SG11202113089RA - Method for slicing off a multiplicity of wafers from workpieces during a number of slicing operations by means of a wire saw, and semiconductor wafer of monocrystalline silicon - Google Patents

Method for slicing off a multiplicity of wafers from workpieces during a number of slicing operations by means of a wire saw, and semiconductor wafer of monocrystalline silicon

Info

Publication number
SG11202113089RA
SG11202113089RA SG11202113089RA SG11202113089RA SG11202113089RA SG 11202113089R A SG11202113089R A SG 11202113089RA SG 11202113089R A SG11202113089R A SG 11202113089RA SG 11202113089R A SG11202113089R A SG 11202113089RA SG 11202113089R A SG11202113089R A SG 11202113089RA
Authority
SG
Singapore
Prior art keywords
slicing
multiplicity
wafers
semiconductor wafer
monocrystalline silicon
Prior art date
Application number
SG11202113089RA
Inventor
Georg Pietsch
Peter Wiesner
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG11202113089RA publication Critical patent/SG11202113089RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG11202113089RA 2019-05-27 2020-04-29 Method for slicing off a multiplicity of wafers from workpieces during a number of slicing operations by means of a wire saw, and semiconductor wafer of monocrystalline silicon SG11202113089RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019207719.6A DE102019207719A1 (en) 2019-05-27 2019-05-27 Method for severing a multiplicity of wafers from workpieces during a number of severing operations by means of a wire saw and semiconductor wafer made of monocrystalline silicon
PCT/EP2020/061893 WO2020239348A1 (en) 2019-05-27 2020-04-29 Method for separating a plurality of slices from workpieces during a number of separating processes by means of a wire saw, and semiconductor wafer made of monocrystalline silicon

Publications (1)

Publication Number Publication Date
SG11202113089RA true SG11202113089RA (en) 2021-12-30

Family

ID=70554016

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202113089RA SG11202113089RA (en) 2019-05-27 2020-04-29 Method for slicing off a multiplicity of wafers from workpieces during a number of slicing operations by means of a wire saw, and semiconductor wafer of monocrystalline silicon

Country Status (9)

Country Link
US (1) US20220234250A1 (en)
EP (1) EP3976335A1 (en)
JP (1) JP2022538517A (en)
KR (1) KR20220014877A (en)
CN (3) CN113891790A (en)
DE (1) DE102019207719A1 (en)
SG (1) SG11202113089RA (en)
TW (2) TWI760753B (en)
WO (1) WO2020239348A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019207719A1 (en) * 2019-05-27 2020-12-03 Siltronic Ag Method for severing a multiplicity of wafers from workpieces during a number of severing operations by means of a wire saw and semiconductor wafer made of monocrystalline silicon
TWI785592B (en) * 2021-05-04 2022-12-01 環球晶圓股份有限公司 Material analysis method
US11717930B2 (en) 2021-05-31 2023-08-08 Siltronic Corporation Method for simultaneously cutting a plurality of disks from a workpiece
WO2023074219A1 (en) * 2021-10-28 2023-05-04 東海カーボン株式会社 Polycrystalline sic molded body and method for manufacturing same
CN115107177A (en) * 2022-05-31 2022-09-27 浙江晶盛机电股份有限公司 Precision compensation method and slicing machine
US20230390962A1 (en) * 2022-06-06 2023-12-07 Globalwafers Co., Ltd. Systems and methods for controlling surface profiles of wafers sliced in a wire saw
CN116587451B (en) * 2023-06-21 2024-01-26 苏州博宏源机械制造有限公司 Semiconductor wafer material processing device and method

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DE102014208187B4 (en) * 2014-04-30 2023-07-06 Siltronic Ag Process for the simultaneous cutting of a large number of slices with a particularly uniform thickness from a workpiece
JP2016135529A (en) * 2015-01-23 2016-07-28 信越半導体株式会社 Method for cutting work-piece
DE102016211883B4 (en) * 2016-06-30 2018-02-08 Siltronic Ag Method and apparatus for resuming the wire sawing process of a workpiece after an unscheduled interruption
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CN111168868B (en) * 2020-01-17 2022-01-04 徐州鑫晶半导体科技有限公司 Wire cutting device and workpiece cutting method

Also Published As

Publication number Publication date
JP2022538517A (en) 2022-09-05
CN214026490U (en) 2021-08-24
CN113891790A (en) 2022-01-04
US20220234250A1 (en) 2022-07-28
CN111993614B (en) 2024-01-12
TW202144107A (en) 2021-12-01
DE102019207719A1 (en) 2020-12-03
CN111993614A (en) 2020-11-27
WO2020239348A1 (en) 2020-12-03
KR20220014877A (en) 2022-02-07
EP3976335A1 (en) 2022-04-06
TW202042941A (en) 2020-12-01
TWI830046B (en) 2024-01-21
TWI760753B (en) 2022-04-11

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