SG139537A1 - Film deposition system - Google Patents
Film deposition systemInfo
- Publication number
- SG139537A1 SG139537A1 SG200402185-3A SG2004021853A SG139537A1 SG 139537 A1 SG139537 A1 SG 139537A1 SG 2004021853 A SG2004021853 A SG 2004021853A SG 139537 A1 SG139537 A1 SG 139537A1
- Authority
- SG
- Singapore
- Prior art keywords
- stage
- processed
- film deposition
- deposition system
- processing vessel
- Prior art date
Links
- 230000008021 deposition Effects 0.000 title 1
- 239000002245 particle Substances 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
Classifications
-
- H01L21/205—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36570099A JP4419237B2 (ja) | 1999-12-22 | 1999-12-22 | 成膜装置及び被処理体の処理方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG139537A1 true SG139537A1 (en) | 2008-02-29 |
Family
ID=18484898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200402185-3A SG139537A1 (en) | 1999-12-22 | 2000-12-22 | Film deposition system |
Country Status (8)
Country | Link |
---|---|
US (2) | US20020166509A1 (ja) |
EP (1) | EP1199380B1 (ja) |
JP (1) | JP4419237B2 (ja) |
KR (1) | KR100754007B1 (ja) |
DE (1) | DE60040392D1 (ja) |
SG (1) | SG139537A1 (ja) |
TW (1) | TW466578B (ja) |
WO (1) | WO2001046491A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7024105B2 (en) | 2003-10-10 | 2006-04-04 | Applied Materials Inc. | Substrate heater assembly |
US20050176252A1 (en) * | 2004-02-10 | 2005-08-11 | Goodman Matthew G. | Two-stage load for processing both sides of a wafer |
US20060219172A1 (en) * | 2005-04-05 | 2006-10-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | PVD equipment and electrode and deposition ring thereof |
US20080289686A1 (en) * | 2007-05-23 | 2008-11-27 | Tae Kyung Won | Method and apparatus for depositing a silicon layer on a transmitting conductive oxide layer suitable for use in solar cell applications |
US8999106B2 (en) | 2007-12-19 | 2015-04-07 | Applied Materials, Inc. | Apparatus and method for controlling edge performance in an inductively coupled plasma chamber |
US9698042B1 (en) * | 2016-07-22 | 2017-07-04 | Lam Research Corporation | Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge |
JP2021012952A (ja) * | 2019-07-05 | 2021-02-04 | 東京エレクトロン株式会社 | 載置台、基板処理装置及び載置台の組立方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5578164A (en) * | 1993-12-24 | 1996-11-26 | Tokyo Electron Limited | Plasma processing apparatus and method |
US5635244A (en) * | 1995-08-28 | 1997-06-03 | Lsi Logic Corporation | Method of forming a layer of material on a wafer |
EP0786804A2 (en) * | 1996-01-26 | 1997-07-30 | Applied Materials, Inc. | Apparatus and method for processing substrates |
WO1998014636A1 (en) * | 1996-09-30 | 1998-04-09 | Lam Research Corporation | Apparatus for reducing polymer deposition on substrate support |
US5963834A (en) * | 1996-12-20 | 1999-10-05 | Tokyo Electron Limited | Method for forming a CVD film |
US5968379A (en) * | 1995-07-14 | 1999-10-19 | Applied Materials, Inc. | High temperature ceramic heater assembly with RF capability and related methods |
EP1033745A2 (en) * | 1999-03-02 | 2000-09-06 | Motorola, Inc. | Method for forming a barrier layer for use in a copper interconnect |
US6162336A (en) * | 1999-07-12 | 2000-12-19 | Chartered Semiconductor Manufacturing Ltd. | Clamping ring design to reduce wafer sticking problem in metal deposition |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5447570A (en) * | 1990-04-23 | 1995-09-05 | Genus, Inc. | Purge gas in wafer coating area selection |
US5273588A (en) * | 1992-06-15 | 1993-12-28 | Materials Research Corporation | Semiconductor wafer processing CVD reactor apparatus comprising contoured electrode gas directing means |
