SG11202012833YA - Substrate carrier and substrate carrier stack - Google Patents

Substrate carrier and substrate carrier stack

Info

Publication number
SG11202012833YA
SG11202012833YA SG11202012833YA SG11202012833YA SG11202012833YA SG 11202012833Y A SG11202012833Y A SG 11202012833YA SG 11202012833Y A SG11202012833Y A SG 11202012833YA SG 11202012833Y A SG11202012833Y A SG 11202012833YA SG 11202012833Y A SG11202012833Y A SG 11202012833YA
Authority
SG
Singapore
Prior art keywords
substrate carrier
stack
substrate
carrier stack
carrier
Prior art date
Application number
SG11202012833YA
Other languages
English (en)
Inventor
Thomas Schober
Bernd Rahrbach
Christian Wohanka
Yves Fenner
Gerhard Dovids
John Fiddes
Original Assignee
Murata Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/185,546 external-priority patent/US10643876B2/en
Application filed by Murata Machinery Ltd filed Critical Murata Machinery Ltd
Publication of SG11202012833YA publication Critical patent/SG11202012833YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Stacking Of Articles And Auxiliary Devices (AREA)
SG11202012833YA 2018-06-27 2019-06-17 Substrate carrier and substrate carrier stack SG11202012833YA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE202018103663 2018-06-27
US16/185,546 US10643876B2 (en) 2016-06-28 2018-11-09 Substrate carrier and substrate carrier stack
DE202019101793.7U DE202019101793U1 (de) 2018-06-27 2019-03-29 Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung
PCT/US2019/037454 WO2020005611A1 (en) 2018-06-27 2019-06-17 Substrate carrier and substrate carrier stack

Publications (1)

Publication Number Publication Date
SG11202012833YA true SG11202012833YA (en) 2021-01-28

Family

ID=66951791

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202012833YA SG11202012833YA (en) 2018-06-27 2019-06-17 Substrate carrier and substrate carrier stack

Country Status (9)

Country Link
EP (1) EP3588542B1 (de)
JP (1) JP7156404B2 (de)
KR (1) KR102454080B1 (de)
CN (1) CN112352307A (de)
DE (1) DE202019101793U1 (de)
IL (1) IL279581B1 (de)
SG (1) SG11202012833YA (de)
TW (1) TWI793341B (de)
WO (1) WO2020005611A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7384132B2 (ja) * 2020-09-04 2023-11-21 村田機械株式会社 物品収容装置
WO2023171220A1 (ja) * 2022-03-08 2023-09-14 村田機械株式会社 ウェハ容器及びウェハ支持体

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6837374B2 (en) * 2001-07-15 2005-01-04 Entegris, Inc. 300MM single stackable film frame carrier
US7682455B2 (en) 2003-07-11 2010-03-23 Tec-Sem Ag Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components
TWI399823B (zh) 2005-07-09 2013-06-21 Tec Sem Ag 用以存放基板之裝置
JP2007035762A (ja) * 2005-07-25 2007-02-08 Murata Mach Ltd 枚葉搬送用トレイ
JP4903429B2 (ja) * 2005-12-05 2012-03-28 ミライアル株式会社 載置トレイ及び薄板保持容器
US8365919B2 (en) * 2005-12-29 2013-02-05 Shin-Etsu Polymer Co., Ltd. Substrate storage container
WO2007092557A2 (en) * 2006-02-08 2007-08-16 Entegris, Inc. Stacking rings for wafers
TWM295649U (en) * 2006-02-20 2006-08-11 Usun Technology Co Ltd Carrying tray for liquid crystal module
JP4716928B2 (ja) * 2006-06-07 2011-07-06 信越ポリマー株式会社 ウェーハ収納容器
EP2306504B1 (de) * 2008-06-23 2018-09-12 Shin-Etsu Polymer Co. Ltd. Haltekörper und substratlagerbehälter
JP5626852B2 (ja) 2010-05-19 2014-11-19 Ｎｅｃエナジーデバイス株式会社 電源装置
CN104221136B (zh) * 2012-04-16 2017-05-31 日商乐华股份有限公司 收纳容器、收纳容器的开闭器开闭单元、及使用它们的晶圆储料器
CH707855B1 (de) * 2013-01-09 2017-09-15 Tec-Sem Ag Vorrichtung zur Lagerung von Objekten aus der Fertigung von elektronischen Bauteilen.
CN105324715B (zh) 2013-07-03 2019-12-10 村田机械株式会社 保管容器
WO2015130690A1 (en) * 2014-02-25 2015-09-03 Entegris, Inc. Wafer shipper with stacked support rings
JP6652362B2 (ja) * 2015-09-30 2020-02-19 東京応化工業株式会社 基板ケース、収納部、及び、基板搬送器
TWI597221B (zh) * 2015-10-01 2017-09-01 家登精密工業股份有限公司 基板承載裝置
US10573545B2 (en) * 2016-06-28 2020-02-25 Murata Machinery, Ltd. Substrate carrier and substrate carrier stack
US10643876B2 (en) * 2016-06-28 2020-05-05 Murata Machinery, Ltd. Substrate carrier and substrate carrier stack
KR20180001999A (ko) * 2016-06-28 2018-01-05 테크-샘 아게 개선된 기판 스토리지 및 프로세싱

Also Published As

Publication number Publication date
WO2020005611A1 (en) 2020-01-02
EP3588542A1 (de) 2020-01-01
TW202000565A (zh) 2020-01-01
TWI793341B (zh) 2023-02-21
DE202019101793U1 (de) 2019-10-09
KR20200140928A (ko) 2020-12-16
EP3588542B1 (de) 2023-02-22
KR102454080B1 (ko) 2022-10-14
JP7156404B2 (ja) 2022-10-19
JP2021527951A (ja) 2021-10-14
IL279581A (en) 2021-03-01
IL279581B1 (en) 2024-04-01
CN112352307A (zh) 2021-02-09

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