SG129257A1 - A method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors - Google Patents

A method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors

Info

Publication number
SG129257A1
SG129257A1 SG200305556A SG200305556A SG129257A1 SG 129257 A1 SG129257 A1 SG 129257A1 SG 200305556 A SG200305556 A SG 200305556A SG 200305556 A SG200305556 A SG 200305556A SG 129257 A1 SG129257 A1 SG 129257A1
Authority
SG
Singapore
Prior art keywords
component
photo
expected location
optoelectronic
fixture
Prior art date
Application number
SG200305556A
Other languages
English (en)
Inventor
Robert E Mcauliffe
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of SG129257A1 publication Critical patent/SG129257A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V13/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices covered by groups G01V1/00 – G01V11/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG200305556A 2002-10-16 2003-09-22 A method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors SG129257A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/272,113 US6903360B2 (en) 2002-10-16 2002-10-16 Method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors

Publications (1)

Publication Number Publication Date
SG129257A1 true SG129257A1 (en) 2007-02-26

Family

ID=29250348

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200305556A SG129257A1 (en) 2002-10-16 2003-09-22 A method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors

Country Status (6)

Country Link
US (1) US6903360B2 (zh)
CN (1) CN1254689C (zh)
DE (1) DE10335094A1 (zh)
GB (1) GB2394284B (zh)
SG (1) SG129257A1 (zh)
TW (1) TWI284735B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6998628B2 (en) * 2002-11-21 2006-02-14 Lexmark International, Inc. Method of media type differentiation in an imaging apparatus
KR100663364B1 (ko) * 2005-07-12 2007-01-02 삼성전자주식회사 퓨즈 분리 장벽을 갖는 퓨즈 영역을 구비하는 반도체소자및 그 제조방법들
GB0525101D0 (en) * 2005-12-09 2006-01-18 Meadwestvaco Packaging Systems Shielding apparatus
CN101201371B (zh) * 2006-12-15 2011-12-21 鸿富锦精密工业（深圳）有限公司 印刷电路检测装置和方法
TWI412738B (zh) * 2006-12-22 2013-10-21 Hon Hai Prec Ind Co Ltd 印刷電路檢測裝置及方法
US8063782B2 (en) * 2007-01-22 2011-11-22 Cisco Technology, Inc. Remote inventory of devices
TWI339733B (en) * 2007-09-28 2011-04-01 Test Research Inc Electronic device testing system and method
US8212674B2 (en) 2007-10-04 2012-07-03 Cisco Technology, Inc. Inventory devices and methods
US7855567B2 (en) * 2008-04-01 2010-12-21 Test Research, Inc. Electronic device testing system and method
US8423584B2 (en) * 2008-05-08 2013-04-16 International Business Machines Corporation Conditional inclusion of resources in a computer system configuration
EP2131204B1 (en) * 2008-06-06 2012-11-14 Texas Instruments France A method and system for testing a semiconductor package
US9609895B2 (en) * 2014-08-21 2017-04-04 Rai Strategic Holdings, Inc. System and related methods, apparatuses, and computer program products for testing components of an aerosol delivery device
CN107592910B (zh) * 2015-04-15 2021-08-13 依科视朗国际有限公司 用于检查电子器件的方法
AT518369B1 (de) * 2016-02-11 2023-06-15 Zkw Group Gmbh Verfahren und ICT-Einrichtung zum Überprüfen von zumindest zwei LEDs enthaltenden Modulen einer Beleuchtungseinrichtung
JP6745117B2 (ja) * 2016-02-24 2020-08-26 Juki株式会社 検査装置、実装装置、検査方法及びプログラム
CN110365405B (zh) * 2019-06-24 2020-11-17 深圳怡化电脑股份有限公司 光电传感器检测方法、装置、可读存储介质及终端设备
CN111366840A (zh) * 2020-03-31 2020-07-03 鹤山市泰利诺电子有限公司 一种电路板快速检测方法及其装置
CN115211245A (zh) * 2020-04-08 2022-10-18 株式会社富士 图像处理装置及安装装置、图像处理方法
US11551349B2 (en) * 2020-05-22 2023-01-10 Future Dial, Inc. Defect detection and image comparison of components in an assembly
US11538148B2 (en) 2020-05-22 2022-12-27 Future Dial, Inc. Defect detection of a component in an assembly
CN116203396A (zh) * 2023-03-09 2023-06-02 深圳市燕麦科技股份有限公司 一种缺件测试方法、装置及相关设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0261505A (ja) * 1988-08-26 1990-03-01 Matsushita Electric Ind Co Ltd 部品検査方法
US5006808A (en) * 1989-03-21 1991-04-09 Bath Scientific Limited Testing electrical circuits
US5124660A (en) * 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5138266A (en) * 1989-10-20 1992-08-11 Digital Equipment Corporation Single-probe charge measurement testing method
JPH04348210A (ja) * 1991-02-18 1992-12-03 Daisho Puretetsuku:Kk プリント実装基板検査装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4650333A (en) * 1984-04-12 1987-03-17 International Business Machines Corporation System for measuring and detecting printed circuit wiring defects
JPS6361505A (ja) 1986-09-01 1988-03-17 Canon Inc 二値化回路
US5254953A (en) 1990-12-20 1993-10-19 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
JP2888829B1 (ja) * 1998-06-05 1999-05-10 日本特殊陶業株式会社 ランド付基板の検査装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0261505A (ja) * 1988-08-26 1990-03-01 Matsushita Electric Ind Co Ltd 部品検査方法
US5006808A (en) * 1989-03-21 1991-04-09 Bath Scientific Limited Testing electrical circuits
US5138266A (en) * 1989-10-20 1992-08-11 Digital Equipment Corporation Single-probe charge measurement testing method
US5124660A (en) * 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
JPH04348210A (ja) * 1991-02-18 1992-12-03 Daisho Puretetsuku:Kk プリント実装基板検査装置

