SG136117A1 - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method

Info

Publication number
SG136117A1
SG136117A1 SG200702551-3A SG2007025513A SG136117A1 SG 136117 A1 SG136117 A1 SG 136117A1 SG 2007025513 A SG2007025513 A SG 2007025513A SG 136117 A1 SG136117 A1 SG 136117A1
Authority
SG
Singapore
Prior art keywords
device manufacturing
lithographic apparatus
lithographic
manufacturing
Prior art date
Application number
SG200702551-3A
Other languages
English (en)
Inventor
Maurice Wijckmans
Martinus Agnes Willem Cuijpers
Jong Frederik Eduard De
Gompel Edwin Augustinus Ma Van
Rob Jansen
Gerardus Adrianus Anto Kusters
Theodorus Petrus Maria Cadee
Martin Frans Pierre Smeets
Der Meulen Frits Van
Wilhelmus Franciscus Jo Simons
Martinus Hendrikus An Leenders
Joost Jeroen Ottens
Baren Martijn Van
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG136117A1 publication Critical patent/SG136117A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L55/00—Devices or appurtenances for use in, or in connection with, pipes or pipe systems
    • F16L55/04—Devices damping pulsations or vibrations in fluids
    • F16L55/045—Devices damping pulsations or vibrations in fluids specially adapted to prevent or minimise the effects of water hammer
    • F16L55/05—Buffers therefor
    • F16L55/052—Pneumatic reservoirs
    • F16L55/053—Pneumatic reservoirs the gas in the reservoir being separated from the fluid in the pipe
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Microscoopes, Condenser (AREA)
SG200702551-3A 2006-04-06 2007-04-05 Lithographic apparatus and device manufacturing method SG136117A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78960406P 2006-04-06 2006-04-06

Publications (1)

Publication Number Publication Date
SG136117A1 true SG136117A1 (en) 2007-10-29

Family

ID=38291302

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200702551-3A SG136117A1 (en) 2006-04-06 2007-04-05 Lithographic apparatus and device manufacturing method

Country Status (7)

Country Link
US (1) US8913228B2 (ja)
EP (1) EP1843206B1 (ja)
JP (2) JP5111918B2 (ja)
KR (1) KR100885971B1 (ja)
CN (2) CN102495539B (ja)
SG (1) SG136117A1 (ja)
TW (2) TWI461854B (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1036544A1 (nl) * 2008-02-21 2009-08-24 Asml Netherlands Bv A lithographic apparatus having a chuck with a visco-elastic damping layer.
CN102057332B (zh) * 2008-06-10 2014-04-09 Asml荷兰有限公司 用于热调节光学元件的方法和系统
JP5001343B2 (ja) 2008-12-11 2012-08-15 エーエスエムエル ネザーランズ ビー．ブイ． 流体抽出システム、液浸リソグラフィ装置、及び液浸リソグラフィ装置で使用される液浸液の圧力変動を低減する方法
EP2515170B1 (en) 2011-04-20 2020-02-19 ASML Netherlands BV Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method
JP6304905B2 (ja) * 2013-12-20 2018-04-04 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィにおけるオブジェクトを位置決めするシステム
EP3137944B1 (en) * 2014-04-30 2020-03-04 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP6367382B2 (ja) 2014-06-19 2018-08-01 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置、対象物位置決めシステムおよびデバイス製造方法
US9904178B2 (en) * 2015-04-09 2018-02-27 Nikon Corporation On-board supply system for a stage assembly
JP6868571B2 (ja) * 2015-05-06 2021-05-12 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
CN110658683A (zh) * 2018-06-28 2020-01-07 上海微电子装备（集团）股份有限公司 晶片承载系统和浸没光刻设备
CN114051599A (zh) 2019-07-19 2022-02-15 Asml荷兰有限公司 温度调节系统
JP2024515487A (ja) * 2021-04-21 2024-04-10 エーエスエムエル ネザーランズ ビー．ブイ． 温度調節システム、リソグラフィ装置及びオブジェクトを温度調節するための方法
EP4102297A1 (en) * 2021-06-10 2022-12-14 ASML Netherlands B.V. Temperature conditioning system, a lithographic apparatus and a method of temperature conditioning an object
DE102021206427A1 (de) * 2021-06-22 2022-12-22 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage für die Halbleiterlithografie
DE102022125354A1 (de) * 2022-09-30 2024-04-04 Asml Netherlands B.V. Kühlvorrichtung zum Kühlen einer positionssensitiven Komponente einer Lithographieanlage

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US4509852A (en) * 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
EP0357423B1 (en) * 1988-09-02 1995-03-15 Canon Kabushiki Kaisha An exposure apparatus
JP2745413B2 (ja) * 1988-09-02 1998-04-28 キヤノン株式会社 露光装置
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US5231291A (en) * 1989-08-01 1993-07-27 Canon Kabushiki Kaisha Wafer table and exposure apparatus with the same
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US5850280A (en) * 1994-06-16 1998-12-15 Nikon Corporation Stage unit, drive table, and scanning exposure and apparatus using same
JP3225344B2 (ja) * 1996-01-26 2001-11-05 東京エレクトロン株式会社 処理装置
TW317644B (ja) * 1996-01-26 1997-10-11 Tokyo Electron Co Ltd
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US5959732A (en) * 1996-04-10 1999-09-28 Nikon Corporation Stage apparatus and a stage control method
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WO1999049504A1 (fr) 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
JP4383626B2 (ja) * 2000-04-13 2009-12-16 キヤノン株式会社 位置決め装置および露光装置
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US6478052B1 (en) * 2001-07-25 2002-11-12 Jeff Alan Conley Pulsation damping assembly and method
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SG2010050110A (en) 2002-11-12 2014-06-27 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1420300B1 (en) 2002-11-12 2015-07-29 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
SG121819A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US6848477B2 (en) * 2003-01-14 2005-02-01 Visteon Global Technologies, Inc. Fuel pressure damping system and method
TWI295414B (en) * 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1491955A1 (en) * 2003-06-27 2004-12-29 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
JP3826118B2 (ja) * 2003-07-08 2006-09-27 キヤノン株式会社 露光装置
EP1496339B1 (de) * 2003-07-09 2014-09-10 Bayerische Motoren Werke Aktiengesellschaft Induktiver Drehwinkelsensor
KR101911681B1 (ko) * 2004-01-05 2018-10-25 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
US7288864B2 (en) * 2004-03-31 2007-10-30 Nikon Corporation System and method for cooling motors of a lithographic tool
US7545478B2 (en) * 2004-05-05 2009-06-09 Asml Netherlands B.V. Lithographic apparatus, thermal conditioning system, and method for manufacturing a device
US8749762B2 (en) * 2004-05-11 2014-06-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7486381B2 (en) * 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
KR100885971B1 (ko) 2009-02-26
JP5111918B2 (ja) 2013-01-09
EP1843206A3 (en) 2008-11-26
TWI528118B (zh) 2016-04-01
CN101051188A (zh) 2007-10-10
JP5513185B2 (ja) 2014-06-04
CN102495539A (zh) 2012-06-13
TWI461854B (zh) 2014-11-21
US8913228B2 (en) 2014-12-16
US20070242245A1 (en) 2007-10-18
EP1843206B1 (en) 2012-09-05
TW200801840A (en) 2008-01-01
CN101051188B (zh) 2012-03-21
JP2007281462A (ja) 2007-10-25
TW201222172A (en) 2012-06-01
KR20070100171A (ko) 2007-10-10
JP2010147506A (ja) 2010-07-01
CN102495539B (zh) 2015-04-15
EP1843206A2 (en) 2007-10-10

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