CN115107177A - Precision compensation method and slicing machine - Google Patents

Abstract

The application relates to a precision compensation method and a slicing machine, wherein the precision compensation method comprises the following steps: acquiring a first fluctuation curve of the surface of the silicon wafer in the direction of the axis a of the silicon rod; or acquiring a second fluctuation curve of the axis a of the silicon rod in the process of moving the movable cutting unit along the preset direction; acquiring a third fluctuation curve based on the first fluctuation curve or the second fluctuation curve, wherein the fluctuation change of the third fluctuation curve in the direction of the axis a of the silicon rod is equal to the fluctuation change of the first fluctuation curve and the second fluctuation curve in the direction of the axis a of the silicon rod and opposite to the fluctuation change of the first fluctuation curve and the second fluctuation curve in the direction of the axis a of the silicon rod; and adjusting the bending degree of the slide rail part along the direction of the silicon rod axis a, so that the fluctuation curve of the slide rail part in the direction of the silicon rod axis a is the same as the third fluctuation curve. The precision compensation method and the slicing machine solve the problem that the warpage of a silicon wafer is large due to the fact that the moving straightness of an existing feeding device in the axis direction of the silicon rod is low.

Description

Precision compensation method and slicing machine

Technical Field

The application relates to the field of semiconductor equipment, in particular to a precision compensation method and a slicing machine.

Background

A microtome is a device for cutting a semiconductor material (typically a silicon rod) into thin-sheet silicon wafers. In addition, in order to ensure that the silicon wafer does not fall off or even break in the subsequent adsorption and transfer process, the cut silicon wafer needs to be ensured to have smaller warping degree. The warp is also called bow, and specifically, the warp of a silicon wafer refers to the bending degree of the silicon wafer.

Generally, the slicing machine slices the silicon rod through the feeding device, and the straightness of the feeding device moving along the axis direction of the silicon rod directly affects the warping degree of the silicon slice cut by the feeding device.

Disclosure of Invention

Therefore, it is necessary to provide a precision compensation method and a slicing machine, which solve the problem that the prior cutter feeding device has low moving linearity along the axis direction of the silicon rod, so that the warping degree of the silicon wafer is large.

The precision compensation method is used for compensating the moving error of the feed device along the direction of the axis a of the silicon rod, the feed device comprises a moving cutting unit, a fixing unit, a sliding rail part and a sliding block part, one of the sliding rail part and the sliding block part is connected with the moving cutting unit, the other one of the sliding rail part and the sliding block part is connected with the fixing unit, and the sliding rail part and the sliding block part are in sliding fit so that the moving cutting unit can move along the preset direction relative to the fixing unit. The precision compensation method comprises the following steps: cutting the silicon rod into silicon wafers along a preset direction, and acquiring a first fluctuation curve of the surfaces of the silicon wafers in the direction of the axis a of the silicon rod; or acquiring a second fluctuation curve of the axis a of the silicon rod in the process of moving the movable cutting unit along the preset direction; acquiring a third fluctuation curve based on the first fluctuation curve or the second fluctuation curve, wherein the fluctuation change of the third fluctuation curve in the direction of the silicon rod axis a is equal in size and opposite in direction to the fluctuation change of the first fluctuation curve in the direction of the silicon rod axis a, or the fluctuation change of the third fluctuation curve in the direction of the silicon rod axis a is equal in size and opposite in direction to the fluctuation change of the second fluctuation curve in the direction of the silicon rod axis a; and adjusting the bending degree of the slide rail part along the direction of the axis a of the silicon rod, so that the fluctuation curve of the slide rail part in the direction of the axis a of the silicon rod is the same as the third fluctuation curve.

In one embodiment, a plurality of track points on the third fluctuation curve are acquired, and the bending degree of the sliding rail part in the direction of the silicon rod axis a is adjusted based on the plurality of track points, so that the fluctuation curve of the sliding rail part in the direction of the silicon rod axis a is the same as the third fluctuation curve.

In one embodiment, a ball is embedded in one side of the slide rail part connected with the slide block part, so that the slide rail part and the slide block part are in rolling connection. It can be understood that such an arrangement is advantageous to improve the smoothness of movement of the moving cutting unit and to reduce the resistance to movement of the moving cutting unit.