Also Published As

Publication number Publication date
US6903360B2 (en) 2005-06-07
TWI284735B (en) 2007-08-01
CN1254689C (zh) 2006-05-03
CN1490631A (zh) 2004-04-21
US20040075067A1 (en) 2004-04-22
TW200406581A (en) 2004-05-01
GB2394284B (en) 2006-03-22
GB2394284A (en) 2004-04-21
GB0321581D0 (en) 2003-10-15
DE10335094A1 (de) 2004-05-13

Similar Documents

Publication Publication Date Title
SG129257A1 (en) A method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors
DE3562534D1 (en) Device for the determination of the diffuse surface reflection of a sample of small dimensions
AU2003227690A1 (en) Device and method for testing printed circuit boards, and testing probe for said device and method
ATE515008T1 (de) Rauchmelder mit zeitlicher auswertung eines rückstreusignals, testverfahren für funktionsfähigkeit eines rauchmelders
SG126025A1 (en) Method and apparatus for a twisting fixture probe for probing test access point structures
DE60204659D1 (de) Verfahren und vorrichtung zur hinderniserkennung und abstandmessung mittels infrarot
GB201119968D0 (en) Apparatus and method for inspecting pcb-mounted integrated circuits
EP0336563A3 (en) Compensating system for inspecting potentially warped printed circuit boards
DE59908245D1 (de) Vorrichtung und Verfahren zur Objektuntersuchung
TWI266872B (en) Unevenness defect inspection method and device of pattern
EP1777493A3 (en) Methods and apparatus for inspecting an object using structured light
FR2859277B1 (fr) Procede et dispositif de detection optique de position par reflexion d'un objet sur une surface quelconque
ATE467095T1 (de) Vorrichtung und verfahren zur ausrichtung von riemenscheiben
DE50002385D1 (de) Einrichtung zur inspektion einer dreidimensionalen oberflächenstruktur
DE50109393D1 (de) Verfahren und vorrichtung zum prüfen von leiterplatten mit einem paralleltester
TW200613738A (en) Method and apparatus for a twisting fixture probe for probing test access point structures
CA2428690C (en) Method and apparatus for verifying a color of an led in a printed circuit board
WO2003013213A3 (en) Optical inspection of solder joints
DE602004022585D1 (de) Messung der pyramidengrösse auf einer texturierten oberfläche
WO2002041013A3 (en) Method and system for automated measuring of electromagnetic emissions
ATE520971T1 (de) Verfahren und vorrichtung zum testen der lötbarkeit von elektrischen bauteilen
WO2004044656A3 (de) Verfahren zum spülen einer optischen linse
US6211959B1 (en) Method of checking for the presence of connection balls
GB0406665D0 (en) Testing intergrated circuits
DE60231589D1 (de) Entfernungsmessgerät