SG128565A1 - Wireless local area network communications module and integrated chip package - Google Patents

Wireless local area network communications module and integrated chip package

Info

Publication number
SG128565A1
SG128565A1 SG200603675A SG200603675A SG128565A1 SG 128565 A1 SG128565 A1 SG 128565A1 SG 200603675 A SG200603675 A SG 200603675A SG 200603675 A SG200603675 A SG 200603675A SG 128565 A1 SG128565 A1 SG 128565A1
Authority
SG
Singapore
Prior art keywords
signals
area network
local area
wireless local
chip package
Prior art date
Application number
SG200603675A
Other languages
English (en)
Inventor
Eric B Janofsky
Original Assignee
Marvell World Trade Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marvell World Trade Ltd filed Critical Marvell World Trade Ltd
Publication of SG128565A1 publication Critical patent/SG128565A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2275—Supports; Mounting means by structural association with other equipment or articles used with computer equipment associated to expansion card or bus, e.g. in PCMCIA, PC cards, Wireless USB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
    • H01L2924/19103—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Transceivers (AREA)
  • Support Of Aerials (AREA)
  • Mobile Radio Communication Systems (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
SG200603675A 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package SG128565A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/157,286 US20060285480A1 (en) 2005-06-21 2005-06-21 Wireless local area network communications module and integrated chip package

Publications (1)

Publication Number Publication Date
SG128565A1 true SG128565A1 (en) 2007-01-30

Family

ID=36649116

Family Applications (4)

Application Number Title Priority Date Filing Date
SG200603675A SG128565A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package
SG200603684A SG128568A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package
SG200603676A SG128566A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package
SG200603686A SG128569A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package

Family Applications After (3)

Application Number Title Priority Date Filing Date
SG200603684A SG128568A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package
SG200603676A SG128566A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package
SG200603686A SG128569A1 (en) 2005-06-21 2006-06-05 Wireless local area network communications module and integrated chip package

Country Status (6)

Country Link
US (1) US20060285480A1 (enExample)
EP (4) EP1737065B1 (enExample)
JP (4) JP4660428B2 (enExample)
CN (4) CN1885850B (enExample)
SG (4) SG128565A1 (enExample)
TW (4) TWI446517B (enExample)

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CN102104557A (zh) * 2009-12-18 2011-06-22 上海贝尔股份有限公司 基带电路及其应用方法
US8570224B2 (en) * 2010-05-12 2013-10-29 Qualcomm Incorporated Apparatus providing thermal management for radio frequency devices
US20110316139A1 (en) * 2010-06-23 2011-12-29 Broadcom Corporation Package for a wireless enabled integrated circuit
US20120086114A1 (en) * 2010-10-07 2012-04-12 Broadcom Corporation Millimeter devices on an integrated circuit
US8901945B2 (en) * 2011-02-23 2014-12-02 Broadcom Corporation Test board for use with devices having wirelessly enabled functional blocks and method of using same
US8928139B2 (en) 2011-09-30 2015-01-06 Broadcom Corporation Device having wirelessly enabled functional blocks
CN102800923A (zh) * 2012-08-10 2012-11-28 上海华勤通讯技术有限公司 移动终端内置天线及其移动终端
CN103066370A (zh) * 2012-12-28 2013-04-24 中兴通讯股份有限公司 一种栅格阵列封装模块及设备
KR20150002200A (ko) * 2013-06-28 2015-01-07 삼성전기주식회사 프론트엔드 모듈 및 그를 이용한 무선 통신 장치
WO2016047005A1 (ja) * 2014-09-25 2016-03-31 日本電気株式会社 アンテナシステム
US9584231B2 (en) * 2014-10-30 2017-02-28 Samsung Electronics Co., Ltd. Integrated two dimensional active antenna array communication system
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JP7027305B2 (ja) * 2015-08-25 2022-03-01 モレックス エルエルシー デジタル平面インターフェースを有する通信ノード
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JP6663504B2 (ja) 2016-03-01 2020-03-11 モレックス エルエルシー 通信ノード
US20170347490A1 (en) * 2016-05-24 2017-11-30 Texas Instruments Incorporated High-frequency antenna structure with high thermal conductivity and high surface area
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WO2018193682A1 (ja) * 2017-04-20 2018-10-25 株式会社フジクラ 無線通信装置及び基板
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Also Published As

Publication number Publication date
EP1737065A1 (en) 2006-12-27
SG128569A1 (en) 2007-01-30
CN1885850B (zh) 2013-08-28
TW200701417A (en) 2007-01-01
JP2007037100A (ja) 2007-02-08
TWI495278B (zh) 2015-08-01
SG128568A1 (en) 2007-01-30
JP2007037101A (ja) 2007-02-08
SG128566A1 (en) 2007-01-30
EP1737067B1 (en) 2016-12-28
TWI446517B (zh) 2014-07-21
EP1737069B1 (en) 2017-01-11
EP1737069A1 (en) 2006-12-27
JP2007028591A (ja) 2007-02-01
US20060285480A1 (en) 2006-12-21
TW200727601A (en) 2007-07-16
TWI438873B (zh) 2014-05-21
CN1885804B (zh) 2013-01-23
TW200707929A (en) 2007-02-16
JP4660428B2 (ja) 2011-03-30
JP4704961B2 (ja) 2011-06-22
JP4728172B2 (ja) 2011-07-20
CN1885804A (zh) 2006-12-27
EP1737067A1 (en) 2006-12-27
EP1737068A1 (en) 2006-12-27
TWI430592B (zh) 2014-03-11
CN1885847A (zh) 2006-12-27
TW200701431A (en) 2007-01-01
JP2007006471A (ja) 2007-01-11
EP1737065B1 (en) 2017-11-01
CN1885850A (zh) 2006-12-27
CN1885851A (zh) 2006-12-27
EP1737068B1 (en) 2018-03-21
JP4732959B2 (ja) 2011-07-27

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