SG117499A1 - Cleaning member and cleaning method - Google Patents

Cleaning member and cleaning method

Info

Publication number
SG117499A1
SG117499A1 SG200403827A SG200403827A SG117499A1 SG 117499 A1 SG117499 A1 SG 117499A1 SG 200403827 A SG200403827 A SG 200403827A SG 200403827 A SG200403827 A SG 200403827A SG 117499 A1 SG117499 A1 SG 117499A1
Authority
SG
Singapore
Prior art keywords
cleaning
cleaning member
cleaning method
Prior art date
Application number
SG200403827A
Other languages
English (en)
Inventor
Terada Yoshio
Toyoda Eiji
Namikawa Makoto
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG117499A1 publication Critical patent/SG117499A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/10—Polypropylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2369/00—Polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2377/00—Polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cleaning In Electrography (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200403827A 2003-06-26 2004-06-24 Cleaning member and cleaning method SG117499A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003182084 2003-06-26
JP2004126304A JP2005034834A (ja) 2003-06-26 2004-04-22 クリーニング部材およびクリーニング方法

Publications (1)

Publication Number Publication Date
SG117499A1 true SG117499A1 (en) 2005-12-29

Family

ID=33422205

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200403827A SG117499A1 (en) 2003-06-26 2004-06-24 Cleaning member and cleaning method

Country Status (8)

Country Link
US (1) US7615288B2 (ko)
EP (1) EP1491266A1 (ko)
JP (1) JP2005034834A (ko)
KR (2) KR100957282B1 (ko)
CN (1) CN1577757B (ko)
MY (1) MY137571A (ko)
SG (1) SG117499A1 (ko)
TW (2) TWI358760B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY137666A (en) 2001-04-09 2009-02-27 Nitto Denko Corp Label sheet for cleaning and conveying member having cleaning function
ES2535235T3 (es) 2004-08-26 2015-05-07 Engeneic Molecular Delivery Pty Ltd Administración de ácidos nucleicos funcionales a células de mamífero a través de minicélulas intactas obtenidas a partir de bacterias
JP4557307B2 (ja) * 2005-07-19 2010-10-06 日東電工株式会社 基板処理装置用クリーニング部材の再利用方法
US8680586B2 (en) 2007-01-05 2014-03-25 Rohm Co., Ltd. Semiconductor light emitting device including GaAs substrate and method for manufacturing the same
JP6100539B2 (ja) * 2013-01-25 2017-03-22 株式会社ニトムズ 有機質汚れ除去用粘着クリーナー
CN104512075B (zh) 2013-10-04 2017-06-23 财团法人工业技术研究院 离型层、基板结构、与柔性电子元件工艺
US20190025524A1 (en) * 2016-02-01 2019-01-24 Tomoegawa Co., Ltd Cleaner
US11298725B2 (en) * 2016-08-31 2022-04-12 Seiko Epson Corporation Sheet manufacturing apparatus
JP2020121270A (ja) * 2019-01-30 2020-08-13 日東電工株式会社 クリーニングシートおよびクリーニング機能付搬送部材
JP7270397B2 (ja) * 2019-01-30 2023-05-10 日東電工株式会社 クリーニングシートおよびクリーニング機能付搬送部材
JP7272583B2 (ja) * 2019-07-11 2023-05-12 東洋濾紙株式会社 イムノクロマトアッセイ用メンブレンの表面処理方法

