SG129366A1 - Method of selecting a grid model for correcting a process recipe for grid deformations in a lithographic apparatus and lithographic assembly using thesame - Google Patents

Method of selecting a grid model for correcting a process recipe for grid deformations in a lithographic apparatus and lithographic assembly using thesame

Info

Publication number
SG129366A1
SG129366A1 SG200604573A SG200604573A SG129366A1 SG 129366 A1 SG129366 A1 SG 129366A1 SG 200604573 A SG200604573 A SG 200604573A SG 200604573 A SG200604573 A SG 200604573A SG 129366 A1 SG129366 A1 SG 129366A1
Authority
SG
Singapore
Prior art keywords
grid
grid model
lithographic
correcting
selecting
Prior art date
Application number
SG200604573A
Other languages
English (en)
Inventor
Hubertus Johannes Gertr Simons
Henricus Johannes Lambe Megens
Everhardus Cornelis Mos
Leonardus Henricus Verstappen
Roy Werkman
Henricus Jacobus Mar Verhoeven
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG129366A1 publication Critical patent/SG129366A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019—Calibration
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
SG200604573A 2005-07-12 2006-07-06 Method of selecting a grid model for correcting a process recipe for grid deformations in a lithographic apparatus and lithographic assembly using thesame SG129366A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US69798805P 2005-07-12 2005-07-12
US81453106P 2006-06-19 2006-06-19

Publications (1)

Publication Number Publication Date
SG129366A1 true SG129366A1 (en) 2007-02-26

Family

ID=37056533

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200604573A SG129366A1 (en) 2005-07-12 2006-07-06 Method of selecting a grid model for correcting a process recipe for grid deformations in a lithographic apparatus and lithographic assembly using thesame

Country Status (7)

Country Link
US (1) US7468795B2 (ja)
EP (1) EP1744217B1 (ja)
JP (2) JP4740057B2 (ja)
KR (1) KR100803742B1 (ja)
CN (1) CN1916770B (ja)
SG (1) SG129366A1 (ja)
TW (1) TWI340300B (ja)

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IL210832A (en) * 2010-02-19 2016-11-30 Asml Netherlands Bv Lithographic facility and method of manufacturing facility
WO2011101187A1 (en) * 2010-02-19 2011-08-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9177219B2 (en) * 2010-07-09 2015-11-03 Asml Netherlands B.V. Method of calibrating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product
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US9588441B2 (en) 2012-05-18 2017-03-07 Kla-Tencor Corporation Method and device for using substrate geometry to determine optimum substrate analysis sampling
KR101664962B1 (ko) * 2012-05-29 2016-10-11 에이에스엠엘 네델란즈 비.브이. 오버레이를 보정하기 위한 정렬 마크들의 유용도를 결정하는 방법, 및 리소그래피 장치 및 오버레이 측정 시스템의 조합
GB2503879A (en) * 2012-07-09 2014-01-15 Qoniac Gmbh Simulation of lithography overlay
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US9304403B2 (en) * 2013-01-02 2016-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for lithography alignment
US10379447B2 (en) * 2013-07-10 2019-08-13 Qoniac Gmbh Method and apparatus for simulation of lithography overlay
US11366397B2 (en) 2013-07-10 2022-06-21 Qoniac Gmbh Method and apparatus for simulation of lithography overlay
TWI560747B (en) * 2014-04-02 2016-12-01 Macromix Internat Co Ltd Method of manufacturing semiconductor and exposure system
JP6719729B2 (ja) 2015-02-23 2020-07-08 株式会社ニコン 基板処理システム及び基板処理方法、並びにデバイス製造方法
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CN114222949A (zh) * 2019-08-13 2022-03-22 Asml荷兰有限公司 用于计算特征的建模方法
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Also Published As

Publication number Publication date
KR20070008427A (ko) 2007-01-17
JP4740057B2 (ja) 2011-08-03
CN1916770A (zh) 2007-02-21
JP5208981B2 (ja) 2013-06-12
JP2010123997A (ja) 2010-06-03
TW200710596A (en) 2007-03-16
US20070021860A1 (en) 2007-01-25
CN1916770B (zh) 2011-10-19
JP2007027721A (ja) 2007-02-01
KR100803742B1 (ko) 2008-02-15
EP1744217B1 (en) 2012-03-14
TWI340300B (en) 2011-04-11
EP1744217A1 (en) 2007-01-17
US7468795B2 (en) 2008-12-23

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