US5803977A (en) * | 1992-09-30 | 1998-09-08 | Applied Materials, Inc. | Apparatus for full wafer deposition |
US5800686A (en) * | 1993-04-05 | 1998-09-01 | Applied Materials, Inc. | Chemical vapor deposition chamber with substrate edge protection |
JPH07201829A (ja) * | 1993-12-28 | 1995-08-04 | Tokyo Electron Ltd | プラズマ処理装置の洗浄方法 |
US5846332A (en) * | 1996-07-12 | 1998-12-08 | Applied Materials, Inc. | Thermally floating pedestal collar in a chemical vapor deposition chamber |
US6051286A (en) * | 1997-02-12 | 2000-04-18 | Applied Materials, Inc. | High temperature, high deposition rate process and apparatus for depositing titanium layers |
US5942042A (en) * | 1997-05-23 | 1999-08-24 | Applied Materials, Inc. | Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system |
US6051122A (en) * | 1997-08-21 | 2000-04-18 | Applied Materials, Inc. | Deposition shield assembly for a semiconductor wafer processing system |
KR100292410B1 (ko) * | 1998-09-23 | 2001-06-01 | 윤종용 | 불순물 오염이 억제된 반도체 제조용 반응 챔버 |
WO2000026939A1 (en) * | 1998-10-29 | 2000-05-11 | Applied Materials, Inc. | Apparatus for coupling power through a workpiece in a semiconductor wafer processing system |
US6159299A (en) * | 1999-02-09 | 2000-12-12 | Applied Materials, Inc. | Wafer pedestal with a purge ring |
US6375748B1 (en) * | 1999-09-01 | 2002-04-23 | Applied Materials, Inc. | Method and apparatus for preventing edge deposition |
-
1999
- 1999-12-22 JP JP36570099A patent/JP4419237B2/ja not_active Expired - Lifetime
-
2000
- 2000-12-21 TW TW089127540A patent/TW466578B/zh not_active IP Right Cessation
- 2000-12-22 EP EP00985841A patent/EP1199380B1/en not_active Expired - Lifetime
- 2000-12-22 DE DE60040392T patent/DE60040392D1/de not_active Expired - Fee Related
- 2000-12-22 US US09/914,013 patent/US20020166509A1/en not_active Abandoned
- 2000-12-22 WO PCT/JP2000/009153 patent/WO2001046491A1/ja active IP Right Grant
- 2000-12-22 SG SG200402185-3A patent/SG139537A1/en unknown
- 2000-12-22 KR KR1020017010632A patent/KR100754007B1/ko active IP Right Grant
-
2003
- 2003-10-16 US US10/685,415 patent/US20040168642A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5578164A (en) * | 1993-12-24 | 1996-11-26 | Tokyo Electron Limited | Plasma processing apparatus and method |
US5968379A (en) * | 1995-07-14 | 1999-10-19 | Applied Materials, Inc. | High temperature ceramic heater assembly with RF capability and related methods |
US5635244A (en) * | 1995-08-28 | 1997-06-03 | Lsi Logic Corporation | Method of forming a layer of material on a wafer |
EP0786804A2 (en) * | 1996-01-26 | 1997-07-30 | Applied Materials, Inc. | Apparatus and method for processing substrates |
WO1998014636A1 (en) * | 1996-09-30 | 1998-04-09 | Lam Research Corporation | Apparatus for reducing polymer deposition on substrate support |
US5963834A (en) * | 1996-12-20 | 1999-10-05 | Tokyo Electron Limited | Method for forming a CVD film |
EP1033745A2 (en) * | 1999-03-02 | 2000-09-06 | Motorola, Inc. | Method for forming a barrier layer for use in a copper interconnect |
US6162336A (en) * | 1999-07-12 | 2000-12-19 | Chartered Semiconductor Manufacturing Ltd. | Clamping ring design to reduce wafer sticking problem in metal deposition |
Also Published As
Publication number | Publication date |
---|---|
EP1199380A1 (en) | 2002-04-24 |
WO2001046491A1 (fr) | 2001-06-28 |
JP4419237B2 (ja) | 2010-02-24 |
DE60040392D1 (de) | 2008-11-13 |
KR100754007B1 (ko) | 2007-09-03 |
JP2001181845A (ja) | 2001-07-03 |
KR20010102302A (ko) | 2001-11-15 |
EP1199380A4 (en) | 2005-01-19 |
EP1199380B1 (en) | 2008-10-01 |
US20020166509A1 (en) | 2002-11-14 |
US20040168642A1 (en) | 2004-09-02 |
TW466578B (en) | 2001-12-01 |
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