半導體元件封裝結構及其形成方法 |
CN102466739B (zh) * | 2010-11-02 | 2014-04-09 | 旺矽科技股份有限公司 | 探针卡 |
JP2014103183A (ja) | 2012-11-19 | 2014-06-05 | Mitsubishi Electric Corp | 電子回路、その製造方法、および電子部品 |
DE102013202904A1 (de) * | 2013-02-22 | 2014-08-28 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Verfahren zu seiner Herstellung |
JP2017157847A (ja) * | 2017-04-21 | 2017-09-07 | 三菱電機株式会社 | 電子回路 |
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI256095B (en) * | 2004-03-11 | 2006-06-01 | Siliconware Precision Industries Co Ltd | Wafer level semiconductor package with build-up layer and process for fabricating the same |
US7453148B2 (en) * | 2006-12-20 | 2008-11-18 | Advanced Chip Engineering Technology Inc. | Structure of dielectric layers in built-up layers of wafer level package |
US7911044B2 (en) * | 2006-12-29 | 2011-03-22 | Advanced Chip Engineering Technology Inc. | RF module package for releasing stress |
US20080217761A1 (en) * | 2007-03-08 | 2008-09-11 | Advanced Chip Engineering Technology Inc. | Structure of semiconductor device package and method of the same |
US7525185B2 (en) * | 2007-03-19 | 2009-04-28 | Advanced Chip Engineering Technology, Inc. | Semiconductor device package having multi-chips with side-by-side configuration and method of the same |
US20080251908A1 (en) * | 2007-04-11 | 2008-10-16 | Advanced Chip Engineering Technology Inc. | Semiconductor device package having multi-chips with side-by-side configuration and method of the same |
-
2007
- 2007-06-26 US US11/819,193 patent/US20080157398A1/en not_active Abandoned
- 2007-08-29 TW TW096132151A patent/TW200901396A/zh unknown
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2008
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- 2008-06-25 SG SG200804825-8A patent/SG148973A1/en unknown
- 2008-06-25 JP JP2008165947A patent/JP2009010378A/ja not_active Withdrawn
- 2008-06-26 DE DE102008002909A patent/DE102008002909A1/de not_active Ceased
- 2008-06-26 KR KR1020080060751A patent/KR20080114603A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
TW200901396A (en) | 2009-01-01 |
CN101335265A (zh) | 2008-12-31 |
KR20080114603A (ko) | 2008-12-31 |
JP2009010378A (ja) | 2009-01-15 |
US20080157398A1 (en) | 2008-07-03 |
DE102008002909A1 (de) | 2009-02-19 |
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