SG115642A1 - Test handler temperature monitoring system - Google Patents
Test handler temperature monitoring systemInfo
- Publication number
- SG115642A1 SG115642A1 SG200401503A SG200401503A SG115642A1 SG 115642 A1 SG115642 A1 SG 115642A1 SG 200401503 A SG200401503 A SG 200401503A SG 200401503 A SG200401503 A SG 200401503A SG 115642 A1 SG115642 A1 SG 115642A1
- Authority
- SG
- Singapore
- Prior art keywords
- monitoring system
- temperature monitoring
- test handler
- handler temperature
- test
- Prior art date
Links
- 238000012544 monitoring process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/3025—Wireless interface with the DUT
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Radiation Pyrometers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/395,401 US6971793B2 (en) | 2003-03-21 | 2003-03-21 | Test handler temperature monitoring system |
Publications (1)
Publication Number | Publication Date |
---|---|
SG115642A1 true SG115642A1 (en) | 2005-10-28 |
Family
ID=32988571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200401503A SG115642A1 (en) | 2003-03-21 | 2004-03-18 | Test handler temperature monitoring system |
Country Status (3)
Country | Link |
---|---|
US (1) | US6971793B2 (zh) |
CN (1) | CN100533702C (zh) |
SG (1) | SG115642A1 (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7064953B2 (en) * | 2001-12-27 | 2006-06-20 | Formfactor, Inc. | Electronic package with direct cooling of active electronic components |
US6891385B2 (en) * | 2001-12-27 | 2005-05-10 | Formfactor, Inc. | Probe card cooling assembly with direct cooling of active electronic components |
US8152365B2 (en) * | 2005-07-05 | 2012-04-10 | Mattson Technology, Inc. | Method and system for determining optical properties of semiconductor wafers |
JP2007171107A (ja) * | 2005-12-26 | 2007-07-05 | Fujitsu Ltd | 炉内の温度測定方法 |
CN103185855B (zh) * | 2011-12-27 | 2016-02-10 | 英业达股份有限公司 | 测试设备 |
US20140167795A1 (en) * | 2012-12-14 | 2014-06-19 | Texas Instruments Incorporated | Active feedback silicon failure analysis die temperature control system |
CN103885474A (zh) * | 2012-12-24 | 2014-06-25 | 浙江鸿禧光伏科技股份有限公司 | 一种分类检测测试机暗箱恒温调节方法 |
DE102015100762A1 (de) * | 2015-01-20 | 2016-07-21 | Infineon Technologies Ag | Behälterschalteinrichtung und Verfahren zum Überwachen einer Fluidrate |
TWI569023B (zh) * | 2015-10-16 | 2017-02-01 | Hon Tech Inc | Temperature of the test apparatus and temperature control method of the adapter |
TWI585424B (zh) * | 2015-11-13 | 2017-06-01 | Hon Tech Inc | Temperature control mechanism of electronic component bonding device, temperature control method and its application Test Equipment |
CN106444715B (zh) * | 2016-11-01 | 2019-07-09 | 合肥舒实工贸有限公司 | 一种温控器自动检测台 |
US10908208B2 (en) * | 2017-01-13 | 2021-02-02 | ams Sensors Singapore. Pte. Ltd. | Apparatus for testing an optoelectronic device and method of operating the same |
CN109283405B (zh) * | 2017-07-20 | 2021-01-29 | 泰克元有限公司 | 用于测试电子部件的分选机 |
KR102440374B1 (ko) * | 2017-07-20 | 2022-09-06 | (주)테크윙 | 전자부품 테스트용 핸들러 |
CN110244141B (zh) * | 2018-03-09 | 2021-10-08 | 泰克元有限公司 | 电子部件测试用分选机 |
EP3683588A1 (de) * | 2019-01-17 | 2020-07-22 | Lisa Dräxlmaier GmbH | Verfahren und prüfvorrichtung zum prüfen eines elektrobauteils |
JP7007677B1 (ja) * | 2021-03-11 | 2022-02-10 | 上野精機株式会社 | 電子部品検査装置 |
TWI833504B (zh) * | 2022-12-16 | 2024-02-21 | 翌實實業有限公司 | 內循環式非接觸測試設備 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4831258A (en) * | 1988-03-04 | 1989-05-16 | Exergen Corporation | Dual sensor radiation detector |
