SG11202111977XA - Method for inspecting semiconductor and semiconductor inspecting device - Google Patents
Method for inspecting semiconductor and semiconductor inspecting deviceInfo
- Publication number
- SG11202111977XA SG11202111977XA SG11202111977XA SG11202111977XA SG11202111977XA SG 11202111977X A SG11202111977X A SG 11202111977XA SG 11202111977X A SG11202111977X A SG 11202111977XA SG 11202111977X A SG11202111977X A SG 11202111977XA SG 11202111977X A SG11202111977X A SG 11202111977XA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor
- inspecting
- inspecting device
- inspecting semiconductor
- semiconductor inspecting
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 2
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/045—Combinations of networks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T3/00—Geometric image transformations in the plane of the image
- G06T3/40—Scaling of whole images or parts thereof, e.g. expanding or contracting
- G06T3/4053—Scaling of whole images or parts thereof, e.g. expanding or contracting based on super-resolution, i.e. the output image resolution being higher than the sensor resolution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20084—Artificial neural networks [ANN]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Biophysics (AREA)
- Mathematical Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Artificial Intelligence (AREA)
- Biomedical Technology (AREA)
- Software Systems (AREA)
- Computational Linguistics (AREA)
- Data Mining & Analysis (AREA)
- Evolutionary Computation (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Quality & Reliability (AREA)
- Image Analysis (AREA)
- Image Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019103831 | 2019-06-03 | ||
| PCT/JP2020/016753 WO2020246150A1 (fr) | 2019-06-03 | 2020-04-16 | Procédé d'inspection de semi-conducteur et dispositif d'inspection de semi-conducteur |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202111977XA true SG11202111977XA (en) | 2021-11-29 |
Family
ID=73652093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202111977XA SG11202111977XA (en) | 2019-06-03 | 2020-04-16 | Method for inspecting semiconductor and semiconductor inspecting device |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20220301135A1 (fr) |
| EP (1) | EP3958210A4 (fr) |
| JP (1) | JP7413376B2 (fr) |
| KR (1) | KR20220016030A (fr) |
| CN (1) | CN113966524A (fr) |
| SG (1) | SG11202111977XA (fr) |
| TW (1) | TW202101292A (fr) |
| WO (1) | WO2020246150A1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220067525A1 (en) * | 2020-08-25 | 2022-03-03 | Nvidia Corporation | Techniques for pruning neural networks |
| JP2022135215A (ja) * | 2021-03-05 | 2022-09-15 | 株式会社日立ハイテク | 学習器の学習方法、及び画像生成システム |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6848087B2 (en) * | 2001-05-30 | 2005-01-25 | Credence Systems Corporation | Sub-resolution alignment of images |
| JP2009162718A (ja) * | 2008-01-10 | 2009-07-23 | Olympus Corp | 基板検査装置および検査領域設定方法 |
| JP2015098342A (ja) | 2013-11-19 | 2015-05-28 | 株式会社エンプラス | 密閉容器および密閉容器セット |
| CN105849882B (zh) | 2013-12-26 | 2019-04-30 | 浜松光子学株式会社 | 图像处理方法、图像处理装置、图像处理程序及存储有图像处理程序的存储介质 |
| US9965901B2 (en) * | 2015-11-19 | 2018-05-08 | KLA—Tencor Corp. | Generating simulated images from design information |
| US11205119B2 (en) * | 2015-12-22 | 2021-12-21 | Applied Materials Israel Ltd. | Method of deep learning-based examination of a semiconductor specimen and system thereof |
| US10648924B2 (en) * | 2016-01-04 | 2020-05-12 | Kla-Tencor Corp. | Generating high resolution images from low resolution images for semiconductor applications |
| US10395356B2 (en) * | 2016-05-25 | 2019-08-27 | Kla-Tencor Corp. | Generating simulated images from input images for semiconductor applications |
| US10282510B2 (en) | 2017-04-07 | 2019-05-07 | Fei Company | Alignment of CAD data to images in high resolution optical fault analysis |
| US10733744B2 (en) * | 2017-05-11 | 2020-08-04 | Kla-Tencor Corp. | Learning based approach for aligning images acquired with different modalities |
| JP6957197B2 (ja) * | 2017-05-17 | 2021-11-02 | キヤノン株式会社 | 画像処理装置および画像処理方法 |
| JP7002949B2 (ja) * | 2018-01-22 | 2022-01-20 | 株式会社日立ハイテク | 画像評価方法及び画像評価装置 |
-
2020
- 2020-04-16 CN CN202080041089.XA patent/CN113966524A/zh active Pending
- 2020-04-16 EP EP20818826.8A patent/EP3958210A4/fr active Pending
- 2020-04-16 KR KR1020217030941A patent/KR20220016030A/ko unknown
- 2020-04-16 JP JP2021524695A patent/JP7413376B2/ja active Active
- 2020-04-16 WO PCT/JP2020/016753 patent/WO2020246150A1/fr unknown
- 2020-04-16 SG SG11202111977XA patent/SG11202111977XA/en unknown
- 2020-04-16 US US17/608,857 patent/US20220301135A1/en active Pending
- 2020-05-15 TW TW109116147A patent/TW202101292A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202101292A (zh) | 2021-01-01 |
| WO2020246150A1 (fr) | 2020-12-10 |
| EP3958210A1 (fr) | 2022-02-23 |
| EP3958210A4 (fr) | 2023-05-03 |
| JP7413376B2 (ja) | 2024-01-15 |
| KR20220016030A (ko) | 2022-02-08 |
| US20220301135A1 (en) | 2022-09-22 |
| JPWO2020246150A1 (fr) | 2020-12-10 |
| CN113966524A (zh) | 2022-01-21 |
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