In one embodiment, a ball is embedded in one side of the sliding block part connected with the sliding rail part, so that the sliding rail part and the sliding block part are in rolling connection. It can be understood that such an arrangement is advantageous to improve the smoothness of movement of the moving cutting unit and to reduce the resistance to movement of the moving cutting unit.

In one embodiment, one of the movable cutting unit and the fixed unit is provided with an axial positioning surface extending along a preset direction, the axial positioning surface is stopped on one side end surface of the slide rail part along the direction of the silicon rod axis a, and part or all of one side end surface of the slide rail part is attached to the axial positioning surface.

In one embodiment, a plurality of first pressing blocks are arranged on one side, away from the axial positioning surface, of the sliding rail part, and the first pressing blocks can apply acting force to the sliding rail part towards the axial positioning surface. It can be appreciated that such an arrangement is beneficial to improving the close fit between the slide rail portion and the axial locating surface.

In one embodiment, the first pressing block is connected with the movable cutting unit through a fastener so as to apply pressing force to a sliding rail part clamped between the axial positioning surface and the first pressing block.

In one embodiment, the plurality of first compacts are uniformly distributed along the preset direction.

In one embodiment, the area of the axial positioning surface is smaller than the area of the end surface of the slide rail part far away from the slide block part. By the arrangement, the straightness of the slide rail part attached to the axial positioning surface along the axial direction of the silicon rod is effectively improved, and the moving straightness of the moving cutting unit directly or indirectly connected with the slide rail part along the axis a direction of the silicon rod is further improved.

In one embodiment, one of the movable cutting unit and the fixing unit is further provided with a radial positioning surface extending along a preset direction, the radial positioning surface is stopped at one side end surface of the slide rail part along the radial direction of the silicon rod, and one side end surface of the slide rail part is partially or completely attached to the radial positioning surface and is connected with the movable cutting unit or the fixing unit through the radial positioning surface.

In one embodiment, a plurality of second pressing blocks are arranged on one side, away from the radial positioning surface, of the sliding rail part, and the second pressing blocks can apply acting force to the sliding rail part towards the radial positioning surface. It will be appreciated that such an arrangement is beneficial to improving the close fit between the slide rail portion and the radially locating surface.

In one embodiment, the area of the radial positioning surface is smaller than the area of the end surface of the slide rail part far away from the slide block part. It can be understood that, by the arrangement, the straightness of the slide rail part attached to the radial positioning surface along the radial direction of the silicon rod is improved, and further, the moving straightness of the moving cutting unit directly or indirectly connected with the slide rail part along the radial direction of the silicon rod is improved.

The application also provides a slicing machine which comprises a cutter feeding device, and the slicing machine adopts the precision compensation method described in any one of the above embodiments to compensate the movement error of the cutter feeding device along the direction of the axis a of the silicon rod.

Compared with the prior art, according to the precision compensation method and the slicing machine provided by the application, when the movable cutting unit moves to any position along the preset direction, the offset of the axial positioning surface in the direction of the silicon rod axis a is equal to the offset of the corresponding position of the first initial two-dimensional trajectory line in the direction of the silicon rod axis a in size and opposite in direction, and the bending degree of the slide rail portion in the direction of the silicon rod axis a is equal to the bending degree of the axial positioning surface in the direction of the silicon rod axis a. Therefore, by arranging the axial positioning surface, when the movable cutting unit moves to any position along the preset direction along the slide rail part, the total offset of the movable cutting unit along the direction of the axis a of the silicon rod is zero. That is, when the movable cutting unit cuts the silicon rod in the preset direction, the movable cutting unit is not deviated in the direction along the axis a of the silicon rod.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a front view of a feed device according to an embodiment provided herein;

FIG. 2 is a side view of a feed device according to an embodiment provided herein;

fig. 3 is a top view of a feed device according to an embodiment of the present disclosure.

Reference numerals: 100. moving the cutting unit; 110. an axial positioning surface; 111. a first positioning surface; 112. a second positioning surface; 120. a radial positioning surface; 121. a third positioning surface; 122. a fourth positioning surface; 200. a fixing unit; 210. a cutting chamber body; 220. a fixed block; 221. a first connection face; 222. a second connection face; 230. assembling a boss; 231. installing a positioning surface; 300. a slide rail portion; 310. a first slide rail; 320. a second slide rail; 400. a slider portion; 410. a first slider; 420. a second slider; 500. a silicon rod; 600. a substrate; 700. a first pressing block; 800. and (4) a ball.

