DE3685491D1 - Polieranlage mit unterwasser-bernoulli-entnahme. - Google Patents

Polieranlage mit unterwasser-bernoulli-entnahme.

Info

Publication number
DE3685491D1
DE3685491D1 DE8686905542T DE3685491T DE3685491D1 DE 3685491 D1 DE3685491 D1 DE 3685491D1 DE 8686905542 T DE8686905542 T DE 8686905542T DE 3685491 T DE3685491 T DE 3685491T DE 3685491 D1 DE3685491 D1 DE 3685491D1
Authority
DE
Germany
Prior art keywords
bernoulli
underwater
removal
polishing system
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686905542T
Other languages
English (en)
Inventor
Paul W Cronkhite
Bruce C Bosley
James H Jones
Asit G Patel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of DE3685491D1 publication Critical patent/DE3685491D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE8686905542T 1985-11-01 1986-08-25 Polieranlage mit unterwasser-bernoulli-entnahme. Expired - Lifetime DE3685491D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/793,818 US4653231A (en) 1985-11-01 1985-11-01 Polishing system with underwater Bernoulli pickup
PCT/US1986/001724 WO1987002608A1 (en) 1985-11-01 1986-08-25 Polishing system with underwater bernoulli pickup

Publications (1)

Publication Number Publication Date
DE3685491D1 true DE3685491D1 (de) 1992-07-02

Family

ID=25160891

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686905542T Expired - Lifetime DE3685491D1 (de) 1985-11-01 1986-08-25 Polieranlage mit unterwasser-bernoulli-entnahme.

Country Status (7)

Country Link
US (1) US4653231A (de)
EP (1) EP0245289B1 (de)
JP (1) JPH0632886B2 (de)
DE (1) DE3685491D1 (de)
HK (1) HK81895A (de)
SG (1) SG139794G (de)
WO (1) WO1987002608A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH658216A5 (fr) * 1985-09-06 1986-10-31 Bula & Fils Mach Procede de finissage de pieces moulees ou usinees et centre de finissage pour la mise en oeuvre de ce procede.
US5885138A (en) 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
US5679059A (en) * 1994-11-29 1997-10-21 Ebara Corporation Polishing aparatus and method
KR100390293B1 (ko) * 1993-09-21 2003-09-02 가부시끼가이샤 도시바 폴리싱장치
US5938504A (en) 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US5582534A (en) * 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
US5733175A (en) * 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5679060A (en) * 1994-07-14 1997-10-21 Silicon Technology Corporation Wafer grinding machine
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US5607341A (en) * 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
KR100487590B1 (ko) * 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US7097544B1 (en) * 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US5804507A (en) * 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
US6213853B1 (en) 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
GB9921879D0 (en) * 1999-09-17 1999-11-17 Interpole Limited Method to obtain metallic lead either from lead ores or from exhausted lead-acid storage batteries
CN101023429B (zh) * 2004-07-02 2010-09-01 斯特拉斯鲍公司 用于处理晶片的方法和系统
NZ571914A (en) * 2008-10-10 2011-05-27 Xiaoqi Chen Non-contact lifting and locomotion device
CA2857213C (en) * 2013-08-10 2016-11-22 Taizhou Federal Robot Technology Co., Ltd. A surface processing system for a work piece
CN104015230B (zh) * 2014-06-23 2015-12-30 台州联帮机器人科技有限公司 一种工件表面的加工系统及加工方法
HUE052562T2 (hu) * 2015-04-29 2021-05-28 Applied Materials Inc Nagy sebességû forgó válogató
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3701222A (en) * 1971-12-13 1972-10-31 Richardson Co Continuous sheet graining process
DE2429421C2 (de) * 1974-06-19 1981-12-10 Vits-Maschinenbau Gmbh, 4018 Langenfeld Vorrichtung zum Anheben des oberen Bogens eines Stapels mit Blasluft
DE2451549A1 (de) * 1974-10-30 1976-08-12 Mueller Georg Kugellager Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
US4184292A (en) * 1978-03-24 1980-01-22 Revlon, Inc. Vacuum chuck
JPS57154835A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Method and apparatus for drying tabular material
JPS57154854A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Processing device for plate type material
FR2505712A1 (fr) * 1981-05-18 1982-11-19 Procedes Equip Sciences Ind Sa Machine a polir automatique, pour plaquettes minces, fragiles et deformables
JPS58157141A (ja) * 1982-03-13 1983-09-19 Fuji Seiki Seizosho:Kk リ−ドフレ−ムケ−ス連続送出し装置
JPS59156666A (ja) * 1984-02-03 1984-09-05 Supiide Fuamu Kk 平面研削装置におけるワ−クの自動装填機構

Also Published As

Publication number Publication date
EP0245289A1 (de) 1987-11-19
JPS63501203A (ja) 1988-05-12
SG139794G (en) 1995-01-13
EP0245289B1 (de) 1992-05-27
JPH0632886B2 (ja) 1994-05-02
EP0245289A4 (de) 1989-01-24
US4653231A (en) 1987-03-31
HK81895A (en) 1995-06-01
WO1987002608A1 (en) 1987-05-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee