SG11202106437RA - Method for producing semiconductor wafers by means of a wire saw - Google Patents

Method for producing semiconductor wafers by means of a wire saw

Info

Publication number
SG11202106437RA
SG11202106437RA SG11202106437RA SG11202106437RA SG11202106437RA SG 11202106437R A SG11202106437R A SG 11202106437RA SG 11202106437R A SG11202106437R A SG 11202106437RA SG 11202106437R A SG11202106437R A SG 11202106437RA SG 11202106437R A SG11202106437R A SG 11202106437RA
Authority
SG
Singapore
Prior art keywords
semiconductor wafers
wire saw
producing semiconductor
producing
saw
Prior art date
Application number
SG11202106437RA
Inventor
Axel Beyer
Carl Frintert
Peter Wiesner
Wolfgang Gmach
Robert Kreuzeder
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG11202106437RA publication Critical patent/SG11202106437RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202106437RA 2018-12-17 2019-12-12 Method for producing semiconductor wafers by means of a wire saw SG11202106437RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018221921.4A DE102018221921A1 (en) 2018-12-17 2018-12-17 Method for manufacturing semiconductor wafers using a wire saw
PCT/EP2019/084799 WO2020126784A1 (en) 2018-12-17 2019-12-12 Method for producing semiconductor wafers using a wire saw

Publications (1)

Publication Number Publication Date
SG11202106437RA true SG11202106437RA (en) 2021-07-29

Family

ID=69055982

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202106437RA SG11202106437RA (en) 2018-12-17 2019-12-12 Method for producing semiconductor wafers by means of a wire saw

Country Status (9)

Country Link
US (1) US20220040883A1 (en)
EP (1) EP3898151B1 (en)
JP (1) JP7362740B2 (en)
KR (1) KR102631727B1 (en)
CN (1) CN113226679B (en)
DE (1) DE102018221921A1 (en)
SG (1) SG11202106437RA (en)
TW (1) TWI737069B (en)
WO (1) WO2020126784A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018221922A1 (en) * 2018-12-17 2020-06-18 Siltronic Ag Method for producing semiconductor wafers using a wire saw, wire saw and semiconductor wafer made of single-crystal silicon
EP4029670A1 (en) 2021-01-15 2022-07-20 Lapmaster Wolters GmbH Device and method for cutting a solid substrate

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4912464B1 (en) * 1969-09-25 1974-03-25
CH690845A5 (en) * 1994-05-19 2001-02-15 Tokyo Seimitsu Co Ltd A method for positioning a workpiece, and apparatus therefor.
DE19510625A1 (en) * 1995-03-23 1996-09-26 Wacker Siltronic Halbleitermat Wire saw and method for cutting slices from a workpiece
JPH09286021A (en) 1996-04-22 1997-11-04 Komatsu Electron Metals Co Ltd Cutting method of semiconductor ingot
JPH11165251A (en) 1997-12-04 1999-06-22 Tokyo Seimitsu Co Ltd Wire row displacement control method of fixed abrasive grain wire saw and device therefor
JP2000015552A (en) 1998-06-30 2000-01-18 Tokyo Seimitsu Co Ltd Cutting method and device of wire saw
US6165051A (en) * 1998-10-29 2000-12-26 Kulicke & Soffa Investments, Inc. Monitoring system for dicing saws
JP4308463B2 (en) * 2001-11-08 2009-08-05 株式会社Ｓｕｍｃｏ Wire saw
JP2003145407A (en) 2001-11-09 2003-05-20 Sharp Corp Slice device and slice method
JP4411062B2 (en) * 2003-12-25 2010-02-10 株式会社アライドマテリアル Super abrasive wire saw winding structure, super abrasive wire saw cutting device, and super abrasive wire saw winding method
US8256407B2 (en) * 2007-06-27 2012-09-04 Mitsubishi Electric Corporation Multi-wire saw and method for cutting ingot
JP6183074B2 (en) * 2013-09-03 2017-08-23 新日鐵住金株式会社 Multi-wire processing method and multi-wire processing apparatus capable of reducing warpage
FR3010922B1 (en) * 2013-09-24 2016-07-01 Commissariat Energie Atomique METHOD AND DEVICE FOR WIRED CUTTING OF A MATERIAL
DE102013219468B4 (en) * 2013-09-26 2015-04-23 Siltronic Ag A method of simultaneously separating a plurality of slices from a workpiece
DE102014208187B4 (en) * 2014-04-30 2023-07-06 Siltronic Ag Process for the simultaneous cutting of a large number of slices with a particularly uniform thickness from a workpiece
WO2016095971A1 (en) * 2014-12-16 2016-06-23 APPLIED MATERIALS SWITZERLAND SàRL Method for wire refurbishment, wire and wire saw
CN108136567B (en) * 2015-09-30 2020-06-16 古河电气工业株式会社 Diamond abrasive grain for wire tool and wire tool
JP6858202B2 (en) * 2016-04-01 2021-04-14 シュロニガー アーゲー Combination sensor
CN106239368B (en) * 2016-07-28 2019-02-22 上海交通大学 A kind of complex contour curve Grinding Error in situ detection device and method
TWI632041B (en) * 2017-09-11 2018-08-11 環球晶圓股份有限公司 Ingot slicing method and slicing abrasive kit

Also Published As

Publication number Publication date
KR102631727B1 (en) 2024-01-30
DE102018221921A1 (en) 2020-06-18
EP3898151A1 (en) 2021-10-27
US20220040883A1 (en) 2022-02-10
TW202025277A (en) 2020-07-01
WO2020126784A1 (en) 2020-06-25
JP2022513289A (en) 2022-02-07
CN113226679A (en) 2021-08-06
CN113226679B (en) 2023-07-14
EP3898151B1 (en) 2023-09-20
JP7362740B2 (en) 2023-10-17
KR20210101314A (en) 2021-08-18
TWI737069B (en) 2021-08-21

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