Detailed Description

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

A microtome is a device for cutting a semiconductor material (typically a silicon rod) into thin-sheet silicon wafers. In addition, in order to ensure that the silicon wafer does not fall off or even break in the subsequent adsorption and transfer processes, the cut silicon wafer needs to have smaller warping degree. The warp is also called bow, and specifically, the warp of a silicon wafer refers to the bending degree of the silicon wafer.

Generally, the slicing machine slices the silicon rod through the feeding device, and the straightness of the feeding device moving along the axis direction of the silicon rod directly affects the warping degree of the silicon slice cut by the feeding device.

Referring to fig. 1 to 3, the problem of the conventional feed device that the silicon wafer has a large warpage due to a low moving linearity along the axis of the silicon rod 500 is solved. The application provides a precision compensation method for compensating the movement error of a feeding device along the direction of the axis a of a silicon rod 500.

Specifically, as shown in fig. 1 to 3, the feeding device includes a movable cutting unit 100, a fixed unit 200, a rail portion 300 and a slider portion 400, one of the rail portion 300 and the slider portion 400 is connected to the movable cutting unit 100, the other is connected to the fixed unit 200, and the rail portion 300 and the slider portion 400 are slidably engaged to enable the movable cutting unit 100 to move in a preset direction with respect to the fixed unit 200.

Further, in one embodiment, in order to improve the smoothness of the movement of the movable cutting unit 100 and reduce the movement resistance of the movable cutting unit 100, in one embodiment, a ball 800 is embedded in one side of the slide rail portion 300 connected to the slider portion 400, so that the slide rail portion 300 and the slider portion 400 are connected in a rolling manner. Alternatively, in other embodiments, a ball 800 is embedded in one side of the slider part 400 connected to the slide rail part 300, so that the slide rail part 300 and the slider part 400 are connected in a rolling manner.

The precision compensation method comprises the following steps:

cutting the silicon rod 500 into silicon wafers along a preset direction, and acquiring a first fluctuation curve of the surfaces of the silicon wafers in the direction of the axis a of the silicon rod 500; or, a second fluctuation curve in the direction of the axis a of the silicon rod 500 during the movement of the mobile cutting unit 100 in the preset direction is acquired;

acquiring a third fluctuation curve based on the first fluctuation curve or the second fluctuation curve, wherein the fluctuation change of the third fluctuation curve in the direction of the axis a of the silicon rod 500 is equal in magnitude and opposite in direction to the fluctuation change of the first fluctuation curve in the direction of the axis a of the silicon rod 500, or the fluctuation change of the third fluctuation curve in the direction of the axis a of the silicon rod 500 is equal in magnitude and opposite in direction to the fluctuation change of the second fluctuation curve in the direction of the axis a of the silicon rod 500;

the degree of bending of the slide rail portion 300 along the axis a of the silicon rod 500 is adjusted such that the fluctuation curve of the slide rail portion 300 in the axis a of the silicon rod 500 is the same as the third fluctuation curve.

It should be noted that, during the movement of the movable cutting unit 100 along the predetermined direction, the movable cutting unit 100 swings to some extent in the direction of the axis a of the silicon rod 500, and therefore, the second fluctuation curve is a trajectory line of the combined movement of the movable cutting unit 100 in the predetermined direction and the direction of the axis a of the silicon rod 500. Since the silicon wafer is cut by the moving cutting unit 100 in a predetermined direction, the second fluctuation curve and the first fluctuation curve have the same shape, but are obtained in different manners.

Further, it should be noted that the fluctuation of the third fluctuation curve in the direction of the axis a of the silicon rod 500 is equal in magnitude and opposite in direction to the fluctuation of the first fluctuation curve in the direction of the axis a of the silicon rod 500, that is, the fluctuation direction of the third fluctuation curve in the direction of the axis a of the silicon rod 500 is opposite to the fluctuation direction of the first fluctuation curve in the direction of the axis a of the silicon rod 500 at the same position in the preset direction with the straight line along the preset direction as the reference, and the fluctuation range of the third fluctuation curve in the direction of the axis a of the silicon rod 500 is equal to the fluctuation range of the first fluctuation curve in the direction of the axis a of the silicon rod 500.

Similarly, the fluctuation of the third fluctuation curve in the direction of the axis a of the silicon rod 500 is equal in magnitude and opposite in direction to the fluctuation of the second fluctuation curve in the direction of the axis a of the silicon rod 500, that is, on the same position in the predetermined direction with reference to a straight line along the predetermined direction, the fluctuation direction of the third fluctuation curve in the direction of the axis a of the silicon rod 500 is opposite to the fluctuation direction of the second fluctuation curve in the direction of the axis a of the silicon rod 500, and the fluctuation range of the third fluctuation curve in the direction of the axis a of the silicon rod 500 is equal to the fluctuation range of the second fluctuation curve in the direction of the axis a of the silicon rod 500.

It can be understood that the fluctuation of the current moving cutting unit 100 is affected by the fluctuation of the previous moving cutting unit 100 and the fluctuation of the slide rail part 300 in the direction of the axis a of the silicon rod 500. Since the fluctuation of the third fluctuation curve in the direction of the axis a of the silicon rod 500 is equal to and opposite to the fluctuation of the first fluctuation curve (or the second fluctuation curve) in the direction of the axis a of the silicon rod 500, and the fluctuation curve of the slide rail portion 300 in the direction of the axis a of the silicon rod 500 is the same as the third fluctuation curve. Therefore, at any position along the predetermined direction, the variation of the fluctuation of the slide rail portion 300 in the direction of the axis a of the silicon rod 500 is equal in magnitude and opposite in direction to the original fluctuation of the moving cutting unit 100. Therefore, it can be seen that, when the current movable cutting unit 100 moves to any position along the preset direction, the fluctuation of the movable cutting unit 100 in the direction of the axis a of the silicon rod 500 is zero, that is, the movable cutting unit 100 moves linearly along the preset direction.

In conclusion, the arrangement solves the problem that the prior cutter feeding device has lower moving straightness along the axis direction of the silicon rod 500 and further causes larger warping degree of the silicon wafer.

In one embodiment, a plurality of track points on the third fluctuation curve are obtained, and the degree of bending of the sliding rail part 300 in the direction of the axis a of the silicon rod 500 is adjusted based on the plurality of track points, so that the fluctuation curve of the sliding rail part 300 in the direction of the axis a of the silicon rod 500 is the same as the third fluctuation curve.

In one embodiment, one of the movable cutting unit 100 and the fixing unit 200 is provided with an axial positioning surface 110 extending along a predetermined direction, the axial positioning surface 110 is stopped at one side end surface of the slide rail portion 300 along the direction of the axis a of the silicon rod 500, and one side end surface of the slide rail portion 300 is partially or completely attached to the axial positioning surface 110.

It should be noted that "one of the slide rail portion 300 and the slide block portion 400 is connected to the movable cutting unit 100, and the other is connected to the fixed unit 200" includes two embodiments, one of which is: the slide rail part 300 is connected to the movable cutting unit 100, the slider part 400 is connected to the fixing unit 200, and the movable cutting unit 100 can move in a predetermined direction with respect to the fixing unit 200 provided with the slider part 400 through the slide rail part 300, thereby completing the cutting of the silicon rod 500. Another embodiment is: the slider part 400 is connected to the movable cutting unit 100, the rail part 300 is connected to the fixing unit 200, and the movable cutting unit 100 can move in a predetermined direction with respect to the fixing unit 200 provided with the rail part 300 through the slider part 400, thereby completing cutting of the silicon rod 500.

Likewise, "one of the mobile cutting unit 100 and the fixed unit 200 is provided with an axial positioning surface 110 extending along a preset direction" means: when the sliding rail portion 300 is connected to the movable cutting unit 100, the axial positioning surface 110 is disposed on the movable cutting unit 100, and when the sliding rail portion 300 is connected to the fixing unit 200, the axial positioning surface 110 is disposed on the fixing unit 200.

Further, it should be noted that "the axial positioning surface 110 stops against one side end surface of the slide rail portion 300 along the direction of the axis a of the silicon rod 500" means: the axial positioning surface 110 can provide a supporting force in the direction of the axis a of the silicon rod 500 to one side end surface of the slide rail portion 300.

Furthermore, as shown in fig. 1 to fig. 3, the silicon rod 500 is adhered to the base plate 600, the base plate 600 is disposed between the silicon rod 500 and the movable cutting unit 100, the movable cutting unit 100 drives the silicon rod 500 to move by pushing the base plate 600, and after the silicon rod 500 is cut into silicon wafers, the silicon wafers are respectively adhered to the base plate 600, so as to prevent the silicon wafers from being scattered and falling off, which is beneficial for transferring the silicon wafers.

In one embodiment, as shown in fig. 3, the area of the axial positioning surface 110 is smaller than the area of the end surface of the slide rail portion 300 on the side away from the slide block portion 400. The rail portion 300 is divided into a head portion connecting the slider portion 400 and a bottom portion away from the slider portion 400, and therefore, an end surface of the rail portion 300 on the side away from the slider portion 400 refers to a bottom surface of the rail portion 300. By setting the area of the axial positioning surface 110 to be smaller than the area of the end surface of the slide rail portion 300 away from the side of the slide block portion 400, the area of the axial positioning surface 110 is effectively reduced, and the flatness error of the axial positioning surface 110 is further effectively reduced, and the difficulty in improving the flatness of the axial positioning surface 110 by a processing means is lower. Therefore, the straightness of the slide rail part 300 attached to the axial positioning surface 110 along the axial direction of the silicon rod 500 is effectively improved, and further, the moving straightness of the movable cutting unit 100 directly or indirectly connected with the slide rail part 300 along the axis a direction of the silicon rod 500 is improved, that is, the warping degree of the silicon wafer is further reduced.

In one embodiment, as shown in fig. 1 to 3, the slide rail portion 300 includes a first slide rail 310 and a second slide rail 320, the axial positioning surface 110 includes a first positioning surface 111 and a second positioning surface 112 distributed at two ends of the movable cutting unit 100 along a radial direction of the silicon rod 500, a side end surface of the first slide rail 310 is partially or entirely closely attached to the first positioning surface 111, and a side end surface of the second slide rail 320 is partially or entirely closely attached to the second positioning surface 112. As such, by providing the first slide rail 310 and the second slide rail 320, the movement stability of the mobile cutting unit 100 is enhanced. It should be noted that the slider portion 400 is provided with a plurality of first sliders 410 corresponding to the first slide rail 310, in this embodiment, the number of the first sliders 410 is, but not limited to, and the number of the first sliders 410 may also be any and integral number greater than that, which is not listed here. Similarly, the slider portion 400 is provided with a plurality of second sliders 420 corresponding to the second slide rail 320, in the embodiment, the number of the second sliders 420 is, but not limited to, any number greater than or equal to that of the second sliders 420, which is not listed here.

It is emphasized that in this embodiment, the mobile cutting unit 100 is provided with only one first positioning surface 111 and one second positioning surface 112. Therefore, the first positioning surfaces 111 can be effectively prevented from excessively limiting the first slide rail 310, and the assembly precision of the first slide rail 310 is improved. Similarly, the second positioning surfaces 112 can be effectively prevented from forming excessive limitation on the second slide rail 320, so as to improve the assembly precision of the second slide rail 320.

Specifically, in one embodiment, the first positioning surface 111 and the second positioning surface 112 may be respectively disposed on both side end surfaces of the mobile cutting unit 100 parallel to the axis a of the silicon rod 500. Thus, the first slide rail 310 and the second slide rail 320 are disposed opposite to each other, so that the stresses on the two sides of the slide rail portion 300 can be mutually offset, and the assembly stress caused by the misplacement of the first slide rail 310 and the second slide rail 320 is avoided. In another embodiment, the first positioning surface 111 and the second positioning surface 112 may also be provided at the same side end surface of the mobile cutting unit 100 along the radial direction of the silicon rod 500. In yet another embodiment, the first positioning surface 111 and the second positioning surface 112 may also be disposed at both side end surfaces of the moving cutting unit 100 along the radial direction of the silicon rod 500. It should be noted that, in the above embodiments, only the positions where the first positioning surface 111 and the second positioning surface 112 may be disposed on the movable cutting unit 100 are listed, that is, the first slide rail 310 and the second slide rail 320 are disposed on different positions of the movable cutting unit 100, but not limited thereto.

In an embodiment, as shown in fig. 1 to 3, a plurality of first pressing blocks 700 are disposed on a side of the sliding rail portion 300 away from the axial positioning surface 110, and the first pressing blocks 700 can apply a force to the sliding rail portion 300 toward the axial positioning surface 110. Thus, the close fit between the slide rail portion 300 and the axial positioning surface 110 is greatly improved.

Specifically, in one embodiment, the first press block 700 is coupled to the mobile cutting unit 100 by a fastener to apply a pressing force to the slide portion 300 sandwiched between the axial positioning surface 110 and the first press block 700. But not limited thereto, the first pressing block 700 may also be connected to the moving cutting unit 100 by means of welding.

Further, in an embodiment, the plurality of first compacts 700 are uniformly distributed along the predetermined direction. But not limited thereto, the plurality of first pressing blocks 700 may not be uniformly distributed along the preset direction, and in other embodiments, a greater number of first pressing blocks 700 may be provided at the axial positioning surface 110 with a greater degree of bending.

In one embodiment, as shown in fig. 1 to 3, one of the movable cutting unit 100 and the fixed unit 200 is further provided with a radial positioning surface 120 extending along a predetermined direction, the radial positioning surface 120 is stopped at one side end surface of the slide rail portion 300 along a radial direction of the silicon rod 500, and one side end surface of the slide rail portion 300 is partially or completely attached to the radial positioning surface 120 and is connected to the movable cutting unit 100 or the fixed unit 200 through the radial positioning surface 120. By providing the radial positioning surface 120, the slide rail portion 300 can be effectively prevented from being deformed along the radial direction of the silicon rod 500, and the straightness of the slide rail portion 300 along the radial direction of the silicon rod 500 is further improved.

It should be noted that "one of the moving cutting unit 100 and the fixed unit 200 is provided with the radial positioning surface 120 extending along the preset direction" means that: when the slide rail portion 300 is connected to the movable cutting unit 100, the radial positioning surface 120 is disposed on the movable cutting unit 100, and when the slide rail portion 300 is connected to the fixing unit 200, the radial positioning surface 120 is disposed on the fixing unit 200.

Further, it should be noted that "the radial positioning surface 120 stops against one side end surface of the slide rail portion 300 along the radial direction of the silicon rod 500" means: the radial positioning surface 120 can provide a supporting force along the radial direction of the silicon rod 500 to one end surface of the slide rail portion 300.

In an embodiment, a side of the sliding rail portion 300 away from the radial positioning surface 120 is provided with a plurality of second pressing blocks (not shown), and the second pressing blocks can apply a force to the sliding rail portion 300 towards the radial positioning surface 120. Thus, the close fit between the slide rail portion 300 and the radial positioning surface 120 is advantageously improved.

Further, in an embodiment, the area of the radial positioning surface 120 is smaller than the area of the end surface of the slide rail portion 300 on the side away from the slide block portion 400. It can be understood that, by setting the area of the radial positioning surface 120 to be smaller than the area of the end surface of the slide rail portion 300 away from the slide block portion 400, the area of the radial positioning surface 120 is effectively reduced, and the flatness error of the radial positioning surface 120 is further effectively reduced. Thus, the straightness of the slide rail part 300 attached to the radial positioning surface 120 along the radial direction of the silicon rod 500 is effectively improved, and further, the moving straightness of the movable cutting unit 100 directly or indirectly connected with the slide rail part 300 along the radial direction of the silicon rod 500 is improved.

Further, in an embodiment, as shown in fig. 3, the radial positioning surfaces 120 include a third positioning surface 121 and a fourth positioning surface 122 distributed at both ends of the moving cutting unit 100 along the radial direction of the silicon rod 500. Further, the third positioning surface 121 and the fourth positioning surface 122 may be respectively disposed at both side end surfaces of the moving cutting unit 100 parallel to the axis of the silicon rod 500. In this way, the slide rail portion 300 may apply a clamping force to the moving cutting unit 100 in the radial direction of the silicon rod 500 through the third positioning surface 121 and the fourth positioning surface 122. It should be noted that, in the present embodiment, the first positioning surface 111 and the third positioning surface 121 are a pair of mutually perpendicular and connected wall surfaces on the mobile cutting unit 100. Similarly, the second positioning surface 112 and the fourth positioning surface 122 are a pair of mutually perpendicular and connected wall surfaces on the mobile cutting unit 100. The first positioning surface 111 and the third positioning surface 121 are provided at one end of the movable cutter unit 100, and the second positioning surface 112 and the fourth positioning surface 122 are provided at the other end of the movable cutter unit 100.

