SG11202112558TA - Methods and apparatus for minimizing substrate backside damage - Google Patents

Methods and apparatus for minimizing substrate backside damage

Info

Publication number
SG11202112558TA
SG11202112558TA SG11202112558TA SG11202112558TA SG11202112558TA SG 11202112558T A SG11202112558T A SG 11202112558TA SG 11202112558T A SG11202112558T A SG 11202112558TA SG 11202112558T A SG11202112558T A SG 11202112558TA SG 11202112558T A SG11202112558T A SG 11202112558TA
Authority
SG
Singapore
Prior art keywords
methods
substrate backside
minimizing substrate
backside damage
damage
Prior art date
Application number
SG11202112558TA
Other languages
English (en)
Inventor
Liangfa Hu
Abdul Aziz Khaja
Sarah Bobek
Prashant Kumar Kulshreshtha
Yoichi Suzuki
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11202112558TA publication Critical patent/SG11202112558TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
SG11202112558TA 2019-05-16 2020-04-22 Methods and apparatus for minimizing substrate backside damage SG11202112558TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962848935P 2019-05-16 2019-05-16
PCT/US2020/029203 WO2020231609A1 (en) 2019-05-16 2020-04-22 Methods and apparatus for minimizing substrate backside damage

Publications (1)

Publication Number Publication Date
SG11202112558TA true SG11202112558TA (en) 2021-12-30

Family

ID=73245323

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202112558TA SG11202112558TA (en) 2019-05-16 2020-04-22 Methods and apparatus for minimizing substrate backside damage

Country Status (7)

Country Link
US (2) US11756819B2 (zh)
JP (1) JP2022532775A (zh)
KR (1) KR20220024045A (zh)
CN (1) CN113994463A (zh)
SG (1) SG11202112558TA (zh)
TW (1) TW202044480A (zh)
WO (1) WO2020231609A1 (zh)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4330949B2 (ja) * 2003-07-01 2009-09-16 東京エレクトロン株式会社 プラズマｃｖｄ成膜方法
JP4674792B2 (ja) * 2003-12-05 2011-04-20 東京エレクトロン株式会社 静電チャック
US7672110B2 (en) 2005-08-29 2010-03-02 Applied Materials, Inc. Electrostatic chuck having textured contact surface
WO2009058376A2 (en) * 2007-10-31 2009-05-07 Lam Research Corporation Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body
WO2010019430A2 (en) 2008-08-12 2010-02-18 Applied Materials, Inc. Electrostatic chuck assembly
US20120097330A1 (en) * 2010-10-20 2012-04-26 Applied Materials, Inc. Dual delivery chamber design
CN103493194B (zh) 2011-06-02 2016-05-18 应用材料公司 静电夹盘的氮化铝电介质修复
US9916998B2 (en) 2012-12-04 2018-03-13 Applied Materials, Inc. Substrate support assembly having a plasma resistant protective layer
US9358702B2 (en) * 2013-01-18 2016-06-07 Applied Materials, Inc. Temperature management of aluminium nitride electrostatic chuck
JP6868553B2 (ja) * 2014-08-15 2021-05-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ プラズマ化学気相堆積システムにおいて高温で圧縮又は引張応力を有するウェハを処理する方法及び装置
KR102174964B1 (ko) 2014-09-30 2020-11-05 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
US10020218B2 (en) * 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
US20190080949A1 (en) * 2017-09-08 2019-03-14 Applied Materials, Inc. Soft chucking and dechucking for electrostatic chucking substrate supports
DE102018117393A1 (de) 2018-07-18 2020-01-23 Infineon Technologies Ag Auflagetisch, auflagetischbaugruppe,verarbeitungsanordnung und verfahren dafür

Also Published As

Publication number Publication date
TW202044480A (zh) 2020-12-01
WO2020231609A1 (en) 2020-11-19
CN113994463A (zh) 2022-01-28
US11756819B2 (en) 2023-09-12
KR20220024045A (ko) 2022-03-03
US20230386883A1 (en) 2023-11-30
JP2022532775A (ja) 2022-07-19
US20200365441A1 (en) 2020-11-19

Similar Documents

Publication Publication Date Title
EP3648151C0 (en) SUBSTRATE PROCESSING DEVICE FOR PROCESSING SUBSTRATES
SG10201911998QA (en) Substrate processing method and substrate processing apparatus
EP3990221A4 (en) ADVANCED SUPPORT DEVICE
EP3298622A4 (en) METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
EP3872840A4 (en) SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
EP4079445A4 (en) SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
SG10201908830SA (en) Pre-alignment apparatus and method
EP3738711A4 (en) WORKPIECE CARRIER DEVICE AND WORKPIECE CARRIER METHOD
EP3643095A4 (en) METHOD FOR IMPLEMENTING A RLAU METHOD AND DEVICE THEREFOR
GB201917734D0 (en) Method, substrate and apparatus
EP4075511A4 (en) DISPLAY SUBSTRATE AND DISPLAY APPARATUS
EP4033840A4 (en) VEHICLE CONFIGURATION PROCEDURE AND RELATED DEVICE
EP3522207A4 (en) WAFER SUPPLY APPARATUS AND COMPONENT MOUNTING APPARATUS
TWI800551B (zh) 用以將基板平坦化之裝置及方法
EP3489620C0 (en) SUBSTRATE INSPECTION APPARATUS AND RELATED METHOD
SG10202009297VA (en) Substrate support and plasma processing apparatus
EP3642386A4 (en) DEVICE AND METHOD FOR SUBSTRATE PROCESSING
EP3861569A4 (en) APPARATUS AND METHOD FOR ASSISTING DEBONDING AND DEBONDING PROCEDURES THEREOF
SG10201909553YA (en) Substrate processing apparatus
TWI800660B (zh) 基板處理裝置及基板處理方法
EP3525566A4 (en) SUBSTRATE INSPECTION DEVICE AND SUBSTRATE DISTORTION COMPENSATION METHOD USING THE SAME
EP3268987A4 (en) Apparatus and method for chucking warped wafers
SG11202112558TA (en) Methods and apparatus for minimizing substrate backside damage
SG11202112722UA (en) Substrate processing methods and apparatus
SG10201912340PA (en) Pre-alignment apparatus and method for warped wafer