SG11202009004VA - Substrate holding apparatus and method of manufacturing a drive ring - Google Patents
Substrate holding apparatus and method of manufacturing a drive ringInfo
- Publication number
- SG11202009004VA SG11202009004VA SG11202009004VA SG11202009004VA SG11202009004VA SG 11202009004V A SG11202009004V A SG 11202009004VA SG 11202009004V A SG11202009004V A SG 11202009004VA SG 11202009004V A SG11202009004V A SG 11202009004VA SG 11202009004V A SG11202009004V A SG 11202009004VA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- substrate holding
- drive ring
- holding apparatus
- ring
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018059670A JP7219009B2 (ja) | 2018-03-27 | 2018-03-27 | 基板保持装置およびドライブリングの製造方法 |
| PCT/JP2019/006313 WO2019187814A1 (ja) | 2018-03-27 | 2019-02-20 | 基板保持装置およびドライブリングの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202009004VA true SG11202009004VA (en) | 2020-10-29 |
Family
ID=68059818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202009004VA SG11202009004VA (en) | 2018-03-27 | 2019-02-20 | Substrate holding apparatus and method of manufacturing a drive ring |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20210138606A1 (ja) |
| JP (1) | JP7219009B2 (ja) |
| SG (1) | SG11202009004VA (ja) |
| WO (1) | WO2019187814A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210047999A (ko) * | 2019-10-22 | 2021-05-03 | 삼성디스플레이 주식회사 | 연마 헤드 유닛, 이를 포함하는 기판 처리 장치, 그리고 이를 이용하는 기판 처리 방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6231428B1 (en) * | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| US6293139B1 (en) * | 1999-11-03 | 2001-09-25 | Memc Electronic Materials, Inc. | Method of determining performance characteristics of polishing pads |
| JP5296985B2 (ja) * | 2003-11-13 | 2013-09-25 | アプライド マテリアルズ インコーポレイテッド | 整形面をもつリテーニングリング |
| CN101023511A (zh) * | 2004-09-30 | 2007-08-22 | 株式会社瑞萨科技 | 半导体器件的制造方法 |
| EP1710045B1 (en) * | 2005-04-08 | 2008-12-17 | Ohara Inc. | A substrate and a method for polishing a substrate |
| WO2006114854A1 (ja) * | 2005-04-12 | 2006-11-02 | Nippon Seimitsu Denshi Co., Ltd. | Ｃｍｐ装置用リテーナリングとその製造方法、および、ｃｍｐ装置 |
| JP2007266068A (ja) * | 2006-03-27 | 2007-10-11 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | 研磨方法及び研磨装置 |
| JP2008023603A (ja) * | 2006-07-18 | 2008-02-07 | Nippon Seimitsu Denshi Co Ltd | ２層構造のリテーナリング |
| JP6392193B2 (ja) * | 2015-10-14 | 2018-09-19 | 株式会社荏原製作所 | 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法 |
-
2018
- 2018-03-27 JP JP2018059670A patent/JP7219009B2/ja active Active
-
2019
- 2019-02-20 WO PCT/JP2019/006313 patent/WO2019187814A1/ja active Application Filing
- 2019-02-20 SG SG11202009004VA patent/SG11202009004VA/en unknown
- 2019-02-20 US US16/980,995 patent/US20210138606A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019171492A (ja) | 2019-10-10 |
| JP7219009B2 (ja) | 2023-02-07 |
| US20210138606A1 (en) | 2021-05-13 |
| WO2019187814A1 (ja) | 2019-10-03 |
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