US4867574A (en) * | 1988-05-19 | 1989-09-19 | Jenkofsky John J | Ultra high speed infrared temperature measuring device |
US5249142A (en) * | 1989-03-31 | 1993-09-28 | Tokyo Electron Kyushu Limited | Indirect temperature-measurement of films formed on semiconductor wafers |
JP2544015Y2 (ja) * | 1990-10-15 | 1997-08-13 | 株式会社アドバンテスト | Ic試験装置 |
US5143450A (en) * | 1991-02-01 | 1992-09-01 | Aetrium, Inc. | Apparatus for handling devices under varying temperatures |
US5801527A (en) * | 1994-07-26 | 1998-09-01 | Tokyo Electron Limited | Apparatus and method for testing semiconductor device |
US5713666A (en) * | 1995-08-30 | 1998-02-03 | Seelink Technology | Thermal testing apparatus and method |
JP3494828B2 (ja) * | 1996-11-18 | 2004-02-09 | 株式会社アドバンテスト | 水平搬送テストハンドラ |
JPH10227828A (ja) * | 1997-02-13 | 1998-08-25 | Advantest Corp | Ic試験装置 |
US5841110A (en) * | 1997-08-27 | 1998-11-24 | Steag-Ast Gmbh | Method and apparatus for improved temperature control in rapid thermal processing (RTP) systems |
US6593761B1 (en) * | 1997-11-28 | 2003-07-15 | Kabushiki Kaisha Toshiba | Test handler for semiconductor device |
US6099597A (en) * | 1997-12-17 | 2000-08-08 | Advanced Micro Devices, Inc. | Picker nest for holding an IC package with minimized stress on an IC component during testing |
US6168311B1 (en) * | 1998-10-13 | 2001-01-02 | Checkpoint Technologies Llc | System and method for optically determining the temperature of a test object |
SG98373A1 (en) * | 1998-11-25 | 2003-09-19 | Advantest Corp | Device testing apparatus |
TW533316B (en) * | 1998-12-08 | 2003-05-21 | Advantest Corp | Testing device for electronic device |
US6190037B1 (en) * | 1999-02-19 | 2001-02-20 | Applied Materials, Inc. | Non-intrusive, on-the-fly (OTF) temperature measurement and monitoring system |
US6183127B1 (en) * | 1999-03-29 | 2001-02-06 | Eaton Corporation | System and method for the real time determination of the in situ emissivity of a workpiece during processing |
US6384487B1 (en) * | 1999-12-06 | 2002-05-07 | Micron Technology, Inc. | Bow resistant plastic semiconductor package and method of fabrication |
US6647350B1 (en) * | 2000-06-02 | 2003-11-11 | Exactus, Inc. | Radiometric temperature measurement system |
US6362640B1 (en) * | 2000-06-26 | 2002-03-26 | Advanced Micro Devices, Inc. | Design of IC package test handler with temperature controller for minimized maintenance |
JP2004507886A (ja) * | 2000-07-21 | 2004-03-11 | テンプトロニック コーポレイション | 温度制御された自動試験用熱プラットフォーム |
JP4150493B2 (ja) * | 2000-08-22 | 2008-09-17 | 株式会社東芝 | パターン描画装置における温度測定方法 |
US6518745B2 (en) * | 2000-10-10 | 2003-02-11 | Mirae Corporation | Device test handler and method for operating the same |
US6507206B1 (en) * | 2000-10-16 | 2003-01-14 | Advanced Micro Devices, Inc. | Automated prevention of transfer of an unsoaked IC package from a temperature soaking chamber to a testing chamber |
MY131859A (en) * | 2001-06-30 | 2007-09-28 | Stmicroelectronics Sdn Bhd | Test handler apparatus for smd ( surface mount devices), bga ( ball grid arrays) and csp ( chip scale packages) |
-
2003
- 2003-03-21 US US10/395,401 patent/US6971793B2/en not_active Expired - Lifetime
-
2004
- 2004-03-18 CN CNB2004100087726A patent/CN100533702C/zh not_active Expired - Lifetime
- 2004-03-18 SG SG200401503A patent/SG115642A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN1534754A (zh) | 2004-10-06 |
CN100533702C (zh) | 2009-08-26 |
US20040184508A1 (en) | 2004-09-23 |
US6971793B2 (en) | 2005-12-06 |
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