SG11202009004VA - Substrate holding apparatus and method of manufacturing a drive ring - Google Patents
Substrate holding apparatus and method of manufacturing a drive ringInfo
- Publication number
- SG11202009004VA SG11202009004VA SG11202009004VA SG11202009004VA SG11202009004VA SG 11202009004V A SG11202009004V A SG 11202009004VA SG 11202009004V A SG11202009004V A SG 11202009004VA SG 11202009004V A SG11202009004V A SG 11202009004VA SG 11202009004V A SG11202009004V A SG 11202009004VA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- substrate holding
- drive ring
- holding apparatus
- ring
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018059670A JP7219009B2 (en) | 2018-03-27 | 2018-03-27 | SUBSTRATE HOLDING DEVICE AND DRIVE RING MANUFACTURING METHOD |
PCT/JP2019/006313 WO2019187814A1 (en) | 2018-03-27 | 2019-02-20 | Substrate holding device and method of manufacturing drive ring |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202009004VA true SG11202009004VA (en) | 2020-10-29 |
Family
ID=68059818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202009004VA SG11202009004VA (en) | 2018-03-27 | 2019-02-20 | Substrate holding apparatus and method of manufacturing a drive ring |
Country Status (4)
Country | Link |
---|---|
US (1) | US20210138606A1 (en) |
JP (1) | JP7219009B2 (en) |
SG (1) | SG11202009004VA (en) |
WO (1) | WO2019187814A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210047999A (en) * | 2019-10-22 | 2021-05-03 | 삼성디스플레이 주식회사 | Polishing head unit, substrate procesing apparatus including the same and processing method of substrate using the same |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6231428B1 (en) | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US6293139B1 (en) * | 1999-11-03 | 2001-09-25 | Memc Electronic Materials, Inc. | Method of determining performance characteristics of polishing pads |
JP5296985B2 (en) * | 2003-11-13 | 2013-09-25 | アプライド マテリアルズ インコーポレイテッド | Retaining ring with shaping surface |
US20080076253A1 (en) | 2004-09-30 | 2008-03-27 | Hiroshi Fukada | Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device |
EP1710045B1 (en) * | 2005-04-08 | 2008-12-17 | Ohara Inc. | A substrate and a method for polishing a substrate |
CN101137464A (en) | 2005-04-12 | 2008-03-05 | 日本精密电子株式会社 | Retainer ring for CMP device, method of manufacturing the same, and CMP device |
JP2007266068A (en) | 2006-03-27 | 2007-10-11 | Sumco Techxiv株式会社 | Polishing method and device |
JP2008023603A (en) | 2006-07-18 | 2008-02-07 | Nippon Seimitsu Denshi Co Ltd | Retainer ring of two-layer structure |
JP6392193B2 (en) | 2015-10-14 | 2018-09-19 | 株式会社荏原製作所 | Substrate holding device, substrate polishing device, and method of manufacturing substrate holding device |
-
2018
- 2018-03-27 JP JP2018059670A patent/JP7219009B2/en active Active
-
2019
- 2019-02-20 SG SG11202009004VA patent/SG11202009004VA/en unknown
- 2019-02-20 US US16/980,995 patent/US20210138606A1/en active Pending
- 2019-02-20 WO PCT/JP2019/006313 patent/WO2019187814A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US20210138606A1 (en) | 2021-05-13 |
JP7219009B2 (en) | 2023-02-07 |
WO2019187814A1 (en) | 2019-10-03 |
JP2019171492A (en) | 2019-10-10 |
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