SG139794G - Polishing system with underwater bernoulli pickup - Google Patents

Polishing system with underwater bernoulli pickup

Info

Publication number
SG139794G
SG139794G SG139794A SG139794A SG139794G SG 139794 G SG139794 G SG 139794G SG 139794 A SG139794 A SG 139794A SG 139794 A SG139794 A SG 139794A SG 139794 G SG139794 G SG 139794G
Authority
SG
Singapore
Prior art keywords
underwater
polishing system
bernoulli pickup
bernoulli
pickup
Prior art date
Application number
SG139794A
Other languages
English (en)
Inventor
Paul W Cronkhite
Bruce C Bosley
James H Jones
Asit G Patel
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to SG139794A priority Critical patent/SG139794G/en
Publication of SG139794G publication Critical patent/SG139794G/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG139794A 1985-11-01 1994-09-30 Polishing system with underwater bernoulli pickup SG139794G (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG139794A SG139794G (en) 1985-11-01 1994-09-30 Polishing system with underwater bernoulli pickup

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/793,818 US4653231A (en) 1985-11-01 1985-11-01 Polishing system with underwater Bernoulli pickup
SG139794A SG139794G (en) 1985-11-01 1994-09-30 Polishing system with underwater bernoulli pickup

Publications (1)

Publication Number Publication Date
SG139794G true SG139794G (en) 1995-01-13

Family

ID=25160891

Family Applications (1)

Application Number Title Priority Date Filing Date
SG139794A SG139794G (en) 1985-11-01 1994-09-30 Polishing system with underwater bernoulli pickup

Country Status (7)

Country Link
US (1) US4653231A (fr)
EP (1) EP0245289B1 (fr)
JP (1) JPH0632886B2 (fr)
DE (1) DE3685491D1 (fr)
HK (1) HK81895A (fr)
SG (1) SG139794G (fr)
WO (1) WO1987002608A1 (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH658216A5 (fr) * 1985-09-06 1986-10-31 Bula & Fils Mach Procede de finissage de pieces moulees ou usinees et centre de finissage pour la mise en oeuvre de ce procede.
US5885138A (en) * 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
US5679059A (en) * 1994-11-29 1997-10-21 Ebara Corporation Polishing aparatus and method
KR100390293B1 (ko) * 1993-09-21 2003-09-02 가부시끼가이샤 도시바 폴리싱장치
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US5582534A (en) * 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
US5733175A (en) * 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5679060A (en) * 1994-07-14 1997-10-21 Silicon Technology Corporation Wafer grinding machine
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US5607341A (en) * 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
KR100487590B1 (ko) * 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
US5804507A (en) * 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US7097544B1 (en) 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
US6213853B1 (en) 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
GB9921879D0 (en) * 1999-09-17 1999-11-17 Interpole Limited Method to obtain metallic lead either from lead ores or from exhausted lead-acid storage batteries
US7249992B2 (en) * 2004-07-02 2007-07-31 Strasbaugh Method, apparatus and system for use in processing wafers
NZ571914A (en) * 2008-10-10 2011-05-27 Xiaoqi Chen Non-contact lifting and locomotion device
CA2857213C (fr) * 2013-08-10 2016-11-22 Taizhou Federal Robot Technology Co., Ltd. Systeme de traitement de surface pour une piece
CN104015230B (zh) * 2014-06-23 2015-12-30 台州联帮机器人科技有限公司 一种工件表面的加工系统及加工方法
HU4795U (hu) * 2015-04-29 2017-11-28 Applied Materials Inc Berendezés több szubsztrátum kezelésére
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3701222A (en) * 1971-12-13 1972-10-31 Richardson Co Continuous sheet graining process
DE2429421C2 (de) * 1974-06-19 1981-12-10 Vits-Maschinenbau Gmbh, 4018 Langenfeld Vorrichtung zum Anheben des oberen Bogens eines Stapels mit Blasluft
DE2451549A1 (de) * 1974-10-30 1976-08-12 Mueller Georg Kugellager Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
US4184292A (en) * 1978-03-24 1980-01-22 Revlon, Inc. Vacuum chuck
JPS57154854A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Processing device for plate type material
JPS57154835A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Method and apparatus for drying tabular material
FR2505712A1 (fr) * 1981-05-18 1982-11-19 Procedes Equip Sciences Ind Sa Machine a polir automatique, pour plaquettes minces, fragiles et deformables
JPS58157141A (ja) * 1982-03-13 1983-09-19 Fuji Seiki Seizosho:Kk リ−ドフレ−ムケ−ス連続送出し装置
JPS59156666A (ja) * 1984-02-03 1984-09-05 Supiide Fuamu Kk 平面研削装置におけるワ−クの自動装填機構

Also Published As

Publication number Publication date
JPH0632886B2 (ja) 1994-05-02
WO1987002608A1 (fr) 1987-05-07
HK81895A (en) 1995-06-01
EP0245289A4 (fr) 1989-01-24
EP0245289B1 (fr) 1992-05-27
JPS63501203A (ja) 1988-05-12
US4653231A (en) 1987-03-31
EP0245289A1 (fr) 1987-11-19
DE3685491D1 (de) 1992-07-02

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