In one embodiment, as shown in fig. 1 to 3, the fixing unit 200 includes a cutting chamber main body 210 and a fixing block 220, and one of the slider part 400 and the rail part 300 is connected to the cutting chamber main body 210 through the fixing block 220. Further, the fixing block 220 is provided with a first connection surface 221 and a second connection surface 222, respectively, one of the slider part 400 and the slide rail part 300 is connected to the fixing block 220 through the first connection surface 221, the cutting chamber body 210 is connected to the fixing block 220 through the second connection surface 222, and the first connection surface 221 and the second connection surface 222 are perpendicular to each other. Thus, the magnitude of the assembling stress between the slider part 400, the fixing block 220, and the cutting chamber main body 210 can be effectively reduced. Furthermore, the first connection surface 221 is parallel to the axis a of the silicon rod 500, and the second connection surface 222 is perpendicular to the axis a of the silicon rod 500. Still further, in the present embodiment, the slider part 400 is connected to the cutting chamber main body 210 through the fixing blocks 220, the number of the fixing blocks 220 is, and each fixing block 220 is connected to two first sliders 410 and two second sliders 420, respectively.

In one embodiment, as shown in fig. 1 to 3, the cutting chamber main body 210 is further provided with a mounting boss 230, and the fixing block 220 is connected to the cutting chamber main body 210 through the mounting boss 230. Further, the assembling boss 230 is provided with a mounting and positioning surface 231, the fixing block 220 is attached to the mounting and positioning surface 231 and is connected to the assembling boss 230 through the mounting and positioning surface 231, and the mounting and positioning surface 231 is parallel to the axis a of the silicon rod 500. In this way, the mounting accuracy of the fixing block 220 along the radial direction of the silicon rod 500 can be effectively improved. Also, it should be noted that the cutting chamber main body 210 is provided with a plurality of fitting bosses 230 corresponding to the plurality of fixing blocks 220, and the plurality of fitting bosses 230 are symmetrically distributed on both sides of the movable cutting unit 100 with respect to the axis a of the silicon rod 500, but only one of the fitting bosses 230 is provided with the mounting positioning surface 231. Therefore, the fixing block 220 is prevented from being difficult to accurately mount due to the fact that the mounting and positioning surfaces 231 at different positions form multiple limits on the position of the fixing block 220.

Next, an assembling method of the feeding device of the present embodiment is explained, in which the first sliding rail 310 is first mounted on one side of the movable cutting unit 100 through the third positioning surface 121 by using a fastener, the fastener is in an incompletely screwed state, the first sliding rail 310 is tightly attached to the first positioning surface 111 by using the pressing action of the first pressing block 700, and then the fastener is completely screwed, so that the first sliding rail 310 is tightly attached to the first positioning surface 111 and the third positioning surface 121 at the same time. And mounting the second slide rail 320 on the other side of the movable cutting unit 100 through the fourth positioning surface 122 by using a fastener, wherein the fastener is in an incompletely screwed state, tightly attaching the second slide rail 320 to the second positioning surface 112 by using the pressing action of the first pressing block 700, and then fully screwing the fastener, so that the second slide rail 320 is simultaneously tightly attached to the second positioning surface 112 and the fourth positioning surface 122. The slider part 400 and the slider part 300 are correspondingly mounted, the plurality of first sliders 410 and the plurality of second sliders 420 are correspondingly coupled to the plurality of fixing blocks 220, respectively, and finally, the assembly is coupled to the mounting bosses of the cutting chamber body 210 through the fixing blocks 220.

The present application also provides a slicing machine, which includes a feeding device, and the slicing machine adopts the precision compensation method described in any one of the above embodiments to compensate for a movement error of the feeding device along the direction in which the axis a of the silicon rod 500 is located.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims (12)

