SG11202112760XA - Multi-chip module hybrid integrated circuit with multiple power zones that provide cold spare support - Google Patents

Multi-chip module hybrid integrated circuit with multiple power zones that provide cold spare support

Info

Publication number
SG11202112760XA
SG11202112760XA SG11202112760XA SG11202112760XA SG11202112760XA SG 11202112760X A SG11202112760X A SG 11202112760XA SG 11202112760X A SG11202112760X A SG 11202112760XA SG 11202112760X A SG11202112760X A SG 11202112760XA SG 11202112760X A SG11202112760X A SG 11202112760XA
Authority
SG
Singapore
Prior art keywords
integrated circuit
chip module
multiple power
hybrid integrated
provide cold
Prior art date
Application number
SG11202112760XA
Other languages
English (en)
Inventor
Lori Dennis
Jamie Bernard
Alan Dennis
Jane Gilliam
Jason Ross
Keith Sturcken
Dale Rickard
Original Assignee
Bae Sys Inf & Elect Sys Integ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bae Sys Inf & Elect Sys Integ filed Critical Bae Sys Inf & Elect Sys Integ
Publication of SG11202112760XA publication Critical patent/SG11202112760XA/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
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    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5382—Adaptable interconnections, e.g. for engineering changes
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    • H01L23/5386—Geometry or layout of the interconnection structure
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/3287—Power saving characterised by the action undertaken by switching off individual functional units in the computer system
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    • H01L2224/13001—Core members of the bump connector
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/151—Die mounting substrate
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
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    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Dc-Dc Converters (AREA)
SG11202112760XA 2019-05-24 2020-05-19 Multi-chip module hybrid integrated circuit with multiple power zones that provide cold spare support SG11202112760XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/422,072 US10854586B1 (en) 2019-05-24 2019-05-24 Multi-chip module hybrid integrated circuit with multiple power zones that provide cold spare support
PCT/US2020/033592 WO2020242826A1 (en) 2019-05-24 2020-05-19 Multi-chip module hybrid integrated circuit with multiple power zones that provide cold spare support

Publications (1)

Publication Number Publication Date
SG11202112760XA true SG11202112760XA (en) 2021-12-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202112760XA SG11202112760XA (en) 2019-05-24 2020-05-19 Multi-chip module hybrid integrated circuit with multiple power zones that provide cold spare support

Country Status (6)

Country Link
US (1) US10854586B1 (ja)
EP (1) EP3977510A4 (ja)
JP (1) JP7159489B2 (ja)
KR (1) KR102447242B1 (ja)
SG (1) SG11202112760XA (ja)
WO (1) WO2020242826A1 (ja)

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US11841815B1 (en) * 2021-12-31 2023-12-12 Eliyan Corporation Chiplet gearbox for low-cost multi-chip module applications

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WO2020242826A1 (en) 2020-12-03
JP2022525692A (ja) 2022-05-18
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EP3977510A1 (en) 2022-04-06
US20200373286A1 (en) 2020-11-26
US10854586B1 (en) 2020-12-01
KR20220003110A (ko) 2022-01-07
KR102447242B1 (ko) 2022-09-26

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