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* Cited by examiner, † Cited by third party
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US3727865A (en) * 1970-10-09 1973-04-17 Rca Corp Suspension system
US3684818A (en) * 1970-10-20 1972-08-15 Sprague Electric Co Multi-layer beam-lead wiring for semiconductor packages
US4075420A (en) * 1975-08-28 1978-02-21 Burroughs Corporation Cover layer for flexible circuits
US4255630A (en) * 1979-05-29 1981-03-10 Hi-Stat Manufacturing Company, Inc. Multi-circuit electrical switch
US4318071A (en) * 1980-04-04 1982-03-02 Texas Instruments Incorporated Interface relay for high current equipment
US4530993A (en) * 1984-11-02 1985-07-23 Director General Of Agency Of Industrial Science & Technology Poly 2,2'-dichloro-4,4'-biphenylene pyromellitimide film
JPS6216284A (ja) * 1985-07-16 1987-01-24 Teijin Memorex Kk フロツピ−デイスク
DE68925791T2 (de) * 1988-12-14 1996-10-17 Idemitsu Kosan Co Polyethercopolymere, Verfahren zu ihrer Herstellung, Zusammensetzungen, diese enthalted, aus diesen geformte Gegenstände und deren Verwendung
JPH02177125A (ja) * 1988-12-28 1990-07-10 Hitachi Maxell Ltd 磁気記録媒体
US4894497A (en) * 1989-02-08 1990-01-16 Service Machine Company High temperature pressure switch assembly for use with explosion-proof enclosures
JP2923170B2 (ja) * 1993-05-26 1999-07-26 日立電線株式会社 打抜き性に優れたフィルム及びこれを用いたリードフレーム
JPH08115897A (ja) 1994-10-13 1996-05-07 Nitto Denko Corp 半導体ウエハに付着した異物の除去用粘着テ―プと除去方法
JPH10154686A (ja) 1996-11-22 1998-06-09 Toshiba Corp 半導体基板処理装置のクリーニング方法
US5902678A (en) * 1997-04-01 1999-05-11 Nitto Denko Corporation Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal
JP3669196B2 (ja) * 1998-07-27 2005-07-06 日東電工株式会社 紫外線硬化型粘着シート
US6272687B1 (en) * 2000-02-11 2001-08-14 Frank W. Cunningham Puncture proof surgical gloves
JP2001198075A (ja) 1999-11-09 2001-07-24 Nitto Denko Corp クリーニングシ―ト
JP3822763B2 (ja) * 1999-04-28 2006-09-20 日東電工株式会社 クリーニングシ―ト
US6165612A (en) * 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
JP4718667B2 (ja) * 1999-11-09 2011-07-06 日東電工株式会社 クリーニングシ―ト
CN100400185C (zh) 2000-06-06 2008-07-09 日东电工株式会社 清洁片、使用清洁片的输送件、使用清洁片与输送件的基片处理设备清洁方法
DE60124405T2 (de) * 2000-07-14 2007-02-22 Nitto Denko Corp., Ibaraki Reinigungsblatt, förderelement dafür und reinigungsverfahren für substrat-bearbeitungsvorrichtungen in dem diese verwendet werden
EP1191306B1 (en) * 2000-09-26 2006-11-22 Fuji Photo Film Co., Ltd. Distance information obtaining apparatus and distance information obtaining method
JP3888197B2 (ja) * 2001-06-13 2007-02-28 三菱電機株式会社 プローブ先端付着異物の除去部材、プローブ先端付着異物のクリーニング方法およびプロービング装置
US20040000149A1 (en) * 2002-07-01 2004-01-01 Kirkconnell Carl S. High-frequency, low-temperature regenerative heat exchanger
CN1300364C (zh) * 2002-01-16 2007-02-14 三井化学株式会社 磁性基材、其叠层体及其制造方法

Also Published As

Publication number Publication date
KR20100028075A (ko) 2010-03-11
CN1577757B (zh) 2010-04-28
KR101078104B1 (ko) 2011-10-28
TW200503096A (en) 2005-01-16
US20040265594A1 (en) 2004-12-30
MY137571A (en) 2009-02-27
KR20050002574A (ko) 2005-01-07
US7615288B2 (en) 2009-11-10
KR100957282B1 (ko) 2010-05-12
JP2005034834A (ja) 2005-02-10
TW201139000A (en) 2011-11-16
TWI358760B (en) 2012-02-21
EP1491266A1 (en) 2004-12-29
CN1577757A (zh) 2005-02-09

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