1. An accuracy compensation method, characterized by compensating for a movement error of a feed device along a direction in which an axis a of a silicon rod (500) is located, the feed device including a moving cutting unit (100), a fixed unit (200), a rail portion (300) and a slider portion (400), one of the rail portion (300) and the slider portion (400) being connected to the moving cutting unit (100) and the other being connected to the fixed unit (200), the rail portion (300) and the slider portion (400) being slidably fitted so that the moving cutting unit (100) can move in a preset direction with respect to the fixed unit (200);

the precision compensation method comprises the following steps:

cutting the silicon rod (500) into silicon wafers along a preset direction, and acquiring a first fluctuation curve of the surfaces of the silicon wafers in the direction of the axis a of the silicon rod (500); or, acquiring a second fluctuation curve in the direction of the axis a of the silicon rod (500) during the movement of the mobile cutting unit (100) along the preset direction;

acquiring a third fluctuation curve based on the first fluctuation curve or the second fluctuation curve, wherein the fluctuation change of the third fluctuation curve in the direction of the axis a of the silicon rod (500) is equal in magnitude and opposite in direction to the fluctuation change of the first fluctuation curve in the direction of the axis a of the silicon rod (500), or the fluctuation change of the third fluctuation curve in the direction of the axis a of the silicon rod (500) is equal in magnitude and opposite in direction to the fluctuation change of the second fluctuation curve in the direction of the axis a of the silicon rod (500);

and adjusting the bending degree of the sliding rail part (300) along the direction of the axis a of the silicon rod (500) so that the fluctuation curve of the sliding rail part (300) in the direction of the axis a of the silicon rod (500) is the same as the third fluctuation curve.

2. The accuracy compensation method according to claim 1, wherein a plurality of track points on the third fluctuation curve are acquired, and the degree of bending of the slide rail portion (300) in the direction of the axis a of the silicon rod (500) is adjusted based on the plurality of track points so that the fluctuation curve of the slide rail portion (300) in the direction of the axis a of the silicon rod (500) is the same as the third fluctuation curve.

3. The accuracy compensation method according to claim 1, wherein a ball (800) is embedded in one side of the slide rail portion (300) connected with the slider portion (400) so as to make the slide rail portion (300) and the slider portion (400) roll connected;

or a ball (800) is embedded in one side of the sliding block part (400) connected with the sliding rail part (300) so that the sliding rail part (300) is in rolling connection with the sliding block part (400).

4. The accuracy compensation method according to claim 1, wherein one of the moving cutting unit (100) and the fixed unit (200) is provided with an axial positioning surface (110) extending along a preset direction, and the axial positioning surface (110) is stopped at one side end surface of the slide rail portion (300) along a direction of an axis a of a silicon rod (500), and one side end surface of the slide rail portion (300) is partially or completely attached to the axial positioning surface (110).

5. The accuracy compensation method according to claim 4, characterized in that a side of the slide rail portion (300) remote from the axial positioning surface (110) is provided with a plurality of first pressure blocks (700), the first pressure blocks (700) being capable of exerting a force on the slide rail portion (300) towards the axial positioning surface (110).

6. The accuracy compensation method according to claim 5, characterized in that the first pressing block (700) is connected to the moving cutting unit (100) by a fastener to apply pressing force to a slide rail portion (300) sandwiched between the axial positioning face (110) and the first pressing block (700).

7. The precision compensation method according to claim 5, wherein a plurality of the first compacts (700) are uniformly distributed along a preset direction.

8. The accuracy compensation method according to claim 4, wherein an area of the axial positioning surface (110) is smaller than an area of an end surface of the slide rail portion (300) on a side away from the slide block portion (400).

9. The accuracy compensation method according to claim 1, wherein one of the moving cutting unit (100) and the fixed unit (200) is further provided with a radial positioning surface (120) extending along a preset direction, and the radial positioning surface (120) is stopped at one side end surface of the slide rail portion (300) along a radial direction of a silicon rod (500), and one side end surface of the slide rail portion (300) is partially or completely attached to the radial positioning surface (120) and connected to the moving cutting unit (100) or the fixed unit (200) through the radial positioning surface (120).

10. The accuracy compensation method according to claim 9, characterized in that a side of the slide rail portion (300) remote from the radially positioned surface (120) is provided with a plurality of second pressure blocks capable of exerting a force on the slide rail portion (300) towards the radially positioned surface (120).

11. The accuracy compensation method according to claim 9, wherein an area of the radially positioning surface (120) is smaller than an area of an end surface of the slide rail portion (300) on a side away from the slide portion (400).

12. A slicer comprising a feeding device, characterized in that the slicer compensates for a movement error of the feeding device along the direction in which the axis a of the silicon rod (500) is located using the accuracy compensation method according to any one of claims 1 to 11.

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